Abstract
In this paper, we report on fabrication of 50 nm features by using a UV
step and stamp imprint lithography method (UV SSIL), which is based on thermal
SSIL using a flip chip bonder. The idea is to fabricate nanoscale patterns by
pressing a small stamp, also called mould or template, into a low viscosity
monomer which is then polymerized and thereby hardened (cured) by UV exposure.
The mirror replicaof the pattern of the stamp is copied in the polymer. The
method is developed onto a stage where a dedicated tool (NPS300) is
commercially available and easily configured for both techniques.
Original language | English |
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Title of host publication | 2007 Digest of papers Microprocesses and Nanotechnology |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 280-281 |
ISBN (Print) | 978-4-9902472-4-9 |
DOIs | |
Publication status | Published - 2007 |
MoE publication type | Not Eligible |
Event | 20th International Microprocesses and Nanotechnology Conference, MNC 2007 - Kyoto, Japan Duration: 5 Nov 2007 → 8 Nov 2007 |
Conference
Conference | 20th International Microprocesses and Nanotechnology Conference, MNC 2007 |
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Country/Territory | Japan |
City | Kyoto |
Period | 5/11/07 → 8/11/07 |
Keywords
- nanoimprinting