Abstract
studied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.
| Original language | English |
|---|---|
| Title of host publication | 13th MicroOptics Conference, MOC'07 |
| Pages | 94-97 |
| Number of pages | 4 |
| Publication status | Published - 2007 |
| MoE publication type | A4 Article in a conference publication |
| Event | 13th MicroOptics Conference, MOC'07 - Takamatsu, Kagawa, Japan Duration: 28 Oct 2007 → 31 Oct 2007 Conference number: 13 |
Conference
| Conference | 13th MicroOptics Conference, MOC'07 |
|---|---|
| Abbreviated title | MOC'07 |
| Country | Japan |
| City | Takamatsu, Kagawa |
| Period | 28/10/07 → 31/10/07 |
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Integration of optical interconnects on circuit board. / Karppinen, Mikko; Alajoki, Teemu; Karioja, Pentti; Hendrickx, Nina; Van Steenberge, Geert; Van Daele, Peter; Van Erps, Jurgen; Debaes, Christof; Thienpont, Hugo; Obi, Samuel; Immonen, Marika; Kivilahti, Jorma; Glebov, Alexei.
13th MicroOptics Conference, MOC'07. 2007. p. 94-97.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Integration of optical interconnects on circuit board
AU - Karppinen, Mikko
AU - Alajoki, Teemu
AU - Karioja, Pentti
AU - Hendrickx, Nina
AU - Van Steenberge, Geert
AU - Van Daele, Peter
AU - Van Erps, Jurgen
AU - Debaes, Christof
AU - Thienpont, Hugo
AU - Obi, Samuel
AU - Immonen, Marika
AU - Kivilahti, Jorma
AU - Glebov, Alexei
PY - 2007
Y1 - 2007
N2 - Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides arestudied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.
AB - Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides arestudied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.
M3 - Conference article in proceedings
SP - 94
EP - 97
BT - 13th MicroOptics Conference, MOC'07
ER -