Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers

M.R.J. Palosaari; L. Grönberg; K.M. Kinnunen; D. Gunnarsson; M. Prunnila; I.J. Maasilta

doi:10.1109/TASC.2014.2366641

Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers

M.R.J. Palosaari, L. Grönberg, K.M. Kinnunen, D. Gunnarsson, M. Prunnila, I.J. Maasilta

Research output: Contribution to journal › Article › Scientific › peer-review

3 Citations (Scopus)

Abstract

We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.

Original language	English
Article number	2100304
Journal	IEEE Transactions on Applied Superconductivity
Volume	25
Issue number	3
DOIs	https://doi.org/10.1109/TASC.2014.2366641
Publication status	Published - 2015
MoE publication type	A1 Journal article-refereed

Keywords

nanosensors
superconducting devices
X-ray spectroscopy
large format arrays
critical temperatures
materials analysis

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abstract = "We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.",

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AU - Palosaari, M.R.J.

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AU - Gunnarsson, D.

AU - Prunnila, M.

AU - Maasilta, I.J.

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KW - X-ray spectroscopy

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KW - critical temperatures

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