Inexpensive packaging techniques of fiber pigtailed laser diodes

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publicationProcessing and Packaging of Semiconductor Lasers and Optoelectronic Devices
PublisherInternational Society for Optics and Photonics SPIE
Pages48-53
DOIs
Publication statusPublished - 1993
MoE publication typeA4 Article in a conference publication
EventOE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering - Los Angeles, United States
Duration: 20 Jan 199321 Jan 1993

Publication series

SeriesProceedings of SPIE
Volume1851

Conference

ConferenceOE/LASE'93
CountryUnited States
CityLos Angeles
Period20/01/9321/01/93

Cite this

Karioja, P., Tukkiniemi, K., Heikkinen, V., & Kaisto, I. (1993). Inexpensive packaging techniques of fiber pigtailed laser diodes. In Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices (pp. 48-53). International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 1851 https://doi.org/10.1117/12.147600
Karioja, Pentti ; Tukkiniemi, Kari ; Heikkinen, Veli ; Kaisto, Ilkka. / Inexpensive packaging techniques of fiber pigtailed laser diodes. Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices. International Society for Optics and Photonics SPIE, 1993. pp. 48-53 (Proceedings of SPIE, Vol. 1851).
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title = "Inexpensive packaging techniques of fiber pigtailed laser diodes",
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publisher = "International Society for Optics and Photonics SPIE",
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booktitle = "Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices",
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Karioja, P, Tukkiniemi, K, Heikkinen, V & Kaisto, I 1993, Inexpensive packaging techniques of fiber pigtailed laser diodes. in Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 1851, pp. 48-53, OE/LASE'93, Los Angeles, United States, 20/01/93. https://doi.org/10.1117/12.147600

Inexpensive packaging techniques of fiber pigtailed laser diodes. / Karioja, Pentti; Tukkiniemi, Kari; Heikkinen, Veli; Kaisto, Ilkka.

Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices. International Society for Optics and Photonics SPIE, 1993. p. 48-53 (Proceedings of SPIE, Vol. 1851).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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T1 - Inexpensive packaging techniques of fiber pigtailed laser diodes

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AU - Tukkiniemi, Kari

AU - Heikkinen, Veli

AU - Kaisto, Ilkka

PY - 1993

Y1 - 1993

U2 - 10.1117/12.147600

DO - 10.1117/12.147600

M3 - Conference article in proceedings

T3 - Proceedings of SPIE

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EP - 53

BT - Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices

PB - International Society for Optics and Photonics SPIE

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Karioja P, Tukkiniemi K, Heikkinen V, Kaisto I. Inexpensive packaging techniques of fiber pigtailed laser diodes. In Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices. International Society for Optics and Photonics SPIE. 1993. p. 48-53. (Proceedings of SPIE, Vol. 1851). https://doi.org/10.1117/12.147600