Abstract
The Internet of Everything (IoE) is a vision for the connectivity of anything, at anytime and from anyplace. It will extend today’s internet to the physical world that surrounds us (things and objects). To reach the vision of IoE, technical innovation is required in a number of fields from hardware solutions to data management. Stick-it-on devices (SioDs) are one of the revolutionary innovations enabling the vision and bringing intelligence into today’s real world objects. SioDs are flexible, energy autonomous, interactive devices that can perform functions like sensing, actuating, computing, and/or communicating.
To incorporate low-power high-performance computing into the SioDs, it is necessary to integrate both flexible printed and silicon components. This presentation focuses on the integration of printed and conventional electronics. It will present progress in 1) SMD mounting, 2) flip-chip bonding, and 3) direct chip connections (e.g. replacement of wire-bonding).
To incorporate low-power high-performance computing into the SioDs, it is necessary to integrate both flexible printed and silicon components. This presentation focuses on the integration of printed and conventional electronics. It will present progress in 1) SMD mounting, 2) flip-chip bonding, and 3) direct chip connections (e.g. replacement of wire-bonding).
| Original language | English |
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| Title of host publication | International Conference on Flexible and Printed Electroncis |
| Place of Publication | Yonezawa |
| Publication status | Published - Sept 2016 |
| MoE publication type | D3 Professional conference proceedings |