Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

Markku Lahti, Kari Kautio, Pentti Karioja

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review


    A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AlN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.
    Original languageEnglish
    Title of host publication2006 European Conference on Wireless Technology
    PublisherIEEE Institute of Electrical and Electronic Engineers
    ISBN (Print)2-9600551-5-2
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication
    EventEuropean Conference on Wireless Technology - Manchester, United Kingdom
    Duration: 10 Sept 200612 Sept 2006


    ConferenceEuropean Conference on Wireless Technology
    Country/TerritoryUnited Kingdom


    • Ceramics
    • Interconnections
    • Packaging
    • Passive circuits
    • Radar applications
    • Transmission lines


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