Improving the performance of advertising LED displays by in-mould integration

Eveliina Juntunen; Vishal Gandhi; Satu Ylimaula; Arttu Huttunen

doi:10.23919/NORDPAC.2018.8423852

Improving the performance of advertising LED displays by in-mould integration

Eveliina Juntunen, Vishal Gandhi, Satu Ylimaula, Arttu Huttunen (Corresponding author)

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

1 Citation (Scopus)

Abstract

Modern manufacturing technologies of flexible electronics and in-mould integration are used to develop advertising backlights that are thin, lightweight, and preferably dynamic. The result is based on in-mould structural electronics in which the flexible electronics is overmoulded with plastics providing additional features to the display. The technique is used to create optical elements on LED backlighting foils. Also, the effect of embedding on thermal management of the LEDs is studied. Measurements done on different tests structures show benefit in both optical and thermal performance by in-mould integration. The light guide element integrated on the backlighting unit in a single processing step demonstrated 17% advantage in optical power in backlighting application. The thermal measurements show that LED temperatures in the in-mould integrated panel reduced on average 20% compared to measurements done on LED foil without embedding.

Original language	English
Title of host publication	2018 IMAPS Nordic Conference on Microelectronics Packaging
Subtitle of host publication	NordPack 2018
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	52-56
Number of pages	5
ISBN (Electronic)	978-952-68150-5-3
ISBN (Print)	978-1-5386-8019-3
DOIs	https://doi.org/10.23919/NORDPAC.2018.8423852
Publication status	Published - 2 Aug 2018
MoE publication type	A4 Article in a conference publication
Event	IMAPS Nordic Annual Conference, NordPack 2018 - Oulu, Finland Duration: 12 Jun 2018 → 14 Jun 2018

Conference

Conference	IMAPS Nordic Annual Conference, NordPack 2018
Abbreviated title	NordPack 2018
Country/Territory	Finland
City	Oulu
Period	12/06/18 → 14/06/18

Keywords

Embedding
Flexible electronics
In-mould integration
LED
Optics
Thermal management

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.23919/NORDPAC.2018.8423852

Cite this

@inproceedings{aee6f4b387e44ec0bef0e8ab4b45ebb7,

title = "Improving the performance of advertising LED displays by in-mould integration",

abstract = "Modern manufacturing technologies of flexible electronics and in-mould integration are used to develop advertising backlights that are thin, lightweight, and preferably dynamic. The result is based on in-mould structural electronics in which the flexible electronics is overmoulded with plastics providing additional features to the display. The technique is used to create optical elements on LED backlighting foils. Also, the effect of embedding on thermal management of the LEDs is studied. Measurements done on different tests structures show benefit in both optical and thermal performance by in-mould integration. The light guide element integrated on the backlighting unit in a single processing step demonstrated 17% advantage in optical power in backlighting application. The thermal measurements show that LED temperatures in the in-mould integrated panel reduced on average 20% compared to measurements done on LED foil without embedding.",

keywords = "Embedding, Flexible electronics, In-mould integration, LED, Optics, Thermal management",

author = "Eveliina Juntunen and Vishal Gandhi and Satu Ylimaula and Arttu Huttunen",

note = "Funding Information: The work was funded by European Commission Horizon2020 program as part of Optintegral project [grant No: 643956] that develops in-mould hybrid integration for advanced TOLAE LED displays. The authors would like to thank Encarna Escudero and Enric Pascual from Eurecat, The Technology Centre of Catalonia, for the overmoulding and Samuli Leivo and Matti Koponen from the Neonelektro Oy for the test module design. Also, authors would like to thank Jouni Kangas, Miia Heikkinen, Emmi Herukka, and Timo Kurkela for their work in preparing the test samples. Publisher Copyright: {\textcopyright} IMAPS Nordic Annual Conference, NordPack 2018. All rights reserved. Copyright: Copyright 2018 Elsevier B.V., All rights reserved.; IMAPS Nordic Annual Conference, NordPack 2018, NordPack 2018 ; Conference date: 12-06-2018 Through 14-06-2018",

year = "2018",

month = aug,

day = "2",

doi = "10.23919/NORDPAC.2018.8423852",

language = "English",

isbn = "978-1-5386-8019-3",

pages = "52--56",

booktitle = "2018 IMAPS Nordic Conference on Microelectronics Packaging",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

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}

Juntunen, E, Gandhi, V, Ylimaula, S & Huttunen, A 2018, Improving the performance of advertising LED displays by in-mould integration. in 2018 IMAPS Nordic Conference on Microelectronics Packaging: NordPack 2018. IEEE Institute of Electrical and Electronic Engineers, pp. 52-56, IMAPS Nordic Annual Conference, NordPack 2018, Oulu, Finland, 12/06/18. https://doi.org/10.23919/NORDPAC.2018.8423852

Improving the performance of advertising LED displays by in-mould integration. / Juntunen, Eveliina; Gandhi, Vishal; Ylimaula, Satu et al.
2018 IMAPS Nordic Conference on Microelectronics Packaging: NordPack 2018. IEEE Institute of Electrical and Electronic Engineers, 2018. p. 52-56.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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AU - Gandhi, Vishal

AU - Ylimaula, Satu

AU - Huttunen, Arttu

N1 - Funding Information: The work was funded by European Commission Horizon2020 program as part of Optintegral project [grant No: 643956] that develops in-mould hybrid integration for advanced TOLAE LED displays. The authors would like to thank Encarna Escudero and Enric Pascual from Eurecat, The Technology Centre of Catalonia, for the overmoulding and Samuli Leivo and Matti Koponen from the Neonelektro Oy for the test module design. Also, authors would like to thank Jouni Kangas, Miia Heikkinen, Emmi Herukka, and Timo Kurkela for their work in preparing the test samples. Publisher Copyright: © IMAPS Nordic Annual Conference, NordPack 2018. All rights reserved. Copyright: Copyright 2018 Elsevier B.V., All rights reserved.

PY - 2018/8/2

Y1 - 2018/8/2

N2 - Modern manufacturing technologies of flexible electronics and in-mould integration are used to develop advertising backlights that are thin, lightweight, and preferably dynamic. The result is based on in-mould structural electronics in which the flexible electronics is overmoulded with plastics providing additional features to the display. The technique is used to create optical elements on LED backlighting foils. Also, the effect of embedding on thermal management of the LEDs is studied. Measurements done on different tests structures show benefit in both optical and thermal performance by in-mould integration. The light guide element integrated on the backlighting unit in a single processing step demonstrated 17% advantage in optical power in backlighting application. The thermal measurements show that LED temperatures in the in-mould integrated panel reduced on average 20% compared to measurements done on LED foil without embedding.

AB - Modern manufacturing technologies of flexible electronics and in-mould integration are used to develop advertising backlights that are thin, lightweight, and preferably dynamic. The result is based on in-mould structural electronics in which the flexible electronics is overmoulded with plastics providing additional features to the display. The technique is used to create optical elements on LED backlighting foils. Also, the effect of embedding on thermal management of the LEDs is studied. Measurements done on different tests structures show benefit in both optical and thermal performance by in-mould integration. The light guide element integrated on the backlighting unit in a single processing step demonstrated 17% advantage in optical power in backlighting application. The thermal measurements show that LED temperatures in the in-mould integrated panel reduced on average 20% compared to measurements done on LED foil without embedding.

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KW - In-mould integration

KW - LED

KW - Optics

KW - Thermal management

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M3 - Conference article in proceedings

AN - SCOPUS:85056706434

SN - 978-1-5386-8019-3

SP - 52

EP - 56

BT - 2018 IMAPS Nordic Conference on Microelectronics Packaging

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - IMAPS Nordic Annual Conference, NordPack 2018

Y2 - 12 June 2018 through 14 June 2018

ER -

Improving the performance of advertising LED displays by in-mould integration

Abstract

Conference

Keywords

UN SDGs

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