Integration of InP-based optoelectronics with silicon waveguides

Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, Jyrki Ollila, Ville Vilokkinen, Ludwig Mörl, Martin Möhrle, Régis Hamelin

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    12 Citations (Scopus)


    Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench. (14 refs.)
    Original languageEnglish
    Title of host publicationIntegrated Optics
    Subtitle of host publicationDevices, Materials, and Technologies XIII
    EditorsJean-Emmanuel Broquin, Christoph M. Greiner
    PublisherInternational Society for Optics and Photonics SPIE
    Number of pages14
    ISBN (Print)978-0-8194-7464-3
    Publication statusPublished - 2009
    MoE publication typeA4 Article in a conference publication
    EventIntegrated Optics: Devices, Materials, and Technologies XIII - San Jose, United States
    Duration: 26 Jan 200926 Jan 2009

    Publication series

    SeriesProceedings of SPIE


    ConferenceIntegrated Optics: Devices, Materials, and Technologies XIII
    Country/TerritoryUnited States
    CitySan Jose


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