Integration of InP-based optoelectronics with silicon waveguides

Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, Jyrki Ollila, Ville Vilokkinen, Ludwig Mörl, Martin Möhrle, Régis Hamelin

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    12 Citations (Scopus)

    Abstract

    Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench. (14 refs.)
    Original languageEnglish
    Title of host publicationIntegrated Optics
    Subtitle of host publicationDevices, Materials, and Technologies XIII
    EditorsJean-Emmanuel Broquin, Christoph M. Greiner
    PublisherInternational Society for Optics and Photonics SPIE
    Number of pages14
    ISBN (Print)978-0-8194-7464-3
    DOIs
    Publication statusPublished - 2009
    MoE publication typeA4 Article in a conference publication
    EventIntegrated Optics: Devices, Materials, and Technologies XIII - San Jose, United States
    Duration: 26 Jan 200926 Jan 2009

    Publication series

    SeriesProceedings of SPIE
    Volume7218
    ISSN0277-786X

    Conference

    ConferenceIntegrated Optics: Devices, Materials, and Technologies XIII
    CountryUnited States
    CitySan Jose
    Period26/01/0926/01/09

    Fingerprint

    chips
    waveguides
    insulators
    silicon
    laser arrays
    integrated optics
    seats
    indium
    platforms
    costs
    detectors

    Cite this

    Aalto, T., Harjanne, M., Kapulainen, M., Ylinen, S., Ollila, J., Vilokkinen, V., ... Hamelin, R. (2009). Integration of InP-based optoelectronics with silicon waveguides. In J-E. Broquin, & C. M. Greiner (Eds.), Integrated Optics: Devices, Materials, and Technologies XIII [72180O] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 7218 https://doi.org/10.1117/12.808129
    Aalto, Timo ; Harjanne, Mikko ; Kapulainen, Markku ; Ylinen, Sami ; Ollila, Jyrki ; Vilokkinen, Ville ; Mörl, Ludwig ; Möhrle, Martin ; Hamelin, Régis. / Integration of InP-based optoelectronics with silicon waveguides. Integrated Optics: Devices, Materials, and Technologies XIII. editor / Jean-Emmanuel Broquin ; Christoph M. Greiner. International Society for Optics and Photonics SPIE, 2009. (Proceedings of SPIE, Vol. 7218).
    @inproceedings{ed2b6d412ef847cabe40168b4c179709,
    title = "Integration of InP-based optoelectronics with silicon waveguides",
    abstract = "Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench. (14 refs.)",
    author = "Timo Aalto and Mikko Harjanne and Markku Kapulainen and Sami Ylinen and Jyrki Ollila and Ville Vilokkinen and Ludwig M{\"o}rl and Martin M{\"o}hrle and R{\'e}gis Hamelin",
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    Aalto, T, Harjanne, M, Kapulainen, M, Ylinen, S, Ollila, J, Vilokkinen, V, Mörl, L, Möhrle, M & Hamelin, R 2009, Integration of InP-based optoelectronics with silicon waveguides. in J-E Broquin & CM Greiner (eds), Integrated Optics: Devices, Materials, and Technologies XIII., 72180O, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 7218, Integrated Optics: Devices, Materials, and Technologies XIII, San Jose, United States, 26/01/09. https://doi.org/10.1117/12.808129

    Integration of InP-based optoelectronics with silicon waveguides. / Aalto, Timo; Harjanne, Mikko; Kapulainen, Markku; Ylinen, Sami; Ollila, Jyrki; Vilokkinen, Ville; Mörl, Ludwig; Möhrle, Martin; Hamelin, Régis.

    Integrated Optics: Devices, Materials, and Technologies XIII. ed. / Jean-Emmanuel Broquin; Christoph M. Greiner. International Society for Optics and Photonics SPIE, 2009. 72180O (Proceedings of SPIE, Vol. 7218).

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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    AU - Aalto, Timo

    AU - Harjanne, Mikko

    AU - Kapulainen, Markku

    AU - Ylinen, Sami

    AU - Ollila, Jyrki

    AU - Vilokkinen, Ville

    AU - Mörl, Ludwig

    AU - Möhrle, Martin

    AU - Hamelin, Régis

    N1 - CA2: TK602 CA2: TK604

    PY - 2009

    Y1 - 2009

    N2 - Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench. (14 refs.)

    AB - Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench. (14 refs.)

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    M3 - Conference article in proceedings

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    A2 - Broquin, Jean-Emmanuel

    A2 - Greiner, Christoph M.

    PB - International Society for Optics and Photonics SPIE

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    Aalto T, Harjanne M, Kapulainen M, Ylinen S, Ollila J, Vilokkinen V et al. Integration of InP-based optoelectronics with silicon waveguides. In Broquin J-E, Greiner CM, editors, Integrated Optics: Devices, Materials, and Technologies XIII. International Society for Optics and Photonics SPIE. 2009. 72180O. (Proceedings of SPIE, Vol. 7218). https://doi.org/10.1117/12.808129