Abstract
| Original language | English |
|---|---|
| Title of host publication | European Conference on Integrated Photonics website |
| Number of pages | 2 |
| Publication status | Published - 2012 |
| MoE publication type | D3 Professional conference proceedings |
| Event | 16th European Conference on Integrated Optics ECIO 2012 - Sitges, Barcelona, Spain Duration: 18 Apr 2012 → 20 Apr 2012 |
Conference
| Conference | 16th European Conference on Integrated Optics ECIO 2012 |
|---|---|
| Country | Spain |
| City | Barcelona |
| Period | 18/04/12 → 20/04/12 |
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Keywords
- Silicon-on-insulator
- SOI
- integration platform
- silicon photonics
- optoelectronics
- hybrid integration
- packaging
Cite this
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Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform. / Aalto, Timo; Harjanne, Mikko; Kapulainen, Markku; Ylinen, Sami.
European Conference on Integrated Photonics website. 2012. ThP128.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Professional
TY - GEN
T1 - Integration and Packaging of Optoelectronic and Silicon Photonic Chips on a µm-scale SOI Platform
AU - Aalto, Timo
AU - Harjanne, Mikko
AU - Kapulainen, Markku
AU - Ylinen, Sami
N1 - CA2: TK610 SDA: MEL
PY - 2012
Y1 - 2012
N2 - An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers
AB - An overview of an integration platform with 1–10 µm thick silicon-on-insulator waveguides is given. It is suitable for the integration and packaging of optoelectronic and silicon photonic (nm-scale) chips. The platform can also contain many passive functions, such as spot-size converters, couplers, wavelength (de)multiplexers/filters and polarization splitters. The footprint of the platform is minimized by using multi-step patterning to realize e.g. mirrors and short MMI couplers
KW - Silicon-on-insulator
KW - SOI
KW - integration platform
KW - silicon photonics
KW - optoelectronics
KW - hybrid integration
KW - packaging
M3 - Conference article in proceedings
BT - European Conference on Integrated Photonics website
ER -