Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AlN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.
Original languageEnglish
Title of host publication2006 European Conference on Wireless Technology
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages1667-1670
ISBN (Print)2-9600551-5-2
DOIs
Publication statusPublished - 2006
MoE publication typeA4 Article in a conference publication
EventEuropean Conference on Wireless Technology - Manchester, United Kingdom
Duration: 10 Sep 200612 Sep 2006

Conference

ConferenceEuropean Conference on Wireless Technology
CountryUnited Kingdom
CityManchester
Period10/09/0612/09/06

Fingerprint

Laminating
Heat sinks
Tapes
Processing
Laminates
Electric lines
Thermal conductivity
Fires
Capacitors
Permittivity
Temperature

Keywords

  • Ceramics
  • Interconnections
  • Packaging
  • Passive circuits
  • Radar applications
  • Transmission lines

Cite this

Lahti, M., Kautio, K., & Karioja, P. (2006). Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. In 2006 European Conference on Wireless Technology (pp. 1667-1670). Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/EUMC.2006.281441
Lahti, Markku ; Kautio, Kari ; Karioja, Pentti. / Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. 2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE, 2006. pp. 1667-1670
@inproceedings{b83d3a0cde73455f8da58eaa442cd69a,
title = "Integrated LTCC modules by laminating and co-firing tapes directly on heat sink",
abstract = "A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AlN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.",
keywords = "Ceramics, Interconnections, Packaging, Passive circuits, Radar applications, Transmission lines",
author = "Markku Lahti and Kari Kautio and Pentti Karioja",
year = "2006",
doi = "10.1109/EUMC.2006.281441",
language = "English",
isbn = "2-9600551-5-2",
pages = "1667--1670",
booktitle = "2006 European Conference on Wireless Technology",
publisher = "Institute of Electrical and Electronic Engineers IEEE",
address = "United States",

}

Lahti, M, Kautio, K & Karioja, P 2006, Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. in 2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE, pp. 1667-1670, European Conference on Wireless Technology, Manchester, United Kingdom, 10/09/06. https://doi.org/10.1109/EUMC.2006.281441

Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. / Lahti, Markku; Kautio, Kari; Karioja, Pentti.

2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE, 2006. p. 1667-1670.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

AU - Lahti, Markku

AU - Kautio, Kari

AU - Karioja, Pentti

PY - 2006

Y1 - 2006

N2 - A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AlN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.

AB - A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AlN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.

KW - Ceramics

KW - Interconnections

KW - Packaging

KW - Passive circuits

KW - Radar applications

KW - Transmission lines

U2 - 10.1109/EUMC.2006.281441

DO - 10.1109/EUMC.2006.281441

M3 - Conference article in proceedings

SN - 2-9600551-5-2

SP - 1667

EP - 1670

BT - 2006 European Conference on Wireless Technology

PB - Institute of Electrical and Electronic Engineers IEEE

ER -

Lahti M, Kautio K, Karioja P. Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. In 2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE. 2006. p. 1667-1670 https://doi.org/10.1109/EUMC.2006.281441