Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates

Martin Kulawski; Hannu Luoto; Kimmo Henttinen; Tommi Suni; Frauke Weimar; Jari Mäkinen

doi:10.1557/PROC-867-W3.4

Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates

Martin Kulawski^*
, Hannu Luoto
, Kimmo Henttinen
, Tommi Suni
, Frauke Weimar
, Jari Mäkinen

^*Corresponding author for this work

VTT Technical Research Centre of Finland

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

1 Citation (Scopus)

Abstract

In this paper a fully integrated manufacturing sequence for flat thick film SOI wafers is presented. By applying low sub-surface damage grinding and combing it with the newly developed polishing process by fixed abrasive pads ,the total removal after mechanical grinding can be strongly reduced. 6" SOI substrates with clearly below 1 µm TTV at an Edge exclusion of below 2 mm are the result. The quality of the surface concerning crystal damage is corroborated by the oxide induced stacking fault method. The wafers show prime quality and the presented sequence provides great benefits and enables the production of highly flat SOI material for future MEMS applications with high demands.

Original language	English
Title of host publication	Symposium W — Chemical-Mechanical Planarization-Integration
Subtitle of host publication	Technology and Reliability
Editors	E.C. Johns, A. Kumar, J.A. Lee, Y.S. Obeng, I. Vos
Publisher	Springer Nature
Pages	111-116
DOIs	https://doi.org/10.1557/PROC-867-W3.4
Publication status	Published - 1 Nov 2005
MoE publication type	A4 Article in a conference publication
Event	MRS Symposium W — Chemical-Mechanical Planarization-Integration - San Francisco, United States Duration: 1 Mar 2005 → …

Publication series

Series	Materials Research Society Symposia Proceedings
Volume	867
ISSN	0272-9172

Conference

Conference	MRS Symposium W — Chemical-Mechanical Planarization-Integration
Country/Territory	United States
City	San Francisco
Period	1/03/05 → …

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

grinding
CMP
polishing
MEMS
thick film SOI fixed abrasive
sub-surface damage

Access to Document

10.1557/PROC-867-W3.4

Cite this

Kulawski, M., Luoto, H., Henttinen, K., Suni, T., Weimar, F., & Mäkinen, J. (2005). Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates. In E. C. Johns, A. Kumar, J. A. Lee, Y. S. Obeng, & I. Vos (Eds.), Symposium W — Chemical-Mechanical Planarization-Integration: Technology and Reliability (pp. 111-116). Article 34 Springer Nature. https://doi.org/10.1557/PROC-867-W3.4

Kulawski, Martin ; Luoto, Hannu ; Henttinen, Kimmo et al. / Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates. Symposium W — Chemical-Mechanical Planarization-Integration: Technology and Reliability. editor / E.C. Johns ; A. Kumar ; J.A. Lee ; Y.S. Obeng ; I. Vos. Springer Nature, 2005. pp. 111-116 (Materials Research Society Symposia Proceedings, Vol. 867).

@inproceedings{a2e7911d7b034d11b0d28fdcbb5cf888,

title = "Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates",

abstract = "In this paper a fully integrated manufacturing sequence for flat thick film SOI wafers is presented. By applying low sub-surface damage grinding and combing it with the newly developed polishing process by fixed abrasive pads ,the total removal after mechanical grinding can be strongly reduced. 6{"} SOI substrates with clearly below 1 µm TTV at an Edge exclusion of below 2 mm are the result. The quality of the surface concerning crystal damage is corroborated by the oxide induced stacking fault method. The wafers show prime quality and the presented sequence provides great benefits and enables the production of highly flat SOI material for future MEMS applications with high demands.",

keywords = "grinding, CMP, polishing, MEMS, thick film SOI fixed abrasive, sub-surface damage",

author = "Martin Kulawski and Hannu Luoto and Kimmo Henttinen and Tommi Suni and Frauke Weimar and Jari M{\"a}kinen",

year = "2005",

month = nov,

day = "1",

doi = "10.1557/PROC-867-W3.4",

language = "English",

series = "Materials Research Society Symposia Proceedings",

publisher = "Springer Nature",

pages = "111--116",

editor = "E.C. Johns and A. Kumar and J.A. Lee and Y.S. Obeng and I. Vos",

booktitle = "Symposium W — Chemical-Mechanical Planarization-Integration",

address = "United Kingdom",

note = "MRS Symposium W — Chemical-Mechanical Planarization-Integration ; Conference date: 01-03-2005",

}

Kulawski, M, Luoto, H, Henttinen, K, Suni, T, Weimar, F & Mäkinen, J 2005, Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates. in EC Johns, A Kumar, JA Lee, YS Obeng & I Vos (eds), Symposium W — Chemical-Mechanical Planarization-Integration: Technology and Reliability., 34, Springer Nature, Materials Research Society Symposia Proceedings, vol. 867, pp. 111-116, MRS Symposium W — Chemical-Mechanical Planarization-Integration, San Francisco, California, United States, 1/03/05. https://doi.org/10.1557/PROC-867-W3.4

Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates. / Kulawski, Martin; Luoto, Hannu; Henttinen, Kimmo et al.
Symposium W — Chemical-Mechanical Planarization-Integration: Technology and Reliability. ed. / E.C. Johns; A. Kumar; J.A. Lee; Y.S. Obeng; I. Vos. Springer Nature, 2005. p. 111-116 34 (Materials Research Society Symposia Proceedings, Vol. 867).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates

AU - Kulawski, Martin

AU - Luoto, Hannu

AU - Henttinen, Kimmo

AU - Suni, Tommi

AU - Weimar, Frauke

AU - Mäkinen, Jari

PY - 2005/11/1

Y1 - 2005/11/1

N2 - In this paper a fully integrated manufacturing sequence for flat thick film SOI wafers is presented. By applying low sub-surface damage grinding and combing it with the newly developed polishing process by fixed abrasive pads ,the total removal after mechanical grinding can be strongly reduced. 6" SOI substrates with clearly below 1 µm TTV at an Edge exclusion of below 2 mm are the result. The quality of the surface concerning crystal damage is corroborated by the oxide induced stacking fault method. The wafers show prime quality and the presented sequence provides great benefits and enables the production of highly flat SOI material for future MEMS applications with high demands.

AB - In this paper a fully integrated manufacturing sequence for flat thick film SOI wafers is presented. By applying low sub-surface damage grinding and combing it with the newly developed polishing process by fixed abrasive pads ,the total removal after mechanical grinding can be strongly reduced. 6" SOI substrates with clearly below 1 µm TTV at an Edge exclusion of below 2 mm are the result. The quality of the surface concerning crystal damage is corroborated by the oxide induced stacking fault method. The wafers show prime quality and the presented sequence provides great benefits and enables the production of highly flat SOI material for future MEMS applications with high demands.

KW - grinding

KW - CMP

KW - polishing

KW - MEMS

KW - thick film SOI fixed abrasive

KW - sub-surface damage

U2 - 10.1557/PROC-867-W3.4

DO - 10.1557/PROC-867-W3.4

M3 - Conference article in proceedings

T3 - Materials Research Society Symposia Proceedings

SP - 111

EP - 116

BT - Symposium W — Chemical-Mechanical Planarization-Integration

A2 - Johns, E.C.

A2 - Kumar, A.

A2 - Lee, J.A.

A2 - Obeng, Y.S.

A2 - Vos, I.

PB - Springer Nature

T2 - MRS Symposium W — Chemical-Mechanical Planarization-Integration

Y2 - 1 March 2005

ER -

Kulawski M, Luoto H, Henttinen K, Suni T, Weimar F, Mäkinen J. Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates. In Johns EC, Kumar A, Lee JA, Obeng YS, Vos I, editors, Symposium W — Chemical-Mechanical Planarization-Integration: Technology and Reliability. Springer Nature. 2005. p. 111-116. 34. (Materials Research Society Symposia Proceedings, Vol. 867). doi: 10.1557/PROC-867-W3.4

Integration of CMP fixed abrasive polishing into the manufacturing of thick film SOI substrates

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

Fingerprint

Cite this