@inproceedings{ed2b6d412ef847cabe40168b4c179709,
title = "Integration of InP-based optoelectronics with silicon waveguides",
abstract = "Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench. (14 refs.)",
author = "Timo Aalto and Mikko Harjanne and Markku Kapulainen and Sami Ylinen and Jyrki Ollila and Ville Vilokkinen and Ludwig M{\"o}rl and Martin M{\"o}hrle and R{\'e}gis Hamelin",
note = "CA2: TK602 CA2: TK604 ; Integrated Optics: Devices, Materials, and Technologies XIII ; Conference date: 26-01-2009 Through 26-01-2009",
year = "2009",
doi = "10.1117/12.808129",
language = "English",
isbn = "978-0-8194-7464-3",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
editor = "Jean-Emmanuel Broquin and Greiner, {Christoph M.}",
booktitle = "Integrated Optics",
address = "United States",
}