Abstract
Imprinting three-dimensional patterns directly into electrically conductive polymer blends is investigated. Silicon substrates are spin-coated by a polymethylmethacrylate/polyaniline-camphor sulfonic acid mixture dissolved in m-cresol. The patterns are imprinted using a silicon stamp having a 500 nm deep grating with 5 μm wide lines and spaces. The imprinting temperature was 140 °C, pressure 150 bar, and time 10 min. The conductivity of the blend was 1 S/cm prior to imprinting and decreased by a factor of about 2 in the process. Removing the residual film from the grooves by etching in argon/oxygen plasma results in resistance anisotropy larger than 104 perpendicular and parallel to the imprinted polymer ridges.
Original language | English |
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Pages (from-to) | 487-489 |
Number of pages | 3 |
Journal | Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics |
Volume | 19 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2001 |
MoE publication type | A1 Journal article-refereed |