Abstract
The article describes a low temperature bump bonding
process to assemble CdTe sensors to readout chips. The
solder material used is In-Sn with a theoretical melting
point of 118 C. The solder was tested using Timepix
readout chips with 30-m diameter bumps and a 55-m pitch
bonded to CdTe sensors. The first results from these
assemblies show very good bumping and bonding yield
Original language | English |
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Title of host publication | Proceedings |
Subtitle of host publication | IEEE Nuclear Science Symposuim & Medical Imaging Conference, NSSMIC 2010 |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 3891-3895 |
ISBN (Electronic) | 978-1-4244-9105-6 |
ISBN (Print) | 978-1-4244-9106-3 |
DOIs | |
Publication status | Published - 2010 |
MoE publication type | A4 Article in a conference publication |
Event | 2010 IEEE Nuclear Science Symposium, Medical Imaging Conference, NSS/MIC 2010 and 17th International Workshop on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors, RTSD 2010 - Knoxville, TN, United States Duration: 30 Oct 2010 → 6 Nov 2010 |
Conference
Conference | 2010 IEEE Nuclear Science Symposium, Medical Imaging Conference, NSS/MIC 2010 and 17th International Workshop on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors, RTSD 2010 |
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Abbreviated title | NSS/MIC 2010 ; RTSD 2010 |
Country/Territory | United States |
City | Knoxville, TN |
Period | 30/10/10 → 6/11/10 |