Abstract
Modern manufacturing technologies of flexible electronics and in-mould integration are used to develop advertising backlights that are thin, lightweight, and preferably dynamic. The result is based on in-mould structural electronics in which the flexible electronics is overmoulded with plastics providing additional features to the display. The technique is used to create optical elements on LED backlighting foils. Also, the effect of embedding on thermal management of the LEDs is studied. Measurements done on different tests structures show benefit in both optical and thermal performance by in-mould integration. The light guide element integrated on the backlighting unit in a single processing step demonstrated 17% advantage in optical power in backlighting application. The thermal measurements show that LED temperatures in the in-mould integrated panel reduced on average 20% compared to measurements done on LED foil without embedding.
| Original language | English |
|---|---|
| Title of host publication | 2018 IMAPS Nordic Conference on Microelectronics Packaging |
| Subtitle of host publication | NordPack 2018 |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Pages | 52-56 |
| ISBN (Electronic) | 978-952-68150-5-3 |
| ISBN (Print) | 978-1-5386-8019-3 |
| DOIs | |
| Publication status | Published - 2 Aug 2018 |
| MoE publication type | A4 Article in a conference publication |
| Event | IMAPS Nordic Annual Conference, NordPack 2018 - Oulu, Finland Duration: 12 Jun 2018 → 14 Jun 2018 |
Conference
| Conference | IMAPS Nordic Annual Conference, NordPack 2018 |
|---|---|
| Abbreviated title | NordPack 2018 |
| Country/Territory | Finland |
| City | Oulu |
| Period | 12/06/18 → 14/06/18 |
Funding
The work was funded by European Commission Horizon2020 program as part of Optintegral project [grant No: 643956] that develops in-mould hybrid integration for advanced TOLAE LED displays.
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Keywords
- Embedding
- Flexible electronics
- In-mould integration
- LED
- Optics
- Thermal management
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