Abstract
| Original language | English |
|---|---|
| Article number | 2100304 |
| Journal | IEEE Transactions on Applied Superconductivity |
| Volume | 25 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2015 |
| MoE publication type | A1 Journal article-refereed |
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Keywords
- nanosensors
- superconducting devices
- X-ray spectroscopy
- large format arrays
- critical temperatures
- materials analysis
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Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers. / Palosaari, M.R.J.; Grönberg, L.; Kinnunen, K.M.; Gunnarsson, D.; Prunnila, M.; Maasilta, I.J.
In: IEEE Transactions on Applied Superconductivity, Vol. 25, No. 3, 2100304, 2015.Research output: Contribution to journal › Article › Scientific › peer-review
TY - JOUR
T1 - Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers
AU - Palosaari, M.R.J.
AU - Grönberg, L.
AU - Kinnunen, K.M.
AU - Gunnarsson, D.
AU - Prunnila, M.
AU - Maasilta, I.J.
PY - 2015
Y1 - 2015
N2 - We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.
AB - We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.
KW - nanosensors
KW - superconducting devices
KW - X-ray spectroscopy
KW - large format arrays
KW - critical temperatures
KW - materials analysis
U2 - 10.1109/TASC.2014.2366641
DO - 10.1109/TASC.2014.2366641
M3 - Article
VL - 25
JO - IEEE Transactions on Applied Superconductivity
JF - IEEE Transactions on Applied Superconductivity
SN - 1051-8223
IS - 3
M1 - 2100304
ER -