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Abstract
We present our experimental results on ultrasound transducers based on Photonic Integrated Circuits. We have fabricated and tested devices based on Mach Zehnder Interferometers and Ring Resonators, in the thick-Silicon On Insulator platform (VTT, Finland) and Si3N4 platform (Ligentec, Switzerland). We have obtained a Noise Equivalent Pressure which is two orders of magnitude lower than conventional State-Of-The-Art transducers, clearly demonstrating the huge potential of this concept.
Original language | English |
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Title of host publication | Integrated Optics: Devices, Materials, and Technologies XXIX |
Editors | Sonia M. Garcia-Blanco, Pavel Cheben |
Publisher | International Society for Optics and Photonics SPIE |
Number of pages | 7 |
ISBN (Electronic) | 9781510684867 |
DOIs | |
Publication status | Published - 2025 |
MoE publication type | A4 Article in a conference publication |
Event | Integrated Optics: Devices, Materials, and Technologies XXIX 2025 - San Francisco, United States Duration: 27 Jan 2025 → 30 Jan 2025 |
Publication series
Series | Proceedings of SPIE |
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Volume | 13369 |
ISSN | 0277-786X |
Conference
Conference | Integrated Optics: Devices, Materials, and Technologies XXIX 2025 |
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Country/Territory | United States |
City | San Francisco |
Period | 27/01/25 → 30/01/25 |
Funding
This work was supported by the TNO Early Research Program (ERP) ‘Opto-acoustics’, NWO grant NWA 1160.18.095 ‘Opto-acoustic sensor and ultrasonic microbubbles for dosimetry in proton therapy’, and partly funded by the European Union, MedIPUT project, HORIZON-CL4-2022-DIGITAL-EMERGING-01, Grant 101092947, https://med-iput.eu/.
Keywords
- integrated photonics
- IPUT
- Mach Zehnder Interferometer
- membrane
- noise-equivalent pressure
- ring resonator
- transducer
- Ultrasound
Fingerprint
Dive into the research topics of 'Integrated Photonic Ultrasound Transducers for Medical Imaging'. Together they form a unique fingerprint.Projects
- 1 Active
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Med-IPUT: MEDical Integrated Photonic Ultrasound Transducers
Marin Vasquez, Y. (Manager), Heimala, P. (Participant), Sun, F. (Participant), Ylinen, S. (Participant), Eskelinen, P. (Participant), Ailas, H. (Participant), Lee, J.-W. (Participant) & Harjanne, M. (Participant)
1/01/23 → 30/06/26
Project: EU project