Integration of InP-based optoelectronics with silicon waveguides

Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, Jyrki Ollila, Ville Vilokkinen, Ludwig Mörl, Martin Möhrle, Régis Hamelin

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

12 Citations (Scopus)

Abstract

Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench. (14 refs.)
Original languageEnglish
Title of host publicationIntegrated Optics
Subtitle of host publicationDevices, Materials, and Technologies XIII
EditorsJean-Emmanuel Broquin, Christoph M. Greiner
PublisherInternational Society for Optics and Photonics SPIE
Number of pages14
ISBN (Print)978-0-8194-7464-3
DOIs
Publication statusPublished - 2009
MoE publication typeA4 Article in a conference publication
EventIntegrated Optics: Devices, Materials, and Technologies XIII - San Jose, United States
Duration: 26 Jan 200926 Jan 2009

Publication series

SeriesProceedings of SPIE
Volume7218
ISSN0277-786X

Conference

ConferenceIntegrated Optics: Devices, Materials, and Technologies XIII
CountryUnited States
CitySan Jose
Period26/01/0926/01/09

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chips
waveguides
insulators
silicon
laser arrays
integrated optics
seats
indium
platforms
costs
detectors

Cite this

Aalto, T., Harjanne, M., Kapulainen, M., Ylinen, S., Ollila, J., Vilokkinen, V., ... Hamelin, R. (2009). Integration of InP-based optoelectronics with silicon waveguides. In J-E. Broquin, & C. M. Greiner (Eds.), Integrated Optics: Devices, Materials, and Technologies XIII [72180O] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 7218 https://doi.org/10.1117/12.808129
Aalto, Timo ; Harjanne, Mikko ; Kapulainen, Markku ; Ylinen, Sami ; Ollila, Jyrki ; Vilokkinen, Ville ; Mörl, Ludwig ; Möhrle, Martin ; Hamelin, Régis. / Integration of InP-based optoelectronics with silicon waveguides. Integrated Optics: Devices, Materials, and Technologies XIII. editor / Jean-Emmanuel Broquin ; Christoph M. Greiner. International Society for Optics and Photonics SPIE, 2009. (Proceedings of SPIE, Vol. 7218).
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abstract = "Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench. (14 refs.)",
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Aalto, T, Harjanne, M, Kapulainen, M, Ylinen, S, Ollila, J, Vilokkinen, V, Mörl, L, Möhrle, M & Hamelin, R 2009, Integration of InP-based optoelectronics with silicon waveguides. in J-E Broquin & CM Greiner (eds), Integrated Optics: Devices, Materials, and Technologies XIII., 72180O, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 7218, Integrated Optics: Devices, Materials, and Technologies XIII, San Jose, United States, 26/01/09. https://doi.org/10.1117/12.808129

Integration of InP-based optoelectronics with silicon waveguides. / Aalto, Timo; Harjanne, Mikko; Kapulainen, Markku; Ylinen, Sami; Ollila, Jyrki; Vilokkinen, Ville; Mörl, Ludwig; Möhrle, Martin; Hamelin, Régis.

Integrated Optics: Devices, Materials, and Technologies XIII. ed. / Jean-Emmanuel Broquin; Christoph M. Greiner. International Society for Optics and Photonics SPIE, 2009. 72180O (Proceedings of SPIE, Vol. 7218).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AB - Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench. (14 refs.)

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Aalto T, Harjanne M, Kapulainen M, Ylinen S, Ollila J, Vilokkinen V et al. Integration of InP-based optoelectronics with silicon waveguides. In Broquin J-E, Greiner CM, editors, Integrated Optics: Devices, Materials, and Technologies XIII. International Society for Optics and Photonics SPIE. 2009. 72180O. (Proceedings of SPIE, Vol. 7218). https://doi.org/10.1117/12.808129