Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers

M.R.J. Palosaari, L. Grönberg, K.M. Kinnunen, D. Gunnarsson, M. Prunnila, I.J. Maasilta

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)

Abstract

We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.
Original languageEnglish
Article number2100304
JournalIEEE Transactions on Applied Superconductivity
Volume25
Issue number3
DOIs
Publication statusPublished - 2015
MoE publication typeA1 Journal article-refereed

Fingerprint

Sensor arrays
Pixels
pixels
X rays
sensors
Gold
x rays
Fabrication
time constant
Geometry
proximity
absorbers
critical temperature
Sensors
Processing
wafers
gold
slopes
fabrication
geometry

Keywords

  • nanosensors
  • superconducting devices
  • X-ray spectroscopy
  • large format arrays
  • critical temperatures
  • materials analysis

Cite this

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title = "Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers",
abstract = "We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.",
keywords = "nanosensors, superconducting devices, X-ray spectroscopy, large format arrays, critical temperatures, materials analysis",
author = "M.R.J. Palosaari and L. Gr{\"o}nberg and K.M. Kinnunen and D. Gunnarsson and M. Prunnila and I.J. Maasilta",
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doi = "10.1109/TASC.2014.2366641",
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journal = "IEEE Transactions on Applied Superconductivity",
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publisher = "IEEE Institute of Electrical and Electronic Engineers",
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Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers. / Palosaari, M.R.J.; Grönberg, L.; Kinnunen, K.M.; Gunnarsson, D.; Prunnila, M.; Maasilta, I.J.

In: IEEE Transactions on Applied Superconductivity, Vol. 25, No. 3, 2100304, 2015.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers

AU - Palosaari, M.R.J.

AU - Grönberg, L.

AU - Kinnunen, K.M.

AU - Gunnarsson, D.

AU - Prunnila, M.

AU - Maasilta, I.J.

PY - 2015

Y1 - 2015

N2 - We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.

AB - We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.

KW - nanosensors

KW - superconducting devices

KW - X-ray spectroscopy

KW - large format arrays

KW - critical temperatures

KW - materials analysis

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DO - 10.1109/TASC.2014.2366641

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