In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components

Teemu Alajoki, M. Koponen, E. Juntunen, J. Petaja, M. Heikkinen, J. Ollila, A. Sitomaniemi, T. Kosonen, J. Aikio, J.-T. Makinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

Abstract

Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, in-mould integration of electronic and optoelectronic modules is examined in order to embed novel functionality into polymer matrix. Thermal load of the electronic components embedded in polymer material was briefly modelled, and a series of test structure samples realized. The test structure consisted of a flexible printed circuit (FPC) substrate with assembled electronic and optoelectronic components, which was set as an insert into injection moulding mould and thermoplastic polymer was cast on the substrate in injection moulding process. After the over moulding of the samples, characterization of components was carried out by visual inspection and by functional testing. It was found out that with correct injection moulding process parameters, all components survived the challenging conditions of injection moulding process. The reliability of the samples was evaluated by subjecting them to constant humidity test +85degC/ 85% RH and -40degC ... +85degC temperature cycling test. After the tests, the samples were analyzed by visual inspection, functional testing and cross-sections. The analysis revealed that when using an appropriate silver paste, over 90% of the components remained functional, although problems were observed in the adhesion between the FPC substrate and the over moulding material.
Original languageEnglish
Title of host publicationEuropean Microelectronics and Packaging Conference
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages1-6
ISBN (Electronic)978-0-6152-9868-9
ISBN (Print)978-1-4244-4722-0
Publication statusPublished - 2009
MoE publication typeA4 Article in a conference publication
Event17th European Microelectronics and Packaging Conference, EMPC - Rimini, Italy
Duration: 15 Jun 200918 Jun 2009
Conference number: 17

Conference

Conference17th European Microelectronics and Packaging Conference, EMPC
Abbreviated titleEMPC
CountryItaly
CityRimini
Period15/06/0918/06/09

Fingerprint

Injection molding
Optoelectronic devices
Mechanics
Electronic equipment
Printed circuits
Molding
Substrates
Inspection
Plastic products
Automobile electronic equipment
Electronic medical equipment
Die casting inserts
Consumer electronics
Testing
Polymers
Thermal load
Polymer matrix
Thermoplastics
Atmospheric humidity
Silver

Keywords

  • circuit testing
  • injection molding
  • inspection
  • casting
  • in-mould integration
  • reliability

Cite this

Alajoki, T., Koponen, M., Juntunen, E., Petaja, J., Heikkinen, M., Ollila, J., ... Makinen, J-T. (2009). In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components. In European Microelectronics and Packaging Conference (pp. 1-6). Institute of Electrical and Electronic Engineers IEEE.
Alajoki, Teemu ; Koponen, M. ; Juntunen, E. ; Petaja, J. ; Heikkinen, M. ; Ollila, J. ; Sitomaniemi, A. ; Kosonen, T. ; Aikio, J. ; Makinen, J.-T. / In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components. European Microelectronics and Packaging Conference. Institute of Electrical and Electronic Engineers IEEE, 2009. pp. 1-6
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abstract = "Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, in-mould integration of electronic and optoelectronic modules is examined in order to embed novel functionality into polymer matrix. Thermal load of the electronic components embedded in polymer material was briefly modelled, and a series of test structure samples realized. The test structure consisted of a flexible printed circuit (FPC) substrate with assembled electronic and optoelectronic components, which was set as an insert into injection moulding mould and thermoplastic polymer was cast on the substrate in injection moulding process. After the over moulding of the samples, characterization of components was carried out by visual inspection and by functional testing. It was found out that with correct injection moulding process parameters, all components survived the challenging conditions of injection moulding process. The reliability of the samples was evaluated by subjecting them to constant humidity test +85degC/ 85{\%} RH and -40degC ... +85degC temperature cycling test. After the tests, the samples were analyzed by visual inspection, functional testing and cross-sections. The analysis revealed that when using an appropriate silver paste, over 90{\%} of the components remained functional, although problems were observed in the adhesion between the FPC substrate and the over moulding material.",
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author = "Teemu Alajoki and M. Koponen and E. Juntunen and J. Petaja and M. Heikkinen and J. Ollila and A. Sitomaniemi and T. Kosonen and J. Aikio and J.-T. Makinen",
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Alajoki, T, Koponen, M, Juntunen, E, Petaja, J, Heikkinen, M, Ollila, J, Sitomaniemi, A, Kosonen, T, Aikio, J & Makinen, J-T 2009, In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components. in European Microelectronics and Packaging Conference. Institute of Electrical and Electronic Engineers IEEE, pp. 1-6, 17th European Microelectronics and Packaging Conference, EMPC, Rimini, Italy, 15/06/09.

In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components. / Alajoki, Teemu; Koponen, M.; Juntunen, E.; Petaja, J.; Heikkinen, M.; Ollila, J.; Sitomaniemi, A.; Kosonen, T.; Aikio, J.; Makinen, J.-T.

European Microelectronics and Packaging Conference. Institute of Electrical and Electronic Engineers IEEE, 2009. p. 1-6.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components

AU - Alajoki, Teemu

AU - Koponen, M.

AU - Juntunen, E.

AU - Petaja, J.

AU - Heikkinen, M.

AU - Ollila, J.

AU - Sitomaniemi, A.

AU - Kosonen, T.

AU - Aikio, J.

AU - Makinen, J.-T.

PY - 2009

Y1 - 2009

N2 - Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, in-mould integration of electronic and optoelectronic modules is examined in order to embed novel functionality into polymer matrix. Thermal load of the electronic components embedded in polymer material was briefly modelled, and a series of test structure samples realized. The test structure consisted of a flexible printed circuit (FPC) substrate with assembled electronic and optoelectronic components, which was set as an insert into injection moulding mould and thermoplastic polymer was cast on the substrate in injection moulding process. After the over moulding of the samples, characterization of components was carried out by visual inspection and by functional testing. It was found out that with correct injection moulding process parameters, all components survived the challenging conditions of injection moulding process. The reliability of the samples was evaluated by subjecting them to constant humidity test +85degC/ 85% RH and -40degC ... +85degC temperature cycling test. After the tests, the samples were analyzed by visual inspection, functional testing and cross-sections. The analysis revealed that when using an appropriate silver paste, over 90% of the components remained functional, although problems were observed in the adhesion between the FPC substrate and the over moulding material.

AB - Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will utilize various electronic, optical and mechanical functions integrated in plastic product structures. In this study, in-mould integration of electronic and optoelectronic modules is examined in order to embed novel functionality into polymer matrix. Thermal load of the electronic components embedded in polymer material was briefly modelled, and a series of test structure samples realized. The test structure consisted of a flexible printed circuit (FPC) substrate with assembled electronic and optoelectronic components, which was set as an insert into injection moulding mould and thermoplastic polymer was cast on the substrate in injection moulding process. After the over moulding of the samples, characterization of components was carried out by visual inspection and by functional testing. It was found out that with correct injection moulding process parameters, all components survived the challenging conditions of injection moulding process. The reliability of the samples was evaluated by subjecting them to constant humidity test +85degC/ 85% RH and -40degC ... +85degC temperature cycling test. After the tests, the samples were analyzed by visual inspection, functional testing and cross-sections. The analysis revealed that when using an appropriate silver paste, over 90% of the components remained functional, although problems were observed in the adhesion between the FPC substrate and the over moulding material.

KW - circuit testing

KW - injection molding

KW - inspection

KW - casting

KW - in-mould integration

KW - reliability

M3 - Conference article in proceedings

SN - 978-1-4244-4722-0

SP - 1

EP - 6

BT - European Microelectronics and Packaging Conference

PB - Institute of Electrical and Electronic Engineers IEEE

ER -

Alajoki T, Koponen M, Juntunen E, Petaja J, Heikkinen M, Ollila J et al. In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components. In European Microelectronics and Packaging Conference. Institute of Electrical and Electronic Engineers IEEE. 2009. p. 1-6