In this study, large-area dielectric breakdown performances of various bi-axially oriented polypropylene (BOPP)-silica nanocomposite films are studied by utilizing the self-healing multi-breakdown method presented in the Part I of this publication. In particular, the effects of silica filler content, pre-mixing method, co-stabilizer content and film processing on the large-area breakdown performance are analyzed. Nanostructural and film cross-sectional analyses are correlated to the breakdown responses. The optimum silica filler content is found to reside at the low fill fraction level (~1 wt-%) and automatic pre-mixing of the raw materials and the optimization of the orientation temperature are found to be preferable. The co-stabilizer Irgafos 168 is found to have a significant effect on the breakdown distribution homogeneity of the reference BOPP films. The breakdown response of the silica nanocomposites is found to be not only dependent on the active measurement area but also on the voltage ramp rate, indicating that the silica nanocomposites exhibit altered internal charge behavior under DC electric field. The area- and ramp-rate-dependence results exemplify the importance of careful breakdown strength evaluation of dielectric polymer nanocomposites. Above all, the results emphasize the fact that a thorough understanding and the optimization of the film processing parameters are crucial for achieving improved breakdown response in dielectric polymer nanocomposite films.
|Journal||IEEE Transactions on Dielectrics and Electrical Insulation|
|Publication status||Published - 2015|
|MoE publication type||A1 Journal article-refereed|
- dielectric polymer nanocomposite
- film processing
- breakdown performance
Rytöluoto, I., Lahti, K., Karttunen, M., Koponen, M., Virtanen, S., & Pettersson, M. (2015). Large-area dielectric breakdown performance of polymer films: Part II: Interdependence of filler content, processing and breakdown performance in polypropylene-silica nanocomposites. IEEE Transactions on Dielectrics and Electrical Insulation, 22(4), 2196-2206. https://doi.org/10.1109/TDEI.2015.004764