Low cost printed flexible multilayer substrates

Tuomo Jaakola; Markku Lahti; Jarno Petäjä; Kari Kautio; Kari Rönkä; Jaakko Lenkkeri

doi:10.1109/EPTC.2008.4763458

Low cost printed flexible multilayer substrates

Tuomo Jaakola, Markku Lahti, Jarno Petäjä, Kari Kautio, Kari Rönkä, Jaakko Lenkkeri

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

9 Citations (Scopus)

Abstract

For high-volume products low-cost techniques for multilayer polymer-based thick film wiring board manufacturing are needed. Screen-printing is a cost-efficient technology candidate to build up approximately 6 conductor layers on both sides of a flexible substrate. In order to experimentally evaluate the feasibility of screen-printing technique, the printing resolution was tested on different substrate materials, such as, polycarbonate (PC), polyethylene terephtalate (PET), polyimide (PI) and liquid crystal polymer (LCP). Conventional screen printed polymer thick film pastes were characterized on polymer substrates to form multilayer fine-line patterning and through-hole vias. The final demonstrator was a double-sided PI substrate having two conductor layers separated by dielectric layers on both sides of the substrate and through substrate vias.

Original language	English
Title of host publication	Proceedings
Subtitle of host publication	10th Electronics Packaging Technology Conference, EPTC 2008
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	344-349
ISBN (Print)	978-1-4244-2117-6, 978-1-4244-2118-3
DOIs	https://doi.org/10.1109/EPTC.2008.4763458
Publication status	Published - 2008
MoE publication type	A4 Article in a conference publication
Event	10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore Duration: 9 Dec 2008 → 12 Dec 2008

Conference

Conference	10th Electronics Packaging Technology Conference, EPTC 2008
Abbreviated title	EPTC 2008
Country/Territory	Singapore
City	Singapore
Period	9/12/08 → 12/12/08

Keywords

flexible multilayer substrate

Access to Document

10.1109/EPTC.2008.4763458

Cite this

@inproceedings{2a7e4b509cca4ff4bea6ef22beae854a,

title = "Low cost printed flexible multilayer substrates",

abstract = "For high-volume products low-cost techniques for multilayer polymer-based thick film wiring board manufacturing are needed. Screen-printing is a cost-efficient technology candidate to build up approximately 6 conductor layers on both sides of a flexible substrate. In order to experimentally evaluate the feasibility of screen-printing technique, the printing resolution was tested on different substrate materials, such as, polycarbonate (PC), polyethylene terephtalate (PET), polyimide (PI) and liquid crystal polymer (LCP). Conventional screen printed polymer thick film pastes were characterized on polymer substrates to form multilayer fine-line patterning and through-hole vias. The final demonstrator was a double-sided PI substrate having two conductor layers separated by dielectric layers on both sides of the substrate and through substrate vias.",

keywords = "flexible multilayer substrate",

author = "Tuomo Jaakola and Markku Lahti and Jarno Pet{\"a}j{\"a} and Kari Kautio and Kari R{\"o}nk{\"a} and Jaakko Lenkkeri",

year = "2008",

doi = "10.1109/EPTC.2008.4763458",

language = "English",

isbn = "978-1-4244-2117-6",

pages = "344--349",

booktitle = "Proceedings",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "10th Electronics Packaging Technology Conference, EPTC 2008, EPTC 2008 ; Conference date: 09-12-2008 Through 12-12-2008",

}

Jaakola, T, Lahti, M , Petäjä, J, Kautio, K, Rönkä, K & Lenkkeri, J 2008, Low cost printed flexible multilayer substrates. in Proceedings: 10th Electronics Packaging Technology Conference, EPTC 2008. IEEE Institute of Electrical and Electronic Engineers, Piscataway, NJ, USA, pp. 344-349, 10th Electronics Packaging Technology Conference, EPTC 2008, Singapore, Singapore, 9/12/08. https://doi.org/10.1109/EPTC.2008.4763458

Low cost printed flexible multilayer substrates. / Jaakola, Tuomo; Lahti, Markku ; Petäjä, Jarno et al.
Proceedings: 10th Electronics Packaging Technology Conference, EPTC 2008. Piscataway, NJ, USA: IEEE Institute of Electrical and Electronic Engineers, 2008. p. 344-349.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Low cost printed flexible multilayer substrates

AU - Jaakola, Tuomo

AU - Lahti, Markku

AU - Petäjä, Jarno

AU - Kautio, Kari

AU - Rönkä, Kari

AU - Lenkkeri, Jaakko

PY - 2008

Y1 - 2008

N2 - For high-volume products low-cost techniques for multilayer polymer-based thick film wiring board manufacturing are needed. Screen-printing is a cost-efficient technology candidate to build up approximately 6 conductor layers on both sides of a flexible substrate. In order to experimentally evaluate the feasibility of screen-printing technique, the printing resolution was tested on different substrate materials, such as, polycarbonate (PC), polyethylene terephtalate (PET), polyimide (PI) and liquid crystal polymer (LCP). Conventional screen printed polymer thick film pastes were characterized on polymer substrates to form multilayer fine-line patterning and through-hole vias. The final demonstrator was a double-sided PI substrate having two conductor layers separated by dielectric layers on both sides of the substrate and through substrate vias.

AB - For high-volume products low-cost techniques for multilayer polymer-based thick film wiring board manufacturing are needed. Screen-printing is a cost-efficient technology candidate to build up approximately 6 conductor layers on both sides of a flexible substrate. In order to experimentally evaluate the feasibility of screen-printing technique, the printing resolution was tested on different substrate materials, such as, polycarbonate (PC), polyethylene terephtalate (PET), polyimide (PI) and liquid crystal polymer (LCP). Conventional screen printed polymer thick film pastes were characterized on polymer substrates to form multilayer fine-line patterning and through-hole vias. The final demonstrator was a double-sided PI substrate having two conductor layers separated by dielectric layers on both sides of the substrate and through substrate vias.

KW - flexible multilayer substrate

U2 - 10.1109/EPTC.2008.4763458

DO - 10.1109/EPTC.2008.4763458

M3 - Conference article in proceedings

SN - 978-1-4244-2117-6

SN - 978-1-4244-2118-3

SP - 344

EP - 349

BT - Proceedings

PB - IEEE Institute of Electrical and Electronic Engineers

CY - Piscataway, NJ, USA

T2 - 10th Electronics Packaging Technology Conference, EPTC 2008

Y2 - 9 December 2008 through 12 December 2008

ER -

Low cost printed flexible multilayer substrates

Abstract

Conference

Keywords

Access to Document

Fingerprint

Cite this