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In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components
Teemu Alajoki, M. Koponen, E. Juntunen, J. Petaja, M. Heikkinen, J. Ollila, A. Sitomaniemi, T. Kosonen, J. Aikio, J.-T. Makinen
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
11
Citations
(Scopus)