Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers

M.R.J. Palosaari, L. Grönberg, K.M. Kinnunen, D. Gunnarsson, M. Prunnila, I.J. Maasilta

    Research output: Contribution to journalArticleScientificpeer-review

    3 Citations (Scopus)

    Abstract

    We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.
    Original languageEnglish
    Article number2100304
    JournalIEEE Transactions on Applied Superconductivity
    Volume25
    Issue number3
    DOIs
    Publication statusPublished - 2015
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Sensor arrays
    Pixels
    pixels
    X rays
    sensors
    Gold
    x rays
    Fabrication
    time constant
    Geometry
    proximity
    absorbers
    critical temperature
    Sensors
    Processing
    wafers
    gold
    slopes
    fabrication
    geometry

    Keywords

    • nanosensors
    • superconducting devices
    • X-ray spectroscopy
    • large format arrays
    • critical temperatures
    • materials analysis

    Cite this

    @article{f035b20b6228445d8138f4f1e5a38386,
    title = "Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers",
    abstract = "We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.",
    keywords = "nanosensors, superconducting devices, X-ray spectroscopy, large format arrays, critical temperatures, materials analysis",
    author = "M.R.J. Palosaari and L. Gr{\"o}nberg and K.M. Kinnunen and D. Gunnarsson and M. Prunnila and I.J. Maasilta",
    year = "2015",
    doi = "10.1109/TASC.2014.2366641",
    language = "English",
    volume = "25",
    journal = "IEEE Transactions on Applied Superconductivity",
    issn = "1051-8223",
    publisher = "IEEE Institute of Electrical and Electronic Engineers",
    number = "3",

    }

    Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers. / Palosaari, M.R.J.; Grönberg, L.; Kinnunen, K.M.; Gunnarsson, D.; Prunnila, M.; Maasilta, I.J.

    In: IEEE Transactions on Applied Superconductivity, Vol. 25, No. 3, 2100304, 2015.

    Research output: Contribution to journalArticleScientificpeer-review

    TY - JOUR

    T1 - Large 256-pixel X-ray transition-edge sensor arrays with Mo/TiW/Cu trilayers

    AU - Palosaari, M.R.J.

    AU - Grönberg, L.

    AU - Kinnunen, K.M.

    AU - Gunnarsson, D.

    AU - Prunnila, M.

    AU - Maasilta, I.J.

    PY - 2015

    Y1 - 2015

    N2 - We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.

    AB - We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 $muhbox{m>. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.

    KW - nanosensors

    KW - superconducting devices

    KW - X-ray spectroscopy

    KW - large format arrays

    KW - critical temperatures

    KW - materials analysis

    U2 - 10.1109/TASC.2014.2366641

    DO - 10.1109/TASC.2014.2366641

    M3 - Article

    VL - 25

    JO - IEEE Transactions on Applied Superconductivity

    JF - IEEE Transactions on Applied Superconductivity

    SN - 1051-8223

    IS - 3

    M1 - 2100304

    ER -