TY - JOUR
T1 - Inkjet-Printed Ternary Oxide Dielectric and Doped Interface Layer for Metal-Oxide Thin-Film Transistors with Low Voltage Operation
AU - Gillan, Liam
AU - Li, Shujie
AU - Lahtinen, Jouko
AU - Chang, Chih Hung
AU - Alastalo, Ari
AU - Leppäniemi, Jaakko
N1 - Funding Information:
VTT's work was funded in part by the Academy of Finland under Grant Agreement No. 305450 (project ROXI) and No. 328627 (project FLEXRAD). Oregon State University's work was supported by the Walmart Manufacturing Innovation Foundation, Grant #29955421, and the US National Science Foundation, Grant No. CBET 1449383. The authors acknowledge the provision of facilities of the Aalto University at OtaNano – Nanomicroscopy Center (Aalto‐NMC).
PY - 2021/6/23
Y1 - 2021/6/23
N2 - Additive solution process patterning, such as inkjet printing, is desirable for high-throughput roll-to-roll and sheet fabrication environments of electronics manufacturing because it can help to reduce cost by conserving active materials and circumventing multistep processing. This paper reports inkjet printing of YxAl2−xO3 gate dielectric, In2O3 semiconductor, and a polyethyleneimine-doped In2O3 interfacial charge injection layer to achieve a thin-film transistor (TFT) mobility (μsat) of ≈1 cm2 V−1 s−1 at a low 3 V operating voltage. When the dielectric material is annealed at 350 °C, plasma treatment induces low-frequency capacitance instability, leading to overestimation of mobility. On the contrary, films annealed at 500 °C show stable capacitance from 1 MHz down to 0.1 Hz. This result highlights the importance of low-frequency capacitance characterization of solution-processed dielectrics, especially if plasma treatment is applied before subsequent processing steps. This study progresses metal-oxide TFT fabrication toward fully inkjet-printed thin-film electronics.
AB - Additive solution process patterning, such as inkjet printing, is desirable for high-throughput roll-to-roll and sheet fabrication environments of electronics manufacturing because it can help to reduce cost by conserving active materials and circumventing multistep processing. This paper reports inkjet printing of YxAl2−xO3 gate dielectric, In2O3 semiconductor, and a polyethyleneimine-doped In2O3 interfacial charge injection layer to achieve a thin-film transistor (TFT) mobility (μsat) of ≈1 cm2 V−1 s−1 at a low 3 V operating voltage. When the dielectric material is annealed at 350 °C, plasma treatment induces low-frequency capacitance instability, leading to overestimation of mobility. On the contrary, films annealed at 500 °C show stable capacitance from 1 MHz down to 0.1 Hz. This result highlights the importance of low-frequency capacitance characterization of solution-processed dielectrics, especially if plasma treatment is applied before subsequent processing steps. This study progresses metal-oxide TFT fabrication toward fully inkjet-printed thin-film electronics.
KW - high-κ oxide dielectrics
KW - inkjet printing
KW - printed electronics
KW - solution-processed oxides
KW - thin-film transistors
UR - http://www.scopus.com/inward/record.url?scp=85106478314&partnerID=8YFLogxK
U2 - 10.1002/admi.202100728
DO - 10.1002/admi.202100728
M3 - Article
AN - SCOPUS:85106478314
SN - 2196-7350
VL - 8
JO - Advanced Materials Interfaces
JF - Advanced Materials Interfaces
IS - 12
M1 - 2100728
ER -