Low cost printed flexible multilayer substrates

Tuomo Jaakola, Markku Lahti, Jarno Petäjä, Kari Kautio, Kari Rönkä, Jaakko Lenkkeri

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

8 Citations (Scopus)

Abstract

For high-volume products low-cost techniques for multilayer polymer-based thick film wiring board manufacturing are needed. Screen-printing is a cost-efficient technology candidate to build up approximately 6 conductor layers on both sides of a flexible substrate. In order to experimentally evaluate the feasibility of screen-printing technique, the printing resolution was tested on different substrate materials, such as, polycarbonate (PC), polyethylene terephtalate (PET), polyimide (PI) and liquid crystal polymer (LCP). Conventional screen printed polymer thick film pastes were characterized on polymer substrates to form multilayer fine-line patterning and through-hole vias. The final demonstrator was a double-sided PI substrate having two conductor layers separated by dielectric layers on both sides of the substrate and through substrate vias.
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publication10th Electronics Packaging Technology Conference, EPTC 2008
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages344-349
ISBN (Print)978-1-4244-2117-6, 978-1-4244-2118-3
DOIs
Publication statusPublished - 2008
MoE publication typeA4 Article in a conference publication
Event10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
Duration: 9 Dec 200812 Dec 2008

Conference

Conference10th Electronics Packaging Technology Conference, EPTC 2008
Abbreviated titleEPTC 2008
CountrySingapore
CitySingapore
Period9/12/0812/12/08

Fingerprint

printing
polymers
polyimides
thick films
conductors
wiring
polycarbonates
polyethylenes
manufacturing
liquid crystals
costs
products

Keywords

  • flexible multilayer substrate

Cite this

Jaakola, T., Lahti, M., Petäjä, J., Kautio, K., Rönkä, K., & Lenkkeri, J. (2008). Low cost printed flexible multilayer substrates. In Proceedings: 10th Electronics Packaging Technology Conference, EPTC 2008 (pp. 344-349). Piscataway, NJ, USA: IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/EPTC.2008.4763458
Jaakola, Tuomo ; Lahti, Markku ; Petäjä, Jarno ; Kautio, Kari ; Rönkä, Kari ; Lenkkeri, Jaakko. / Low cost printed flexible multilayer substrates. Proceedings: 10th Electronics Packaging Technology Conference, EPTC 2008. Piscataway, NJ, USA : IEEE Institute of Electrical and Electronic Engineers , 2008. pp. 344-349
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Jaakola, T, Lahti, M, Petäjä, J, Kautio, K, Rönkä, K & Lenkkeri, J 2008, Low cost printed flexible multilayer substrates. in Proceedings: 10th Electronics Packaging Technology Conference, EPTC 2008. IEEE Institute of Electrical and Electronic Engineers , Piscataway, NJ, USA, pp. 344-349, 10th Electronics Packaging Technology Conference, EPTC 2008, Singapore, Singapore, 9/12/08. https://doi.org/10.1109/EPTC.2008.4763458

Low cost printed flexible multilayer substrates. / Jaakola, Tuomo; Lahti, Markku; Petäjä, Jarno; Kautio, Kari; Rönkä, Kari; Lenkkeri, Jaakko.

Proceedings: 10th Electronics Packaging Technology Conference, EPTC 2008. Piscataway, NJ, USA : IEEE Institute of Electrical and Electronic Engineers , 2008. p. 344-349.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Jaakola T, Lahti M, Petäjä J, Kautio K, Rönkä K, Lenkkeri J. Low cost printed flexible multilayer substrates. In Proceedings: 10th Electronics Packaging Technology Conference, EPTC 2008. Piscataway, NJ, USA: IEEE Institute of Electrical and Electronic Engineers . 2008. p. 344-349 https://doi.org/10.1109/EPTC.2008.4763458