Abstract
We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 μm. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.
Original language | English |
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Article number | 2100304 |
Journal | IEEE Transactions on Applied Superconductivity |
Volume | 25 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2015 |
MoE publication type | A1 Journal article-refereed |
Keywords
- nanosensors
- superconducting devices
- X-ray spectroscopy
- large format arrays
- critical temperatures
- materials analysis