Integration of optical interconnects on circuit board

Mikko Karppinen, Teemu Alajoki, Pentti Karioja, Nina Hendrickx, Geert Van Steenberge, Peter Van Daele, Jurgen Van Erps, Christof Debaes, Hugo Thienpont, Samuel Obi, Marika Immonen, Jorma Kivilahti, Alexei Glebov

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review


    Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides are
    studied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.
    Original languageEnglish
    Title of host publication13th MicroOptics Conference, MOC'07
    Number of pages4
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication
    Event13th MicroOptics Conference, MOC'07 - Takamatsu, Kagawa, Japan
    Duration: 28 Oct 200731 Oct 2007
    Conference number: 13


    Conference13th MicroOptics Conference, MOC'07
    Abbreviated titleMOC'07
    CityTakamatsu, Kagawa


    Dive into the research topics of 'Integration of optical interconnects on circuit board'. Together they form a unique fingerprint.

    Cite this