Imprinted 50 nm features by UV step and stamp imprint lithography method

Haatainen Tomi; Majander Päivi; Mäkelä Tapio; Ahopelto Jouni

doi:10.1109/IMNC.2007.4456213

Imprinted 50 nm features by UV step and stamp imprint lithography method

Haatainen Tomi, Majander Päivi, Mäkelä Tapio, Ahopelto Jouni

VTT Technical Research Centre of Finland

Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific

1 Citation (Scopus)

Abstract

In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by pressing a small stamp, also called mould or template, into a low viscosity monomer which is then polymerized and thereby hardened (cured) by UV exposure. The mirror replicaof the pattern of the stamp is copied in the polymer. The method is developed onto a stage where a dedicated tool (NPS300) is commercially available and easily configured for both techniques.

Original language	English
Title of host publication	2007 Digest of papers Microprocesses and Nanotechnology
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	280-281
ISBN (Print)	978-4-9902472-4-9
DOIs	https://doi.org/10.1109/IMNC.2007.4456213
Publication status	Published - 2007
MoE publication type	Not Eligible
Event	20th International Microprocesses and Nanotechnology Conference, MNC 2007 - Kyoto, Japan Duration: 5 Nov 2007 → 8 Nov 2007

Conference

Conference	20th International Microprocesses and Nanotechnology Conference, MNC 2007
Country/Territory	Japan
City	Kyoto
Period	5/11/07 → 8/11/07

Keywords

nanoimprinting

Access to Document

10.1109/IMNC.2007.4456213

Cite this

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title = "Imprinted 50 nm features by UV step and stamp imprint lithography method",

abstract = "In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by pressing a small stamp, also called mould or template, into a low viscosity monomer which is then polymerized and thereby hardened (cured) by UV exposure. The mirror replicaof the pattern of the stamp is copied in the polymer. The method is developed onto a stage where a dedicated tool (NPS300) is commercially available and easily configured for both techniques.",

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author = "Haatainen Tomi and Majander P{\"a}ivi and M{\"a}kel{\"a} Tapio and Ahopelto Jouni",

year = "2007",

doi = "10.1109/IMNC.2007.4456213",

language = "English",

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booktitle = "2007 Digest of papers Microprocesses and Nanotechnology",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "20th International Microprocesses and Nanotechnology Conference, MNC 2007 ; Conference date: 05-11-2007 Through 08-11-2007",

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Tomi, H, Päivi, M, Tapio, M & Jouni, A 2007, Imprinted 50 nm features by UV step and stamp imprint lithography method. in 2007 Digest of papers Microprocesses and Nanotechnology. IEEE Institute of Electrical and Electronic Engineers, pp. 280-281, 20th International Microprocesses and Nanotechnology Conference, MNC 2007, Kyoto, Japan, 5/11/07. https://doi.org/10.1109/IMNC.2007.4456213

Imprinted 50 nm features by UV step and stamp imprint lithography method. / Tomi, Haatainen; Päivi, Majander; Tapio, Mäkelä et al.
2007 Digest of papers Microprocesses and Nanotechnology. IEEE Institute of Electrical and Electronic Engineers, 2007. p. 280-281.

Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific

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T1 - Imprinted 50 nm features by UV step and stamp imprint lithography method

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AU - Tapio, Mäkelä

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N2 - In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by pressing a small stamp, also called mould or template, into a low viscosity monomer which is then polymerized and thereby hardened (cured) by UV exposure. The mirror replicaof the pattern of the stamp is copied in the polymer. The method is developed onto a stage where a dedicated tool (NPS300) is commercially available and easily configured for both techniques.

AB - In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by pressing a small stamp, also called mould or template, into a low viscosity monomer which is then polymerized and thereby hardened (cured) by UV exposure. The mirror replicaof the pattern of the stamp is copied in the polymer. The method is developed onto a stage where a dedicated tool (NPS300) is commercially available and easily configured for both techniques.

KW - nanoimprinting

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DO - 10.1109/IMNC.2007.4456213

M3 - Conference abstract in proceedings

SN - 978-4-9902472-4-9

SP - 280

EP - 281

BT - 2007 Digest of papers Microprocesses and Nanotechnology

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 20th International Microprocesses and Nanotechnology Conference, MNC 2007

Y2 - 5 November 2007 through 8 November 2007

ER -

Imprinted 50 nm features by UV step and stamp imprint lithography method

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Keywords

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