Low-loss and broadband BGA package transition for LTCC-SiP applications

T. Kangasvieri (Corresponding Author), J. Halme, J. Vähäkangas, Markku Lahti

    Research output: Contribution to journalArticleScientificpeer-review

    12 Citations (Scopus)

    Abstract

    A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.
    Original languageEnglish
    Pages (from-to)1036 - 1040
    Number of pages5
    JournalMicrowave and Optical Technology Letters
    Volume50
    Issue number4
    DOIs
    Publication statusPublished - 2008
    MoE publication typeA1 Journal article-refereed

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    Keywords

    • BGA
    • broadband
    • LTCC
    • System-in-Package
    • transition

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