Abstract
| Original language | English |
|---|---|
| Title of host publication | SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials |
| Publisher | International Society for Optics and Photonics SPIE |
| ISBN (Print) | 978-081949903-5 |
| DOIs | |
| Publication status | Published - 2014 |
| MoE publication type | A4 Article in a conference publication |
| Event | Silicon Photonics IX - San Francisco, United States Duration: 3 Feb 2014 → 5 Feb 2014 |
Publication series
| Series | Proceedings of SPIE |
|---|---|
| Volume | 8990 |
Conference
| Conference | Silicon Photonics IX |
|---|---|
| Country | United States |
| City | San Francisco |
| Period | 3/02/14 → 5/02/14 |
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Keywords
- silicon photonics
- waveguides
- packaging
- polarization
- multi-project wafers
- silicion-on-insulators
Cite this
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Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology. / Aalto, Timo; Cherchi, Matteo; Harjanne, Mikko; Ylinen, Sami; Kapulainen, Markku; Vehmas, Tapani.
SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials. International Society for Optics and Photonics SPIE, 2014. 899003 (Proceedings of SPIE, Vol. 8990).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology
AU - Aalto, Timo
AU - Cherchi, Matteo
AU - Harjanne, Mikko
AU - Ylinen, Sami
AU - Kapulainen, Markku
AU - Vehmas, Tapani
N1 - CA2: BA1124
PY - 2014
Y1 - 2014
N2 - Silicon photonics is a rapidly growing R&D field where universities, institutes and companies are all involved and the business expectations for the next few years are high. One of the key enabling elements that led to the present success of silicon photonics is ePIXfab. It is a consortium of institutes that has together offered multi-project wafer (MPW) runs, packaging services, training, and feasibility studies. These services have significantly lowered the barrier of various research groups and companies to start developing silicon photonics. Until now the MPW services have been offered by the ePIXfab partners IMEC, CEA-Leti and IHP, which all use CMOS-type silicon photonics technology with a typical silicon-on-insulator (SOI) waveguide thickness of 220 nm. In November 2013 this MPW offering was expanded by the ePIXfab partner VTT that opened the access to its 3 µm SOI waveguide platform via ePIXfab MPW runs. This technology platform is complementary to the mainstream silicon photonics technology (220 nm) and it offers such benefits as very low losses, small polarization dependency, ultrabroadband operation and low starting costs.
AB - Silicon photonics is a rapidly growing R&D field where universities, institutes and companies are all involved and the business expectations for the next few years are high. One of the key enabling elements that led to the present success of silicon photonics is ePIXfab. It is a consortium of institutes that has together offered multi-project wafer (MPW) runs, packaging services, training, and feasibility studies. These services have significantly lowered the barrier of various research groups and companies to start developing silicon photonics. Until now the MPW services have been offered by the ePIXfab partners IMEC, CEA-Leti and IHP, which all use CMOS-type silicon photonics technology with a typical silicon-on-insulator (SOI) waveguide thickness of 220 nm. In November 2013 this MPW offering was expanded by the ePIXfab partner VTT that opened the access to its 3 µm SOI waveguide platform via ePIXfab MPW runs. This technology platform is complementary to the mainstream silicon photonics technology (220 nm) and it offers such benefits as very low losses, small polarization dependency, ultrabroadband operation and low starting costs.
KW - silicon photonics
KW - waveguides
KW - packaging
KW - polarization
KW - multi-project wafers
KW - silicion-on-insulators
U2 - 10.1117/12.2038989
DO - 10.1117/12.2038989
M3 - Conference article in proceedings
SN - 978-081949903-5
T3 - Proceedings of SPIE
BT - SPIE Photonics West 2014-OPTO: Optoelectronic Devices and Materials
PB - International Society for Optics and Photonics SPIE
ER -