Abstract
A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band
frequencies. The vertical BGA‐via transition path starts from an
organic motherboard (PCB) and ends at the top surface of a
low‐temperature cofired ceramic module package. To assess solder joint
reliability, large plastic‐core solder balls with a diameter of 800 μm
were employed. The measured insertion loss of the entire vertical
transition path, including feedlines, was better than 0.5 dB (1 dB) up
to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the
complete transition path was developed.
| Original language | English |
|---|---|
| Pages (from-to) | 1036 - 1040 |
| Number of pages | 5 |
| Journal | Microwave and Optical Technology Letters |
| Volume | 50 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2008 |
| MoE publication type | A1 Journal article-refereed |
Keywords
- BGA
- broadband
- LTCC
- System-in-Package
- transition
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Kangasvieri, T., Halme, J., Vähäkangas, J., & Lahti, M. (2008). Low-loss and broadband BGA package transition for LTCC-SiP applications. Microwave and Optical Technology Letters, 50(4), 1036 - 1040. https://doi.org/10.1002/mop.23276