Abstract
Roll-to-roll compatible processes are opening up the new
opportunity for high throughput and cost-efficient
manufacturing of electronics and other required
functionalities. Extending the continuous roll-to-roll
manufacturing approach as far as possible in the
manufacturing process to assembly and bonding, the manual
assembly and handling phases can be almost fully
eliminated. Modern assembly and bonding machines, such as
EVO2200, enable component bonding on flexible substrates
in high throughput roll-to-roll process using anisotropic
conductive adhesives (ACAs).
Original language | English |
---|---|
Title of host publication | Electronic System-Integration Technology Conference (ESTC), 2016 6th |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 1-5 |
ISBN (Electronic) | 978-1-5090-1402-6 |
ISBN (Print) | 978-15090-1403-3 |
DOIs | |
Publication status | Published - 5 Dec 2016 |
MoE publication type | A4 Article in a conference publication |
Event | 6th Electronic System-Integration Technology Conference, ESTC 2016 - Grenoble, France Duration: 13 Sept 2016 → 16 Sept 2016 Conference number: 6 |
Conference
Conference | 6th Electronic System-Integration Technology Conference, ESTC 2016 |
---|---|
Abbreviated title | ESTC 2016 |
Country/Territory | France |
City | Grenoble |
Period | 13/09/16 → 16/09/16 |
Keywords
- lighting
- light emitting diodes
- brightness
- color
- mobile handsets
- bonding