Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsProfessional

    Abstract

    An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers
    Original languageEnglish
    Title of host publicationEuropean Conference on Integrated Photonics website
    Number of pages2
    Publication statusPublished - 2012
    MoE publication typeD3 Professional conference proceedings
    Event16th European Conference on Integrated Optics ECIO 2012 - Sitges, Barcelona, Spain
    Duration: 18 Apr 201220 Apr 2012

    Conference

    Conference16th European Conference on Integrated Optics ECIO 2012
    CountrySpain
    CityBarcelona
    Period18/04/1220/04/12

    Fingerprint

    SOI (semiconductors)
    packaging
    platforms
    chips
    photonics
    couplers
    silicon
    footprints
    multiplexing
    converters
    insulators
    mirrors
    waveguides
    filters
    polarization
    wavelengths

    Keywords

    • Silicon-on-insulator
    • SOI
    • integration platform
    • silicon photonics
    • optoelectronics
    • hybrid integration
    • packaging

    Cite this

    @inproceedings{0d7e7d0c25fa4c2e9b0ec7a9c5f51ec0,
    title = "Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform",
    abstract = "An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers",
    keywords = "Silicon-on-insulator, SOI, integration platform, silicon photonics, optoelectronics, hybrid integration, packaging",
    author = "Timo Aalto and Mikko Harjanne and Markku Kapulainen and Sami Ylinen",
    note = "CA2: TK610 SDA: MEL",
    year = "2012",
    language = "English",
    booktitle = "European Conference on Integrated Photonics website",

    }

    Aalto, T, Harjanne, M, Kapulainen, M & Ylinen, S 2012, Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform. in European Conference on Integrated Photonics website., ThP128, 16th European Conference on Integrated Optics ECIO 2012, Barcelona, Spain, 18/04/12.

    Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform. / Aalto, Timo; Harjanne, Mikko; Kapulainen, Markku; Ylinen, Sami.

    European Conference on Integrated Photonics website. 2012. ThP128.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsProfessional

    TY - GEN

    T1 - Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform

    AU - Aalto, Timo

    AU - Harjanne, Mikko

    AU - Kapulainen, Markku

    AU - Ylinen, Sami

    N1 - CA2: TK610 SDA: MEL

    PY - 2012

    Y1 - 2012

    N2 - An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers

    AB - An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers

    KW - Silicon-on-insulator

    KW - SOI

    KW - integration platform

    KW - silicon photonics

    KW - optoelectronics

    KW - hybrid integration

    KW - packaging

    M3 - Conference article in proceedings

    BT - European Conference on Integrated Photonics website

    ER -