Improving the performance of advertising LED displays by in-mould integration

Eveliina Juntunen, Vishal Gandhi, Satu Ylimaula, Arttu Huttunen (Corresponding author)

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    Modern manufacturing technologies of flexible electronics and in-mould integration are used to develop advertising backlights that are thin, lightweight, and preferably dynamic. The result is based on in-mould structural electronics in which the flexible electronics is overmoulded with plastics providing additional features to the display. The technique is used to create optical elements on LED backlighting foils. Also, the effect of embedding on thermal management of the LEDs is studied. Measurements done on different tests structures show benefit in both optical and thermal performance by in-mould integration. The light guide element integrated on the backlighting unit in a single processing step demonstrated 17% advantage in optical power in backlighting application. The thermal measurements show that LED temperatures in the in-mould integrated panel reduced on average 20% compared to measurements done on LED foil without embedding.

    Original languageEnglish
    Title of host publication2018 IMAPS Nordic Conference on Microelectronics Packaging
    Subtitle of host publicationNordPack 2018
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages52-56
    Number of pages5
    ISBN (Electronic)978-952-68150-5-3
    ISBN (Print)978-1-5386-8019-3
    DOIs
    Publication statusPublished - 2 Aug 2018
    MoE publication typeA4 Article in a conference publication
    EventIMAPS Nordic Annual Conference, NordPack 2018 - Oulu, Finland
    Duration: 12 Jun 201814 Jun 2018

    Conference

    ConferenceIMAPS Nordic Annual Conference, NordPack 2018
    Abbreviated titleNordPack 2018
    CountryFinland
    CityOulu
    Period12/06/1814/06/18

    Keywords

    • Embedding
    • Flexible electronics
    • In-mould integration
    • LED
    • Optics
    • Thermal management

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