Abstract
An overview of an integration platform with 1–10 µm thick
silicon-on-insulator waveguides is given. It is suitable for the integration
and packaging of optoelectronic and silicon photonic (nm-scale) chips. The
platform can also contain many passive functions, such as spot-size
converters, couplers, wavelength (de)multiplexers/filters and polarization
splitters. The footprint of the platform is minimized by using multi-step
patterning to realize e.g. mirrors and short MMI couplers
Original language | English |
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Title of host publication | European Conference on Integrated Photonics website |
Number of pages | 2 |
Publication status | Published - 2012 |
MoE publication type | D3 Professional conference proceedings |
Event | 16th European Conference on Integrated Optics ECIO 2012 - Sitges, Barcelona, Spain Duration: 18 Apr 2012 → 20 Apr 2012 |
Conference
Conference | 16th European Conference on Integrated Optics ECIO 2012 |
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Country/Territory | Spain |
City | Barcelona |
Period | 18/04/12 → 20/04/12 |
Keywords
- Silicon-on-insulator
- SOI
- integration platform
- silicon photonics
- optoelectronics
- hybrid integration
- packaging