Imprinted 50 nm features by UV step and stamp imprint lithography method

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

Abstract

In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by pressing a small stamp, also called mould or template, into a low viscosity monomer which is then polymerized and thereby hardened (cured) by UV exposure. The mirror replicaof the pattern of the stamp is copied in the polymer. The method is developed onto a stage where a dedicated tool (NPS300) is commercially available and easily configured for both techniques.
Original languageEnglish
Title of host publication 2007 Digest of papers Microprocesses and Nanotechnology
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages280-281
ISBN (Print)978-4-9902472-4-9
DOIs
Publication statusPublished - 2007
MoE publication typeNot Eligible
Event20th International Microprocesses and Nanotechnology Conference, MNC 2007 - Kyoto, Japan
Duration: 5 Nov 20078 Nov 2007

Conference

Conference20th International Microprocesses and Nanotechnology Conference, MNC 2007
CountryJapan
CityKyoto
Period5/11/078/11/07

Fingerprint

lithography
pressing
templates
monomers
chips
viscosity
mirrors
fabrication
polymers

Keywords

  • nanoimprinting

Cite this

Tomi, H., Päivi, M., Tapio, M., & Jouni, A. (2007). Imprinted 50 nm features by UV step and stamp imprint lithography method. In 2007 Digest of papers Microprocesses and Nanotechnology (pp. 280-281). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/IMNC.2007.4456213
Tomi, Haatainen ; Päivi, Majander ; Tapio, Mäkelä ; Jouni, Ahopelto. / Imprinted 50 nm features by UV step and stamp imprint lithography method. 2007 Digest of papers Microprocesses and Nanotechnology. IEEE Institute of Electrical and Electronic Engineers , 2007. pp. 280-281
@inbook{68175c823186427aa370b05ee7a1f714,
title = "Imprinted 50 nm features by UV step and stamp imprint lithography method",
abstract = "In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by pressing a small stamp, also called mould or template, into a low viscosity monomer which is then polymerized and thereby hardened (cured) by UV exposure. The mirror replicaof the pattern of the stamp is copied in the polymer. The method is developed onto a stage where a dedicated tool (NPS300) is commercially available and easily configured for both techniques.",
keywords = "nanoimprinting",
author = "Haatainen Tomi and Majander P{\"a}ivi and M{\"a}kel{\"a} Tapio and Ahopelto Jouni",
year = "2007",
doi = "10.1109/IMNC.2007.4456213",
language = "English",
isbn = "978-4-9902472-4-9",
pages = "280--281",
booktitle = "2007 Digest of papers Microprocesses and Nanotechnology",
publisher = "IEEE Institute of Electrical and Electronic Engineers",
address = "United States",

}

Tomi, H, Päivi, M, Tapio, M & Jouni, A 2007, Imprinted 50 nm features by UV step and stamp imprint lithography method. in 2007 Digest of papers Microprocesses and Nanotechnology. IEEE Institute of Electrical and Electronic Engineers , pp. 280-281, 20th International Microprocesses and Nanotechnology Conference, MNC 2007, Kyoto, Japan, 5/11/07. https://doi.org/10.1109/IMNC.2007.4456213

Imprinted 50 nm features by UV step and stamp imprint lithography method. / Tomi, Haatainen; Päivi, Majander; Tapio, Mäkelä; Jouni, Ahopelto.

2007 Digest of papers Microprocesses and Nanotechnology. IEEE Institute of Electrical and Electronic Engineers , 2007. p. 280-281.

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

TY - CHAP

T1 - Imprinted 50 nm features by UV step and stamp imprint lithography method

AU - Tomi, Haatainen

AU - Päivi, Majander

AU - Tapio, Mäkelä

AU - Jouni, Ahopelto

PY - 2007

Y1 - 2007

N2 - In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by pressing a small stamp, also called mould or template, into a low viscosity monomer which is then polymerized and thereby hardened (cured) by UV exposure. The mirror replicaof the pattern of the stamp is copied in the polymer. The method is developed onto a stage where a dedicated tool (NPS300) is commercially available and easily configured for both techniques.

AB - In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by pressing a small stamp, also called mould or template, into a low viscosity monomer which is then polymerized and thereby hardened (cured) by UV exposure. The mirror replicaof the pattern of the stamp is copied in the polymer. The method is developed onto a stage where a dedicated tool (NPS300) is commercially available and easily configured for both techniques.

KW - nanoimprinting

U2 - 10.1109/IMNC.2007.4456213

DO - 10.1109/IMNC.2007.4456213

M3 - Conference abstract in proceedings

SN - 978-4-9902472-4-9

SP - 280

EP - 281

BT - 2007 Digest of papers Microprocesses and Nanotechnology

PB - IEEE Institute of Electrical and Electronic Engineers

ER -

Tomi H, Päivi M, Tapio M, Jouni A. Imprinted 50 nm features by UV step and stamp imprint lithography method. In 2007 Digest of papers Microprocesses and Nanotechnology. IEEE Institute of Electrical and Electronic Engineers . 2007. p. 280-281 https://doi.org/10.1109/IMNC.2007.4456213