Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems

    Research output: Chapter in Book/Report/Conference proceedingChapter or book articleProfessional

    2 Citations (Scopus)

    Abstract

    This article presents a case study in the design of a modular semi-automated reconfigurable assembly system using life cycle cost analysis methodology. To ensure that an assembly system is appropriately designed, system measurement schemes should be established for determining and understanding design effectiveness. Understanding life cycle costs is the first step toward increasing profits. The authors are developing an analysis tool that integrates Overall Equipment Efficiency (OEE), Cost of Ownership (COO), and other analysis methods to improve the design of flexible, modular reconfigurable assembly systems. The development is based on selected industrial standards and the authors' own experience in modular assembly system design and simulation. The developed TCO (Total Cost of Ownership) methodology is useful in system supplier and end-user communication and helps in trade-off analysis of the system concepts.
    Original languageEnglish
    Title of host publicationPrecision Assembly Technologies for Mini and Micro Products
    Subtitle of host publicationProceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria
    EditorsSvetan Ratchev
    PublisherSpringer
    Pages277-286
    ISBN (Electronic)978-0-387-31277-4
    ISBN (Print)0-387-31276-5, 978-0-387-31276-7
    DOIs
    Publication statusPublished - 2006
    MoE publication typeD2 Article in professional manuals or guides or professional information systems or text book material

    Publication series

    SeriesIFIP International Federation for Information Processing
    Volume198
    ISSN1571-5736

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    Keywords

    • modular assembly system design
    • cost of ownership analysis
    • overall equipment efficiency

    Cite this

    Heilala, J., Helin, K., Montonen, J., & Väätäinen, O. (2006). Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems. In S. Ratchev (Ed.), Precision Assembly Technologies for Mini and Micro Products: Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria (pp. 277-286). Springer. IFIP International Federation for Information Processing, Vol.. 198 https://doi.org/10.1007/0-387-31277-3_26