Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)

    Abstract

    A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.
    Original languageEnglish
    Title of host publication2006 European Conference on Wireless Technology
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages372-375
    ISBN (Print)2-9600551-5-2
    DOIs
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication
    Event9th European Conference on Wireless Technology, ECWT 2006 - Manchester, United Kingdom
    Duration: 10 Sep 200612 Sep 2006
    Conference number: 9

    Conference

    Conference9th European Conference on Wireless Technology, ECWT 2006
    Abbreviated titleECWT 2006
    CountryUnited Kingdom
    CityManchester
    Period10/09/0612/09/06

    Fingerprint

    Laminating
    Heat sinks
    Tapes
    Processing
    Laminates
    Electric lines
    Thermal conductivity
    Fires
    Capacitors
    Permittivity
    Temperature

    Keywords

    • Ceramics
    • Interconnections
    • Packaging
    • Passive circuits
    • Radar applications
    • Transmission lines

    Cite this

    Lahti, M., Kautio, K., & Karioja, P. (2006). Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. In 2006 European Conference on Wireless Technology (pp. 372-375). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/ECWT.2006.280515
    Lahti, Markku ; Kautio, Kari ; Karioja, Pentti. / Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. 2006 European Conference on Wireless Technology. IEEE Institute of Electrical and Electronic Engineers , 2006. pp. 372-375
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    title = "Integrated LTCC modules by laminating and co-firing tapes directly on heat sink",
    abstract = "A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.",
    keywords = "Ceramics, Interconnections, Packaging, Passive circuits, Radar applications, Transmission lines",
    author = "Markku Lahti and Kari Kautio and Pentti Karioja",
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    Lahti, M, Kautio, K & Karioja, P 2006, Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. in 2006 European Conference on Wireless Technology. IEEE Institute of Electrical and Electronic Engineers , pp. 372-375, 9th European Conference on Wireless Technology, ECWT 2006, Manchester, United Kingdom, 10/09/06. https://doi.org/10.1109/ECWT.2006.280515

    Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. / Lahti, Markku; Kautio, Kari; Karioja, Pentti.

    2006 European Conference on Wireless Technology. IEEE Institute of Electrical and Electronic Engineers , 2006. p. 372-375.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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    AU - Kautio, Kari

    AU - Karioja, Pentti

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    Y1 - 2006

    N2 - A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.

    AB - A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.

    KW - Ceramics

    KW - Interconnections

    KW - Packaging

    KW - Passive circuits

    KW - Radar applications

    KW - Transmission lines

    U2 - 10.1109/ECWT.2006.280515

    DO - 10.1109/ECWT.2006.280515

    M3 - Conference article in proceedings

    SN - 2-9600551-5-2

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    BT - 2006 European Conference on Wireless Technology

    PB - IEEE Institute of Electrical and Electronic Engineers

    ER -

    Lahti M, Kautio K, Karioja P. Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. In 2006 European Conference on Wireless Technology. IEEE Institute of Electrical and Electronic Engineers . 2006. p. 372-375 https://doi.org/10.1109/ECWT.2006.280515