Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems

Harri Kopola; Pentti Karioja; Outi Rusanen; Ari Lehto; Jorma Lammasniemi

doi:10.1117/12.302409

Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems

Harri Kopola^*
, Pentti Karioja
, Outi Rusanen
, Ari Lehto
, Jorma Lammasniemi

^*Corresponding author for this work

VTT (former employee or external)

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

2 Citations (Scopus)

Abstract

This paper presents an overview of the research and development work on packaging and manufacturing different optoelectronic modules and microsystems for spectroscopic applications at VTT Electronics. Four different spectrometer concepts are analyzed: a multiwavelength detector module, an LED array spectrometer module, a PGP-spectrograph and an IR-spectrometer on silicon. The construction, main features, packaging concepts and performance are reviewed.

Original language	English
Title of host publication	Miniaturized Systems with Micro-Optics and Micromechanics III
Editors	M. Edward Motamedi, Rolf Goering
Publisher	International Society for Optics and Photonics SPIE
Pages	56-64
DOIs	https://doi.org/10.1117/12.302409
Publication status	Published - 1998
MoE publication type	A4 Article in a conference publication
Event	Miniaturized Systems with Micro-Optics and Micromechanics III: Optoelectronics and High-Power Lasers and Applications - San Jose, CA, United States Duration: 26 Jan 1998 → 27 Jan 1998

Publication series

Series	Proceedings of SPIE
Volume	3276
ISSN	0277-786X

Conference

Conference	Miniaturized Systems with Micro-Optics and Micromechanics III
Country/Territory	United States
City	San Jose, CA
Period	26/01/98 → 27/01/98

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Bolometer
Fabry-Perot interferometer
LED array spectrometer
Multi-channel detector
PGP spectrograph
Surface micromachining

Access to Document

10.1117/12.302409

Cite this

Kopola, H., Karioja, P., Rusanen, O., Lehto, A., & Lammasniemi, J. (1998). Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems. In M. E. Motamedi, & R. Goering (Eds.), Miniaturized Systems with Micro-Optics and Micromechanics III (pp. 56-64). International Society for Optics and Photonics SPIE. https://doi.org/10.1117/12.302409

Kopola, Harri ; Karioja, Pentti ; Rusanen, Outi et al. / Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems. Miniaturized Systems with Micro-Optics and Micromechanics III. editor / M. Edward Motamedi ; Rolf Goering. International Society for Optics and Photonics SPIE, 1998. pp. 56-64 (Proceedings of SPIE, Vol. 3276).

@inproceedings{8e78dd3b39894c4eaffd299673b9aacc,

title = "Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems",

abstract = "This paper presents an overview of the research and development work on packaging and manufacturing different optoelectronic modules and microsystems for spectroscopic applications at VTT Electronics. Four different spectrometer concepts are analyzed: a multiwavelength detector module, an LED array spectrometer module, a PGP-spectrograph and an IR-spectrometer on silicon. The construction, main features, packaging concepts and performance are reviewed.",

keywords = "Bolometer, Fabry-Perot interferometer, LED array spectrometer, Multi-channel detector, PGP spectrograph, Surface micromachining",

author = "Harri Kopola and Pentti Karioja and Outi Rusanen and Ari Lehto and Jorma Lammasniemi",

year = "1998",

doi = "10.1117/12.302409",

language = "English",

series = "Proceedings of SPIE",

publisher = "International Society for Optics and Photonics SPIE",

pages = "56--64",

editor = "Motamedi, \{M. Edward\} and Rolf Goering",

booktitle = "Miniaturized Systems with Micro-Optics and Micromechanics III",

address = "United States",

note = "Miniaturized Systems with Micro-Optics and Micromechanics III : Optoelectronics and High-Power Lasers and Applications ; Conference date: 26-01-1998 Through 27-01-1998",

}

Kopola, H, Karioja, P, Rusanen, O, Lehto, A & Lammasniemi, J 1998, Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems. in ME Motamedi & R Goering (eds), Miniaturized Systems with Micro-Optics and Micromechanics III. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 3276, pp. 56-64, Miniaturized Systems with Micro-Optics and Micromechanics III, San Jose, CA, United States, 26/01/98. https://doi.org/10.1117/12.302409

Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems. / Kopola, Harri; Karioja, Pentti; Rusanen, Outi et al.
Miniaturized Systems with Micro-Optics and Micromechanics III. ed. / M. Edward Motamedi; Rolf Goering. International Society for Optics and Photonics SPIE, 1998. p. 56-64 (Proceedings of SPIE, Vol. 3276).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems

AU - Kopola, Harri

AU - Karioja, Pentti

AU - Rusanen, Outi

AU - Lehto, Ari

AU - Lammasniemi, Jorma

PY - 1998

Y1 - 1998

N2 - This paper presents an overview of the research and development work on packaging and manufacturing different optoelectronic modules and microsystems for spectroscopic applications at VTT Electronics. Four different spectrometer concepts are analyzed: a multiwavelength detector module, an LED array spectrometer module, a PGP-spectrograph and an IR-spectrometer on silicon. The construction, main features, packaging concepts and performance are reviewed.

AB - This paper presents an overview of the research and development work on packaging and manufacturing different optoelectronic modules and microsystems for spectroscopic applications at VTT Electronics. Four different spectrometer concepts are analyzed: a multiwavelength detector module, an LED array spectrometer module, a PGP-spectrograph and an IR-spectrometer on silicon. The construction, main features, packaging concepts and performance are reviewed.

KW - Bolometer

KW - Fabry-Perot interferometer

KW - LED array spectrometer

KW - Multi-channel detector

KW - PGP spectrograph

KW - Surface micromachining

UR - https://www.scopus.com/pages/publications/0032225678

U2 - 10.1117/12.302409

DO - 10.1117/12.302409

M3 - Conference article in proceedings

AN - SCOPUS:0032225678

T3 - Proceedings of SPIE

SP - 56

EP - 64

BT - Miniaturized Systems with Micro-Optics and Micromechanics III

A2 - Motamedi, M. Edward

A2 - Goering, Rolf

PB - International Society for Optics and Photonics SPIE

T2 - Miniaturized Systems with Micro-Optics and Micromechanics III

Y2 - 26 January 1998 through 27 January 1998

ER -

Kopola H, Karioja P, Rusanen O, Lehto A, Lammasniemi J. Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems. In Motamedi ME, Goering R, editors, Miniaturized Systems with Micro-Optics and Micromechanics III. International Society for Optics and Photonics SPIE. 1998. p. 56-64. (Proceedings of SPIE, Vol. 3276). doi: 10.1117/12.302409

Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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