Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems

Harri Kopola*, Pentti Karioja, Outi Rusanen, Ari Lehto, Jorma Lammasniemi

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    This paper presents an overview of the research and development work on packaging and manufacturing different optoelectronic modules and microsystems for spectroscopic applications at VTT Electronics. Four different spectrometer concepts are analyzed: a multiwavelength detector module, an LED array spectrometer module, a PGP-spectrograph and an IR-spectrometer on silicon. The construction, main features, packaging concepts and performance are reviewed.

    Original languageEnglish
    Title of host publicationMiniaturized Systems with Micro-Optics and Micromechanics III
    EditorsM. Edward Motamedi, Rolf Goering
    PublisherInternational Society for Optics and Photonics SPIE
    Pages56-64
    DOIs
    Publication statusPublished - 1998
    MoE publication typeA4 Article in a conference publication
    EventMiniaturized Systems with Micro-Optics and Micromechanics III: Optoelectronics and High-Power Lasers and Applications - San Jose, CA, United States
    Duration: 26 Jan 199827 Jan 1998

    Publication series

    SeriesProceedings of SPIE
    Volume3276
    ISSN0277-786X

    Conference

    ConferenceMiniaturized Systems with Micro-Optics and Micromechanics III
    Country/TerritoryUnited States
    CitySan Jose, CA
    Period26/01/9827/01/98

    Keywords

    • Bolometer
    • Fabry-Perot interferometer
    • LED array spectrometer
    • Multi-channel detector
    • PGP spectrograph
    • Surface micromachining

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