Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System

Chenhui Li; Srivathsa Bhat; Ripalta Stabile; Yuchen Song; Christian Neumeyr; Oded Raz

doi:10.1109/TCPMT.2022.3160149

Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System

Chenhui Li, Srivathsa Bhat, Ripalta Stabile, Yuchen Song, Christian Neumeyr, Oded Raz

BA6203 Silicon photonics

Research output: Contribution to journal › Article › Scientific › peer-review

Abstract

We design an optical interface system for vertically coupling between Vertical-Cavity Surface-Emitting Lasers and 3-μm silicon waveguides. The system includes a photoresist lens and a total internal reflection mirror, which allows for passive alignment and flip-chip bonding of VCSELs. The simulated coupling loss is 0.7dB, in optimal conditions, which increases to 1 dB when 3-μm and 20-μm alignment tolerances are considered in lateral and longitudinal directions, respectively. The system is built by post-processing lens and metallic wiring on the backside of a 3-μm silicon photonic platform. After flip-chip bonding and embedding of the VCSELs, the system performance is characterized, and VCSEL-to-waveguide coupling efficiency of -7.5 dB is obtained.

Original language	English
Pages (from-to)	883-886
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	12
Issue number	5
Early online date	16 Mar 2022
DOIs	https://doi.org/10.1109/TCPMT.2022.3160149
Publication status	Published - 1 May 2022
MoE publication type	A1 Journal article-refereed

Funding

Keywords

Couplings
flip-chip bonding
Lenses
microlens
Mirrors
Optical waveguides
Resists
silicon photonic waveguide
VCSEL
Vertical cavity surface emitting lasers
Waveguide lasers

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10.1109/TCPMT.2022.3160149

Cite this

@article{359cc5e710f647008379a8e156a8316d,

title = "Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System",

abstract = "We design an optical interface system for vertically coupling between Vertical-Cavity Surface-Emitting Lasers and 3-μm silicon waveguides. The system includes a photoresist lens and a total internal reflection mirror, which allows for passive alignment and flip-chip bonding of VCSELs. The simulated coupling loss is 0.7dB, in optimal conditions, which increases to 1 dB when 3-μm and 20-μm alignment tolerances are considered in lateral and longitudinal directions, respectively. The system is built by post-processing lens and metallic wiring on the backside of a 3-μm silicon photonic platform. After flip-chip bonding and embedding of the VCSELs, the system performance is characterized, and VCSEL-to-waveguide coupling efficiency of -7.5 dB is obtained.",

keywords = "Couplings, flip-chip bonding, Lenses, microlens, Mirrors, Optical waveguides, Resists, silicon photonic waveguide, VCSEL, Vertical cavity surface emitting lasers, Waveguide lasers",

author = "Chenhui Li and Srivathsa Bhat and Ripalta Stabile and Yuchen Song and Christian Neumeyr and Oded Raz",

note = "Publisher Copyright: IEEE",

year = "2022",

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doi = "10.1109/TCPMT.2022.3160149",

language = "English",

volume = "12",

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T1 - Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System

AU - Li, Chenhui

AU - Bhat, Srivathsa

AU - Stabile, Ripalta

AU - Song, Yuchen

AU - Neumeyr, Christian

AU - Raz, Oded

N1 - Publisher Copyright: IEEE

PY - 2022/5/1

Y1 - 2022/5/1

N2 - We design an optical interface system for vertically coupling between Vertical-Cavity Surface-Emitting Lasers and 3-μm silicon waveguides. The system includes a photoresist lens and a total internal reflection mirror, which allows for passive alignment and flip-chip bonding of VCSELs. The simulated coupling loss is 0.7dB, in optimal conditions, which increases to 1 dB when 3-μm and 20-μm alignment tolerances are considered in lateral and longitudinal directions, respectively. The system is built by post-processing lens and metallic wiring on the backside of a 3-μm silicon photonic platform. After flip-chip bonding and embedding of the VCSELs, the system performance is characterized, and VCSEL-to-waveguide coupling efficiency of -7.5 dB is obtained.

AB - We design an optical interface system for vertically coupling between Vertical-Cavity Surface-Emitting Lasers and 3-μm silicon waveguides. The system includes a photoresist lens and a total internal reflection mirror, which allows for passive alignment and flip-chip bonding of VCSELs. The simulated coupling loss is 0.7dB, in optimal conditions, which increases to 1 dB when 3-μm and 20-μm alignment tolerances are considered in lateral and longitudinal directions, respectively. The system is built by post-processing lens and metallic wiring on the backside of a 3-μm silicon photonic platform. After flip-chip bonding and embedding of the VCSELs, the system performance is characterized, and VCSEL-to-waveguide coupling efficiency of -7.5 dB is obtained.

KW - Couplings

KW - flip-chip bonding

KW - Lenses

KW - microlens

KW - Mirrors

KW - Optical waveguides

KW - Resists

KW - silicon photonic waveguide

KW - VCSEL

KW - Vertical cavity surface emitting lasers

KW - Waveguide lasers

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DO - 10.1109/TCPMT.2022.3160149

M3 - Article

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EP - 886

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 5

ER -

Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System

Abstract

Funding

Keywords

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Photonic technologies for progrAmmable transmission and switching modular systems based on Scalable Spectrum/space aggregation for future agIle high capacity metrO Networks

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Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System

Abstract

Funding

Keywords

Access to Document

Other files and links

Fingerprint

Projects

Photonic technologies for progrAmmable transmission and switching modular systems based on Scalable Spectrum/space aggregation for future agIle high capacity metrO Networks

Cite this