Abstract
A novel method to laminate and co-fire LTCC tapes directly on a heat
sink was studied. Several tape systems, including combination of mixed
permittivities, and heat sink material options have been demonstrated. The
critical issue in the selection of materials was the compatibility of CTE
values between different materials due to wide temperature range in the
processing. The most optimal heat sink material was AlN. It has high thermal
conductivity and good enough CTE match to LTCC tapes used. In addition, it can
be selectively patterned. The effects of LTCC processing on electrical values
were studied by utilizing buried capacitors and transmission lines.
Original language | English |
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Title of host publication | 2006 European Conference on Wireless Technology |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 1667-1670 |
ISBN (Print) | 2-9600551-5-2 |
DOIs | |
Publication status | Published - 2006 |
MoE publication type | A4 Article in a conference publication |
Event | European Conference on Wireless Technology - Manchester, United Kingdom Duration: 10 Sept 2006 → 12 Sept 2006 |
Conference
Conference | European Conference on Wireless Technology |
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Country/Territory | United Kingdom |
City | Manchester |
Period | 10/09/06 → 12/09/06 |
Keywords
- Ceramics
- Interconnections
- Packaging
- Passive circuits
- Radar applications
- Transmission lines