Abstract
Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides are
studied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.
studied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.
Original language | English |
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Title of host publication | 13th MicroOptics Conference, MOC'07 |
Pages | 94-97 |
Number of pages | 4 |
Publication status | Published - 2007 |
MoE publication type | A4 Article in a conference publication |
Event | 13th MicroOptics Conference, MOC'07 - Takamatsu, Kagawa, Japan Duration: 28 Oct 2007 → 31 Oct 2007 Conference number: 13 |
Conference
Conference | 13th MicroOptics Conference, MOC'07 |
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Abbreviated title | MOC'07 |
Country/Territory | Japan |
City | Takamatsu, Kagawa |
Period | 28/10/07 → 31/10/07 |