Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards

Marika P. Immonen (Corresponding Author), Mikko Karppinen, Jorma K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    15 Citations (Scopus)

    Abstract

    In this paper, the effects of environmental stresses on the properties of polymeric optical waveguides were investigated. Optical multimode waveguides were embedded on printed circuit boards by employing commercial polymers. Three optical-PCB constructions varying in board structure and in optical build-up materials were compared. The guide systems were subjected to four different tests: damp heat-high humidity, isothermal annealing, thermal shock and environmental flowing multigas test. Isothermal annealing reduced the refractive index to greatest extent. The optical-PCB structure with optical surface build-up layer was observed to be more vulnerable under temperature shock when compared with the O-PCB with optical inner layer. The buffer layer beneath the optical build-up was found to improve the stability of the optical waveguides significantly. The results indicated of a wavelength dependence to the aging factor with a failure mechanism. The factors affecting the performance and reliability of polymer-based optical waveguides on PCBs were discussed.
    Original languageEnglish
    Pages (from-to)363-371
    JournalMicroelectronics Reliability
    Volume47
    Issue number2-3
    DOIs
    Publication statusPublished - 2007
    MoE publication typeA1 Journal article-refereed

    Keywords

    • polymers
    • optical waveguides
    • interconnections
    • circuits

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