Abstract
Recess test structures are utilized in the investigation
of the bonding energy of the plasma activated uncoated
and SiO 2 coated silicon wafers. The scanning acoustic
microscope images are compared with the values obtained
from the crack opening measurements
Original language | English |
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Title of host publication | Proceedings |
Subtitle of host publication | 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
ISBN (Electronic) | 978-1-4673-0742-0 |
ISBN (Print) | 978-1-4673-0743-7 |
DOIs | |
Publication status | Published - 2012 |
MoE publication type | Not Eligible |
Event | 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan Duration: 22 May 2012 → 23 May 2012 |
Conference
Conference | 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 |
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Abbreviated title | LTB-3D 2012 |
Country/Territory | Japan |
City | Tokyo |
Period | 22/05/12 → 23/05/12 |