Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

Markku Lahti; Kari Kautio; Pentti Karioja

doi:10.1109/ECWT.2006.280515

Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

Markku Lahti, Kari Kautio, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

2 Citations (Scopus)

Abstract

A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.

Original language	English
Title of host publication	2006 European Conference on Wireless Technology
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	372-375
ISBN (Print)	2-9600551-5-2
DOIs	https://doi.org/10.1109/ECWT.2006.280515
Publication status	Published - 2006
MoE publication type	A4 Article in a conference publication
Event	9th European Conference on Wireless Technology, ECWT 2006 - Manchester, United Kingdom Duration: 10 Sept 2006 → 12 Sept 2006 Conference number: 9

Conference

Conference	9th European Conference on Wireless Technology, ECWT 2006
Abbreviated title	ECWT 2006
Country/Territory	United Kingdom
City	Manchester
Period	10/09/06 → 12/09/06

Keywords

Ceramics
Interconnections
Packaging
Passive circuits
Radar applications
Transmission lines

Access to Document

10.1109/ECWT.2006.280515

Cite this

@inproceedings{41db6b4c7bda4008a537b424b9247a96,

title = "Integrated LTCC modules by laminating and co-firing tapes directly on heat sink",

abstract = "A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.",

keywords = "Ceramics, Interconnections, Packaging, Passive circuits, Radar applications, Transmission lines",

author = "Markku Lahti and Kari Kautio and Pentti Karioja",

year = "2006",

doi = "10.1109/ECWT.2006.280515",

language = "English",

isbn = "2-9600551-5-2",

pages = "372--375",

booktitle = "2006 European Conference on Wireless Technology",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "9th European Conference on Wireless Technology, ECWT 2006, ECWT 2006 ; Conference date: 10-09-2006 Through 12-09-2006",

}

Lahti, M, Kautio, K & Karioja, P 2006, Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. in 2006 European Conference on Wireless Technology. IEEE Institute of Electrical and Electronic Engineers, pp. 372-375, 9th European Conference on Wireless Technology, ECWT 2006, Manchester, United Kingdom, 10/09/06. https://doi.org/10.1109/ECWT.2006.280515

Integrated LTCC modules by laminating and co-firing tapes directly on heat sink. / Lahti, Markku; Kautio, Kari; Karioja, Pentti.
2006 European Conference on Wireless Technology. IEEE Institute of Electrical and Electronic Engineers, 2006. p. 372-375.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

AU - Lahti, Markku

AU - Kautio, Kari

AU - Karioja, Pentti

N1 - Conference code: 9

PY - 2006

Y1 - 2006

N2 - A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.

AB - A novel method to laminate and co-fire LTCC tapes directly on a heat sink was studied. Several tape systems, including combination of mixed permittivities, and heat sink material options have been demonstrated. The critical issue in the selection of materials was the compatibility of CTE values between different materials due to wide temperature range in the processing. The most optimal heat sink material was AIN. It has high thermal conductivity and good enough CTE match to LTCC tapes used. In addition, it can be selectively patterned. The effects of LTCC processing on electrical values were studied by utilizing buried capacitors and transmission lines.

KW - Ceramics

KW - Interconnections

KW - Packaging

KW - Passive circuits

KW - Radar applications

KW - Transmission lines

U2 - 10.1109/ECWT.2006.280515

DO - 10.1109/ECWT.2006.280515

M3 - Conference article in proceedings

SN - 2-9600551-5-2

SP - 372

EP - 375

BT - 2006 European Conference on Wireless Technology

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 9th European Conference on Wireless Technology, ECWT 2006

Y2 - 10 September 2006 through 12 September 2006

ER -

Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

Abstract

Conference

Keywords

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