Keyphrases
Residual Stress
100%
In Situ
100%
MEMS Application
100%
Low Pressure Chemical Vapor Deposition (LPCVD)
100%
Polysilicon
100%
Boron Doping
100%
Low Tensile Stress
100%
Surface Morphology
50%
Microstructure
50%
Deposition Process
50%
Resistivity
50%
Final Value
50%
Doping Concentration
50%
Annealing Temperature
50%
Post-deposition Annealing
50%
Annealing Treatment
50%
Annealing Effect
50%
Amorphous Microstructure
50%
INIS
applications
100%
chemical vapor deposition
100%
doped materials
100%
boron
100%
annealing
100%
microstructure
66%
residual stresses
66%
deposition
66%
films
66%
values
33%
surfaces
33%
morphology
33%
concentration
33%
Material Science
Residual Stress
100%
Annealing
100%
Boron
100%
Film
100%
Microelectromechanical System
100%
Ultimate Tensile Strength
100%
Low Pressure Chemical Vapor Deposition
100%
Surface Morphology
50%
Doping (Additives)
50%
Electrical Resistivity
50%
Engineering
Tensile Stress σ
100%
Residual Stress
100%
Microelectromechanical System
100%
Polysilicon
100%
Final Value
50%
Annealing Temperature
50%
Dopant Concentration
50%
Surface Morphology
50%
Deposition Process
50%