Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsProfessional

Abstract

An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers
Original languageEnglish
Title of host publicationEuropean Conference on Integrated Photonics website
Number of pages2
Publication statusPublished - 2012
MoE publication typeD3 Professional conference proceedings
Event16th European Conference on Integrated Optics ECIO 2012 - Sitges, Barcelona, Spain
Duration: 18 Apr 201220 Apr 2012

Conference

Conference16th European Conference on Integrated Optics ECIO 2012
CountrySpain
CityBarcelona
Period18/04/1220/04/12

Fingerprint

SOI (semiconductors)
packaging
platforms
chips
photonics
couplers
silicon
footprints
multiplexing
converters
insulators
mirrors
waveguides
filters
polarization
wavelengths

Keywords

  • Silicon-on-insulator
  • SOI
  • integration platform
  • silicon photonics
  • optoelectronics
  • hybrid integration
  • packaging

Cite this

@inproceedings{0d7e7d0c25fa4c2e9b0ec7a9c5f51ec0,
title = "Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform",
abstract = "An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers",
keywords = "Silicon-on-insulator, SOI, integration platform, silicon photonics, optoelectronics, hybrid integration, packaging",
author = "Timo Aalto and Mikko Harjanne and Markku Kapulainen and Sami Ylinen",
note = "CA2: TK610 SDA: MEL",
year = "2012",
language = "English",
booktitle = "European Conference on Integrated Photonics website",

}

Aalto, T, Harjanne, M, Kapulainen, M & Ylinen, S 2012, Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform. in European Conference on Integrated Photonics website., ThP128, 16th European Conference on Integrated Optics ECIO 2012, Barcelona, Spain, 18/04/12.

Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform. / Aalto, Timo; Harjanne, Mikko; Kapulainen, Markku; Ylinen, Sami.

European Conference on Integrated Photonics website. 2012. ThP128.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsProfessional

TY - GEN

T1 - Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform

AU - Aalto, Timo

AU - Harjanne, Mikko

AU - Kapulainen, Markku

AU - Ylinen, Sami

N1 - CA2: TK610 SDA: MEL

PY - 2012

Y1 - 2012

N2 - An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers

AB - An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers

KW - Silicon-on-insulator

KW - SOI

KW - integration platform

KW - silicon photonics

KW - optoelectronics

KW - hybrid integration

KW - packaging

M3 - Conference article in proceedings

BT - European Conference on Integrated Photonics website

ER -