Integration of optical interconnects on circuit board

Mikko Karppinen, Teemu Alajoki, Pentti Karioja, Nina Hendrickx, Geert Van Steenberge, Peter Van Daele, Jurgen Van Erps, Christof Debaes, Hugo Thienpont, Samuel Obi, Marika Immonen, Jorma Kivilahti, Alexei Glebov

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides are
studied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.
Original languageEnglish
Title of host publication13th MicroOptics Conference, MOC'07
Pages94-97
Number of pages4
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event13th MicroOptics Conference, MOC'07 - Takamatsu, Kagawa, Japan
Duration: 28 Oct 200731 Oct 2007
Conference number: 13

Conference

Conference13th MicroOptics Conference, MOC'07
Abbreviated titleMOC'07
CountryJapan
CityTakamatsu, Kagawa
Period28/10/0731/10/07

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