Low-loss and broadband BGA package transition for LTCC-SiP applications

T. Kangasvieri (Corresponding Author), J. Halme, J. Vähäkangas, Markku Lahti

    Research output: Contribution to journalArticleScientificpeer-review

    12 Citations (Scopus)

    Abstract

    A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.
    Original languageEnglish
    Pages (from-to)1036 - 1040
    Number of pages5
    JournalMicrowave and Optical Technology Letters
    Volume50
    Issue number4
    DOIs
    Publication statusPublished - 2008
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Soldering alloys
    broadband
    Polychlorinated Biphenyls
    solders
    Insertion losses
    Polychlorinated biphenyls
    Equivalent circuits
    polychlorinated biphenyls
    equivalent circuits
    insertion loss
    balls
    modules
    direct current
    ceramics
    System-in-package

    Keywords

    • BGA
    • broadband
    • LTCC
    • System-in-Package
    • transition

    Cite this

    Kangasvieri, T. ; Halme, J. ; Vähäkangas, J. ; Lahti, Markku. / Low-loss and broadband BGA package transition for LTCC-SiP applications. In: Microwave and Optical Technology Letters. 2008 ; Vol. 50, No. 4. pp. 1036 - 1040.
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    abstract = "A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.",
    keywords = "BGA, broadband, LTCC, System-in-Package, transition",
    author = "T. Kangasvieri and J. Halme and J. V{\"a}h{\"a}kangas and Markku Lahti",
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    Low-loss and broadband BGA package transition for LTCC-SiP applications. / Kangasvieri, T. (Corresponding Author); Halme, J.; Vähäkangas, J.; Lahti, Markku.

    In: Microwave and Optical Technology Letters, Vol. 50, No. 4, 2008, p. 1036 - 1040.

    Research output: Contribution to journalArticleScientificpeer-review

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    T1 - Low-loss and broadband BGA package transition for LTCC-SiP applications

    AU - Kangasvieri, T.

    AU - Halme, J.

    AU - Vähäkangas, J.

    AU - Lahti, Markku

    PY - 2008

    Y1 - 2008

    N2 - A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.

    AB - A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.

    KW - BGA

    KW - broadband

    KW - LTCC

    KW - System-in-Package

    KW - transition

    U2 - 10.1002/mop.23276

    DO - 10.1002/mop.23276

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    JO - Microwave and Optical Technology Letters

    JF - Microwave and Optical Technology Letters

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