Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems

Research output: Chapter in Book/Report/Conference proceedingChapter or book articleProfessional

2 Citations (Scopus)

Abstract

This article presents a case study in the design of a modular semi-automated reconfigurable assembly system using life cycle cost analysis methodology. To ensure that an assembly system is appropriately designed, system measurement schemes should be established for determining and understanding design effectiveness. Understanding life cycle costs is the first step toward increasing profits. The authors are developing an analysis tool that integrates Overall Equipment Efficiency (OEE), Cost of Ownership (COO), and other analysis methods to improve the design of flexible, modular reconfigurable assembly systems. The development is based on selected industrial standards and the authors' own experience in modular assembly system design and simulation. The developed TCO (Total Cost of Ownership) methodology is useful in system supplier and end-user communication and helps in trade-off analysis of the system concepts.
Original languageEnglish
Title of host publicationPrecision Assembly Technologies for Mini and Micro Products
Subtitle of host publicationProceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria
EditorsSvetan Ratchev
PublisherSpringer
Pages277-286
ISBN (Electronic)978-0-387-31277-4
ISBN (Print)0-387-31276-5, 978-0-387-31276-7
DOIs
Publication statusPublished - 2006
MoE publication typeD2 Article in professional manuals or guides or professional information systems or text book material

Publication series

SeriesIFIP International Federation for Information Processing
Volume198
ISSN1571-5736

Fingerprint

Life cycle
Costs
Profitability
Systems analysis
Communication

Keywords

  • modular assembly system design
  • cost of ownership analysis
  • overall equipment efficiency

Cite this

Heilala, J., Helin, K., Montonen, J., & Väätäinen, O. (2006). Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems. In S. Ratchev (Ed.), Precision Assembly Technologies for Mini and Micro Products: Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria (pp. 277-286). Springer. IFIP International Federation for Information Processing, Vol.. 198 https://doi.org/10.1007/0-387-31277-3_26
Heilala, Juhani ; Helin, Kaj ; Montonen, Jari ; Väätäinen, Otso. / Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems. Precision Assembly Technologies for Mini and Micro Products: Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria. editor / Svetan Ratchev. Springer, 2006. pp. 277-286 (IFIP International Federation for Information Processing, Vol. 198).
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Heilala, J, Helin, K, Montonen, J & Väätäinen, O 2006, Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems. in S Ratchev (ed.), Precision Assembly Technologies for Mini and Micro Products: Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria. Springer, IFIP International Federation for Information Processing, vol. 198, pp. 277-286. https://doi.org/10.1007/0-387-31277-3_26

Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems. / Heilala, Juhani; Helin, Kaj; Montonen, Jari; Väätäinen, Otso.

Precision Assembly Technologies for Mini and Micro Products: Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria. ed. / Svetan Ratchev. Springer, 2006. p. 277-286 (IFIP International Federation for Information Processing, Vol. 198).

Research output: Chapter in Book/Report/Conference proceedingChapter or book articleProfessional

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AB - This article presents a case study in the design of a modular semi-automated reconfigurable assembly system using life cycle cost analysis methodology. To ensure that an assembly system is appropriately designed, system measurement schemes should be established for determining and understanding design effectiveness. Understanding life cycle costs is the first step toward increasing profits. The authors are developing an analysis tool that integrates Overall Equipment Efficiency (OEE), Cost of Ownership (COO), and other analysis methods to improve the design of flexible, modular reconfigurable assembly systems. The development is based on selected industrial standards and the authors' own experience in modular assembly system design and simulation. The developed TCO (Total Cost of Ownership) methodology is useful in system supplier and end-user communication and helps in trade-off analysis of the system concepts.

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KW - cost of ownership analysis

KW - overall equipment efficiency

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Heilala J, Helin K, Montonen J, Väätäinen O. Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems. In Ratchev S, editor, Precision Assembly Technologies for Mini and Micro Products: Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS ’2006), 19–21 February 2006, Bad Hofgastein, Austria. Springer. 2006. p. 277-286. (IFIP International Federation for Information Processing, Vol. 198). https://doi.org/10.1007/0-387-31277-3_26