Integration of optical interconnects on circuit board

Mikko Karppinen; Teemu Alajoki; Pentti Karioja; Nina Hendrickx; Geert Van Steenberge; Peter Van Daele; Jurgen Van Erps; Christof Debaes; Hugo Thienpont; Samuel Obi; Marika Immonen; Jorma Kivilahti; Alexei Glebov

Integration of optical interconnects on circuit board

Mikko Karppinen, Teemu Alajoki, Pentti Karioja, Nina Hendrickx, Geert Van Steenberge, Peter Van Daele, Jurgen Van Erps, Christof Debaes, Hugo Thienpont, Samuel Obi, Marika Immonen, Jorma Kivilahti, Alexei Glebov

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides are
studied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.

Original language	English
Title of host publication	13th MicroOptics Conference, MOC'07
Pages	94-97
Number of pages	4
Publication status	Published - 2007
MoE publication type	A4 Article in a conference publication
Event	13th MicroOptics Conference, MOC'07 - Takamatsu, Kagawa, Japan Duration: 28 Oct 2007 → 31 Oct 2007 Conference number: 13

Conference

Conference	13th MicroOptics Conference, MOC'07
Abbreviated title	MOC'07
Country/Territory	Japan
City	Takamatsu, Kagawa
Period	28/10/07 → 31/10/07

Cite this

@inproceedings{ff804cdffe664b4d80803758328b64e7,

title = "Integration of optical interconnects on circuit board",

abstract = "Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides arestudied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.",

author = "Mikko Karppinen and Teemu Alajoki and Pentti Karioja and Nina Hendrickx and {Van Steenberge}, Geert and {Van Daele}, Peter and {Van Erps}, Jurgen and Christof Debaes and Hugo Thienpont and Samuel Obi and Marika Immonen and Jorma Kivilahti and Alexei Glebov",

year = "2007",

language = "English",

pages = "94--97",

booktitle = "13th MicroOptics Conference, MOC'07",

note = "13th MicroOptics Conference, MOC'07, MOC'07 ; Conference date: 28-10-2007 Through 31-10-2007",

}

TY - GEN

T1 - Integration of optical interconnects on circuit board

AU - Karppinen, Mikko

AU - Alajoki, Teemu

AU - Karioja, Pentti

AU - Hendrickx, Nina

AU - Van Steenberge, Geert

AU - Van Daele, Peter

AU - Van Erps, Jurgen

AU - Debaes, Christof

AU - Thienpont, Hugo

AU - Obi, Samuel

AU - Immonen, Marika

AU - Kivilahti, Jorma

AU - Glebov, Alexei

N1 - Conference code: 13

PY - 2007

Y1 - 2007

N2 - Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides arestudied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.

AB - Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides arestudied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.

M3 - Conference article in proceedings

SP - 94

EP - 97

BT - 13th MicroOptics Conference, MOC'07

T2 - 13th MicroOptics Conference, MOC'07

Y2 - 28 October 2007 through 31 October 2007

ER -

Integration of optical interconnects on circuit board

Abstract

Conference

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