Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

Abstract

Silicon photonics is a rapidly growing R&D field where universities, institutes and companies are all involved and the business expectations for the next few years are high. One of the key enabling elements that led to the present success of silicon photonics is ePIXfab. It is a consortium of institutes that has together offered multi-project wafer (MPW) runs, packaging services, training, and feasibility studies. These services have significantly lowered the barrier of various research groups and companies to start developing silicon photonics. Until now the MPW services have been offered by the ePIXfab partners IMEC, CEA-Leti and IHP, which all use CMOS-type silicon photonics technology with a typical silicon-on-insulator (SOI) waveguide thickness of 220 nm. In November 2013 this MPW offering was expanded by the ePIXfab partner VTT that opened the access to its 3 µm SOI waveguide platform via ePIXfab MPW runs. This technology platform is complementary to the mainstream silicon photonics technology (220 nm) and it offers such benefits as very low losses, small polarization dependency, ultrabroadband operation and low starting costs.
Original languageEnglish
Title of host publicationSPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials
PublisherInternational Society for Optics and Photonics SPIE
ISBN (Print)978-081949903-5
DOIs
Publication statusPublished - 2014
MoE publication typeA4 Article in a conference publication
EventSilicon Photonics IX - San Francisco, United States
Duration: 3 Feb 20145 Feb 2014

Publication series

SeriesProceedings of SPIE
Volume8990

Conference

ConferenceSilicon Photonics IX
CountryUnited States
CitySan Francisco
Period3/02/145/02/14

Fingerprint

launching
wafers
waveguides
silicon
photonics
platforms
insulators
packaging
CMOS
education
costs
polarization

Keywords

  • silicon photonics
  • waveguides
  • packaging
  • polarization
  • multi-project wafers
  • silicion-on-insulators

Cite this

Aalto, T., Cherchi, M., Harjanne, M., Ylinen, S., Kapulainen, M., & Vehmas, T. (2014). Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology. In SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials [899003] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 8990 https://doi.org/10.1117/12.2038989
Aalto, Timo ; Cherchi, Matteo ; Harjanne, Mikko ; Ylinen, Sami ; Kapulainen, Markku ; Vehmas, Tapani. / Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology. SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials. International Society for Optics and Photonics SPIE, 2014. (Proceedings of SPIE, Vol. 8990).
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Aalto, T, Cherchi, M, Harjanne, M, Ylinen, S, Kapulainen, M & Vehmas, T 2014, Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology. in SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials., 899003, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 8990, Silicon Photonics IX, San Francisco, United States, 3/02/14. https://doi.org/10.1117/12.2038989

Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology. / Aalto, Timo; Cherchi, Matteo; Harjanne, Mikko; Ylinen, Sami; Kapulainen, Markku; Vehmas, Tapani.

SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials. International Society for Optics and Photonics SPIE, 2014. 899003 (Proceedings of SPIE, Vol. 8990).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AB - Silicon photonics is a rapidly growing R&D field where universities, institutes and companies are all involved and the business expectations for the next few years are high. One of the key enabling elements that led to the present success of silicon photonics is ePIXfab. It is a consortium of institutes that has together offered multi-project wafer (MPW) runs, packaging services, training, and feasibility studies. These services have significantly lowered the barrier of various research groups and companies to start developing silicon photonics. Until now the MPW services have been offered by the ePIXfab partners IMEC, CEA-Leti and IHP, which all use CMOS-type silicon photonics technology with a typical silicon-on-insulator (SOI) waveguide thickness of 220 nm. In November 2013 this MPW offering was expanded by the ePIXfab partner VTT that opened the access to its 3 µm SOI waveguide platform via ePIXfab MPW runs. This technology platform is complementary to the mainstream silicon photonics technology (220 nm) and it offers such benefits as very low losses, small polarization dependency, ultrabroadband operation and low starting costs.

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Aalto T, Cherchi M, Harjanne M, Ylinen S, Kapulainen M, Vehmas T. Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology. In SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials. International Society for Optics and Photonics SPIE. 2014. 899003. (Proceedings of SPIE, Vol. 8990). https://doi.org/10.1117/12.2038989