Laser cutting of paper

Jari Hovikorpi, Petri Laakso, Heidi Malmberg, Veli Kujanpää, Nina Miikki

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    It is commonly known that CO2 laser beam is suitable for paper and board cutting. However there exists quite little published research work about paper cutting with laser. Lasers at paper industry are mainly used to different perforating and scoring applications. There exists only few paper slitting applications. Water jet cutting is widely used edge trimming applications at paper plants. Laser cutting could be substation process for water jet cutting.

    This paper concentrates on understanding parameters that are characteristic to the laser cuttability of coated and uncoated papers. Also economical aspects, for edge trimming of paper web, are studied. This study was performed within a national project in Finland about laser cutting of pulps, papers and boards. The research was carried out with a Trumpf 2.7 kW HQ laser and a work cell designed and manufactured for the project.

    The cutting experiments contained the cutting tests of how different laser parameters like power, focal point position, and focal length affected the cutting speed and the cut edge quality. Papers used in study could be laser cut with acceptable quality. Highest cutting speeds were noted with 127 mm focal length. It was also found that the cut edge quality and kerf width were stable for each grammage and paper types produced with parameter combinations on cutting limit (laser power/cutting speed).
    Original languageEnglish
    Title of host publicationICALEO 2004: 23rd International Congress on Laser Materials Processing and Laser Microfabrication
    PublisherLaser Institute of America
    Number of pages11
    ISBN (Print)978-0-912035-77-2
    DOIs
    Publication statusPublished - 2004
    MoE publication typeA4 Article in a conference publication
    Event23rd International Congress on Applications of Lasers and Electro-Optics, ICALEO 2004 - San Francisco, United States
    Duration: 4 Oct 20047 Oct 2004
    Conference number: 23

    Conference

    Conference23rd International Congress on Applications of Lasers and Electro-Optics, ICALEO 2004
    Abbreviated titleICALEO 2004
    CountryUnited States
    CitySan Francisco
    Period4/10/047/10/04

    Fingerprint Dive into the research topics of 'Laser cutting of paper'. Together they form a unique fingerprint.

  • Cite this

    Hovikorpi, J., Laakso, P., Malmberg, H., Kujanpää, V., & Miikki, N. (2004). Laser cutting of paper. In ICALEO 2004: 23rd International Congress on Laser Materials Processing and Laser Microfabrication Laser Institute of America. https://doi.org/10.2351/1.5060256