Integration of optical interconnects on circuit board

Mikko Karppinen, Teemu Alajoki, Pentti Karioja, Nina Hendrickx, Geert Van Steenberge, Peter Van Daele, Jurgen Van Erps, Christof Debaes, Hugo Thienpont, Samuel Obi, Marika Immonen, Jorma Kivilahti, Alexei Glebov

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides are
studied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.
Original languageEnglish
Title of host publication13th MicroOptics Conference, MOC'07
Pages94-97
Number of pages4
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event13th MicroOptics Conference, MOC'07 - Takamatsu, Kagawa, Japan
Duration: 28 Oct 200731 Oct 2007
Conference number: 13

Conference

Conference13th MicroOptics Conference, MOC'07
Abbreviated titleMOC'07
CountryJapan
CityTakamatsu, Kagawa
Period28/10/0731/10/07

Fingerprint

optical interconnects
circuit boards
waveguides
transmitter receivers
printed circuits
packaging
optical waveguides
laser ablation
integrated circuits
communication
alignment
ceramics
polymers

Cite this

Karppinen, M., Alajoki, T., Karioja, P., Hendrickx, N., Van Steenberge, G., Van Daele, P., ... Glebov, A. (2007). Integration of optical interconnects on circuit board. In 13th MicroOptics Conference, MOC'07 (pp. 94-97)
Karppinen, Mikko ; Alajoki, Teemu ; Karioja, Pentti ; Hendrickx, Nina ; Van Steenberge, Geert ; Van Daele, Peter ; Van Erps, Jurgen ; Debaes, Christof ; Thienpont, Hugo ; Obi, Samuel ; Immonen, Marika ; Kivilahti, Jorma ; Glebov, Alexei. / Integration of optical interconnects on circuit board. 13th MicroOptics Conference, MOC'07. 2007. pp. 94-97
@inproceedings{ff804cdffe664b4d80803758328b64e7,
title = "Integration of optical interconnects on circuit board",
abstract = "Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides arestudied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.",
author = "Mikko Karppinen and Teemu Alajoki and Pentti Karioja and Nina Hendrickx and {Van Steenberge}, Geert and {Van Daele}, Peter and {Van Erps}, Jurgen and Christof Debaes and Hugo Thienpont and Samuel Obi and Marika Immonen and Jorma Kivilahti and Alexei Glebov",
year = "2007",
language = "English",
pages = "94--97",
booktitle = "13th MicroOptics Conference, MOC'07",

}

Karppinen, M, Alajoki, T, Karioja, P, Hendrickx, N, Van Steenberge, G, Van Daele, P, Van Erps, J, Debaes, C, Thienpont, H, Obi, S, Immonen, M, Kivilahti, J & Glebov, A 2007, Integration of optical interconnects on circuit board. in 13th MicroOptics Conference, MOC'07. pp. 94-97, 13th MicroOptics Conference, MOC'07, Takamatsu, Kagawa, Japan, 28/10/07.

Integration of optical interconnects on circuit board. / Karppinen, Mikko; Alajoki, Teemu; Karioja, Pentti; Hendrickx, Nina; Van Steenberge, Geert; Van Daele, Peter; Van Erps, Jurgen; Debaes, Christof; Thienpont, Hugo; Obi, Samuel; Immonen, Marika; Kivilahti, Jorma; Glebov, Alexei.

13th MicroOptics Conference, MOC'07. 2007. p. 94-97.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Integration of optical interconnects on circuit board

AU - Karppinen, Mikko

AU - Alajoki, Teemu

AU - Karioja, Pentti

AU - Hendrickx, Nina

AU - Van Steenberge, Geert

AU - Van Daele, Peter

AU - Van Erps, Jurgen

AU - Debaes, Christof

AU - Thienpont, Hugo

AU - Obi, Samuel

AU - Immonen, Marika

AU - Kivilahti, Jorma

AU - Glebov, Alexei

PY - 2007

Y1 - 2007

N2 - Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides arestudied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.

AB - Hybrid integration of polymer-based micro-optical technologies allows implementing high-bit-rate optoelectronic interconnects. The target is communication between surface-mounted integrated circuit packages on printed circuit board through embedded optical waveguides. Different kinds of optical elements for coupling between transmitters/receivers and waveguides arestudied, including microlens arrays, microlenses integrated on VCSELs, surface-mountable beam deflecting elements, optical pillar structures, and waveguide structures patterned by laser ablation. Integration experiments by the use of ceramic packaging substrate as well as results of the coupling efficiency and alignment tolerance characterizations are presented.

M3 - Conference article in proceedings

SP - 94

EP - 97

BT - 13th MicroOptics Conference, MOC'07

ER -

Karppinen M, Alajoki T, Karioja P, Hendrickx N, Van Steenberge G, Van Daele P et al. Integration of optical interconnects on circuit board. In 13th MicroOptics Conference, MOC'07. 2007. p. 94-97