Low-loss and broadband BGA package transition for LTCC-SiP applications

T. Kangasvieri; J. Halme; J. Vähäkangas; Markku Lahti

doi:10.1002/mop.23276

Low-loss and broadband BGA package transition for LTCC-SiP applications

T. Kangasvieri (Corresponding Author), J. Halme, J. Vähäkangas, Markku Lahti

Research output: Contribution to journal › Article › Scientific › peer-review

12 Citations (Scopus)

Abstract

A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the K_a‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.

Original language	English
Pages (from-to)	1036 - 1040
Number of pages	5
Journal	Microwave and Optical Technology Letters
Volume	50
Issue number	4
DOIs	https://doi.org/10.1002/mop.23276
Publication status	Published - 2008
MoE publication type	A1 Journal article-refereed

Keywords

BGA
broadband
LTCC
System-in-Package
transition

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title = "Low-loss and broadband BGA package transition for LTCC-SiP applications",

abstract = "A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed. ",

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AU - Kangasvieri, T.

AU - Halme, J.

AU - Vähäkangas, J.

AU - Lahti, Markku

PY - 2008

Y1 - 2008

N2 - A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.

AB - A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.

KW - BGA

KW - broadband

KW - LTCC

KW - System-in-Package

KW - transition

U2 - 10.1002/mop.23276

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JF - Microwave and Optical Technology Letters

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