Low cost printed flexible multilayer substrates

Tuomo Jaakola, Markku Lahti, Jarno Petäjä, Kari Kautio, Kari Rönkä, Jaakko Lenkkeri

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    9 Citations (Scopus)


    For high-volume products low-cost techniques for multilayer polymer-based thick film wiring board manufacturing are needed. Screen-printing is a cost-efficient technology candidate to build up approximately 6 conductor layers on both sides of a flexible substrate. In order to experimentally evaluate the feasibility of screen-printing technique, the printing resolution was tested on different substrate materials, such as, polycarbonate (PC), polyethylene terephtalate (PET), polyimide (PI) and liquid crystal polymer (LCP). Conventional screen printed polymer thick film pastes were characterized on polymer substrates to form multilayer fine-line patterning and through-hole vias. The final demonstrator was a double-sided PI substrate having two conductor layers separated by dielectric layers on both sides of the substrate and through substrate vias.
    Original languageEnglish
    Title of host publicationProceedings
    Subtitle of host publication10th Electronics Packaging Technology Conference, EPTC 2008
    Place of PublicationPiscataway, NJ, USA
    PublisherIEEE Institute of Electrical and Electronic Engineers
    ISBN (Print)978-1-4244-2117-6, 978-1-4244-2118-3
    Publication statusPublished - 2008
    MoE publication typeA4 Article in a conference publication
    Event10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
    Duration: 9 Dec 200812 Dec 2008


    Conference10th Electronics Packaging Technology Conference, EPTC 2008
    Abbreviated titleEPTC 2008


    • flexible multilayer substrate


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