@inproceedings{4dd8792a4b97457d8e180a2abfe43ade,
title = "Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology",
abstract = "Silicon photonics is a rapidly growing R&D field where universities, institutes and companies are all involved and the business expectations for the next few years are high. One of the key enabling elements that led to the present success of silicon photonics is ePIXfab. It is a consortium of institutes that has together offered multi-project wafer (MPW) runs, packaging services, training, and feasibility studies. These services have significantly lowered the barrier of various research groups and companies to start developing silicon photonics. Until now the MPW services have been offered by the ePIXfab partners IMEC, CEA-Leti and IHP, which all use CMOS-type silicon photonics technology with a typical silicon-on-insulator (SOI) waveguide thickness of 220 nm. In November 2013 this MPW offering was expanded by the ePIXfab partner VTT that opened the access to its 3 µm SOI waveguide platform via ePIXfab MPW runs. This technology platform is complementary to the mainstream silicon photonics technology (220 nm) and it offers such benefits as very low losses, small polarization dependency, ultrabroadband operation and low starting costs.",
keywords = "silicon photonics, waveguides, packaging, polarization, multi-project wafers, silicion-on-insulators",
author = "Timo Aalto and Matteo Cherchi and Mikko Harjanne and Sami Ylinen and Markku Kapulainen and Tapani Vehmas",
note = "CA2: BA1124; Silicon Photonics IX ; Conference date: 03-02-2014 Through 05-02-2014",
year = "2014",
doi = "10.1117/12.2038989",
language = "English",
isbn = "978-081949903-5",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
booktitle = "SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials",
address = "United States",
}