Integrated PMUTs on Elastic Substrate for Wearable Applications

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Hybrid electronics integration enables the development of novel wearable skin patches where conventional rigid electronics can be integrated into soft and conformal substrates. This work presents a stretchable patch with integrated piezo micro-machined ultrasound transducers (PMUTs) for potential application in continuous blood pressure estimation, as well as measuring arterial wall thickness and stiffness. The performance of the integrated PMUT is evaluated via a specific acoustic measurement setup to detect the dimensional variation of a water-filled pipe as a function of the applied pressure using pulse-echo arrival time. The setup mimics dimensional changes to arterial diameter due to blood flow. With the setup, the diameter change of 4.17 mm and wall thickness change of 0.41 mm are detected while the pipe pressure varies from 0–2 bar.
Original languageEnglish
Title of host publicationFLEPS 2024 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
PublisherIEEE Institute of Electrical and Electronic Engineers
Number of pages3
ISBN (Electronic)979-8-3503-8326-3
ISBN (Print)979-8-3503-8327-0
DOIs
Publication statusPublished - 25 Jul 2024
MoE publication typeA4 Article in a conference publication
Event2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) - Tampere, Finland
Duration: 30 Jun 20243 Jul 2024

Publication series

Series IEEE International Conference on Flexible and Printable Sensors and Systems
Volume2024
ISSN2832-8248

Conference

Conference2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
Country/TerritoryFinland
CityTampere
Period30/06/243/07/24

Funding

This work was labelled by ITEA and funded by local authorities under grant agreement ITEA-2021-21022- RM4Health, and partly funded by VTT s internal grant. The authors would like to thank Okmetic Oy for providing CSOI wafers (in Moore4Medical project H2020-ECSEL-2019-IA-876190).

Keywords

  • blood pressure
  • hybrid integration
  • wearable sensor
  • piezo micro-machined ultrasound transducers
  • Ultrasound

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