Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.
Original languageEnglish
Title of host publication2006 European Conference on Wireless Technology
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages372-375
ISBN (Print)2-9600551-5-2
DOIs
Publication statusPublished - 2006
MoE publication typeA4 Article in a conference publication
Event9th European Conference on Wireless Technology, ECWT 2006 - Manchester, United Kingdom
Duration: 10 Sep 200612 Sep 2006
Conference number: 9

Conference

Conference9th European Conference on Wireless Technology, ECWT 2006
Abbreviated titleECWT 2006
CountryUnited Kingdom
CityManchester
Period10/09/0612/09/06

Fingerprint

Laminating
Heat sinks
Tapes
Processing
Laminates
Electric lines
Thermal conductivity
Fires
Capacitors
Permittivity
Temperature

Keywords

  • Ceramics
  • Interconnections
  • Packaging
  • Passive circuits
  • Radar applications
  • Transmission lines

Cite this

Lahti, M., Kautio, K., & Karioja, P. (2006). Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. In 2006 European Conference on Wireless Technology (pp. 372-375). Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/ECWT.2006.280515
Lahti, Markku ; Kautio, Kari ; Karioja, Pentti. / Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. 2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE, 2006. pp. 372-375
@inproceedings{41db6b4c7bda4008a537b424b9247a96,
title = "Integrated LTCC modules by laminating and co-firing tapes directly on heat sink",
abstract = "A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.",
keywords = "Ceramics, Interconnections, Packaging, Passive circuits, Radar applications, Transmission lines",
author = "Markku Lahti and Kari Kautio and Pentti Karioja",
year = "2006",
doi = "10.1109/ECWT.2006.280515",
language = "English",
isbn = "2-9600551-5-2",
pages = "372--375",
booktitle = "2006 European Conference on Wireless Technology",
publisher = "Institute of Electrical and Electronic Engineers IEEE",
address = "United States",

}

Lahti, M, Kautio, K & Karioja, P 2006, Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. in 2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE, pp. 372-375, 9th European Conference on Wireless Technology, ECWT 2006, Manchester, United Kingdom, 10/09/06. https://doi.org/10.1109/ECWT.2006.280515

Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. / Lahti, Markku; Kautio, Kari; Karioja, Pentti.

2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE, 2006. p. 372-375.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

AU - Lahti, Markku

AU - Kautio, Kari

AU - Karioja, Pentti

PY - 2006

Y1 - 2006

N2 - A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.

AB - A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.

KW - Ceramics

KW - Interconnections

KW - Packaging

KW - Passive circuits

KW - Radar applications

KW - Transmission lines

U2 - 10.1109/ECWT.2006.280515

DO - 10.1109/ECWT.2006.280515

M3 - Conference article in proceedings

SN - 2-9600551-5-2

SP - 372

EP - 375

BT - 2006 European Conference on Wireless Technology

PB - Institute of Electrical and Electronic Engineers IEEE

ER -

Lahti M, Kautio K, Karioja P. Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. In 2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE. 2006. p. 372-375 https://doi.org/10.1109/ECWT.2006.280515