Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems

Harri Kopola, Pentti Karioja, Outi Rusanen, Ari Lehto, Jorma Lammasniemi

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)

Abstract

This paper presents an overview of the research and development work on packaging and manufacturing different optoelectronic modules and microsystems for spectroscopic applications at VTT Electronics. Four different spectrometer concepts are analyzed: a multiwavelength detector module, an LED array spectrometer module, a PGP-spectrograph and an IR-spectrometer on silicon. The construction, main features, packaging concepts and performance are reviewed.

Original languageEnglish
Title of host publicationMiniaturized Systems with Micro-Optics and Micromechanics III
EditorsM. Edward Motamedi, Rolf Goering
PublisherInternational Society for Optics and Photonics SPIE
Pages56-64
DOIs
Publication statusPublished - 1998
MoE publication typeA4 Article in a conference publication
EventMiniaturized Systems with Micro-Optics and Micromechanics III: Optoelectronics and High-Power Lasers and Applications - San Jose, CA, United States
Duration: 26 Jan 199827 Jan 1998

Publication series

SeriesProceedings of SPIE
Volume3276
ISSN0277-786X

Conference

ConferenceMiniaturized Systems with Micro-Optics and Micromechanics III
CountryUnited States
CitySan Jose, CA
Period26/01/9827/01/98

Keywords

  • Bolometer
  • Fabry-Perot interferometer
  • LED array spectrometer
  • Multi-channel detector
  • PGP spectrograph
  • Surface micromachining

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