Abstract
| Original language | English |
|---|---|
| Pages (from-to) | 1036 - 1040 |
| Number of pages | 5 |
| Journal | Microwave and Optical Technology Letters |
| Volume | 50 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2008 |
| MoE publication type | A1 Journal article-refereed |
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Keywords
- BGA
- broadband
- LTCC
- System-in-Package
- transition
Cite this
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Low-loss and broadband BGA package transition for LTCC-SiP applications. / Kangasvieri, T. (Corresponding Author); Halme, J.; Vähäkangas, J.; Lahti, Markku.
In: Microwave and Optical Technology Letters, Vol. 50, No. 4, 2008, p. 1036 - 1040.Research output: Contribution to journal › Article › Scientific › peer-review
TY - JOUR
T1 - Low-loss and broadband BGA package transition for LTCC-SiP applications
AU - Kangasvieri, T.
AU - Halme, J.
AU - Vähäkangas, J.
AU - Lahti, Markku
PY - 2008
Y1 - 2008
N2 - A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.
AB - A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.
KW - BGA
KW - broadband
KW - LTCC
KW - System-in-Package
KW - transition
U2 - 10.1002/mop.23276
DO - 10.1002/mop.23276
M3 - Article
VL - 50
SP - 1036
EP - 1040
JO - Microwave and Optical Technology Letters
JF - Microwave and Optical Technology Letters
SN - 0895-2477
IS - 4
ER -