Ketterät modulaariset elektroniikan loppukokoonpanojärjestelmät - LASSI teknologiaohjelman SEMI-hanke

Translated title of the contribution: Agile modular final assembly systems in electronic industry - LASSI program SEMI project

Research output: Contribution to conference › Conference article › Professional

Translated title of the contribution	Agile modular final assembly systems in electronic industry - LASSI program SEMI project
Original language	Finnish
Number of pages	5
Publication status	Published - 2000
MoE publication type	Not Eligible
Event	Konepajatekniikan jatko-opintopäivät - Espoo, Finland Duration: 4 Apr 2000 → 4 Apr 2000

Seminar	Konepajatekniikan jatko-opintopäivät
Country/Territory	Finland
City	Espoo
Period	4/04/00 → 4/04/00

Cite this

@conference{64f8a86d097e4600baf8a3b482f04599,

title = "Ketter{\"a}t modulaariset elektroniikan loppukokoonpanoj{\"a}rjestelm{\"a}t - LASSI teknologiaohjelman SEMI-hanke",

author = "Juhani Heilala and Paavo Voho",

note = "HUO: VAL75 Project code: V9SU01006; Konepajatekniikan jatko-opintop{\"a}iv{\"a}t ; Conference date: 04-04-2000 Through 04-04-2000",

year = "2000",

language = "Finnish",

}