Low-loss and broadband BGA package transition for LTCC-SiP applications

T. Kangasvieri (Corresponding Author), J. Halme, J. Vähäkangas, Markku Lahti

Research output: Contribution to journalArticleScientificpeer-review

12 Citations (Scopus)

Abstract

A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.
Original languageEnglish
Pages (from-to)1036 - 1040
Number of pages5
JournalMicrowave and Optical Technology Letters
Volume50
Issue number4
DOIs
Publication statusPublished - 2008
MoE publication typeA1 Journal article-refereed

Fingerprint

Soldering alloys
broadband
Polychlorinated Biphenyls
solders
Insertion losses
Polychlorinated biphenyls
Equivalent circuits
polychlorinated biphenyls
equivalent circuits
insertion loss
balls
modules
direct current
ceramics
System-in-package

Keywords

  • BGA
  • broadband
  • LTCC
  • System-in-Package
  • transition

Cite this

Kangasvieri, T. ; Halme, J. ; Vähäkangas, J. ; Lahti, Markku. / Low-loss and broadband BGA package transition for LTCC-SiP applications. In: Microwave and Optical Technology Letters. 2008 ; Vol. 50, No. 4. pp. 1036 - 1040.
@article{87ee4e0d938049988bf8cbc7d4fa2d35,
title = "Low-loss and broadband BGA package transition for LTCC-SiP applications",
abstract = "A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.",
keywords = "BGA, broadband, LTCC, System-in-Package, transition",
author = "T. Kangasvieri and J. Halme and J. V{\"a}h{\"a}kangas and Markku Lahti",
year = "2008",
doi = "10.1002/mop.23276",
language = "English",
volume = "50",
pages = "1036 -- 1040",
journal = "Microwave and Optical Technology Letters",
issn = "0895-2477",
publisher = "Wiley",
number = "4",

}

Low-loss and broadband BGA package transition for LTCC-SiP applications. / Kangasvieri, T. (Corresponding Author); Halme, J.; Vähäkangas, J.; Lahti, Markku.

In: Microwave and Optical Technology Letters, Vol. 50, No. 4, 2008, p. 1036 - 1040.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Low-loss and broadband BGA package transition for LTCC-SiP applications

AU - Kangasvieri, T.

AU - Halme, J.

AU - Vähäkangas, J.

AU - Lahti, Markku

PY - 2008

Y1 - 2008

N2 - A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.

AB - A high‐performance broadband ball‐grid‐array (BGA) package transition was designed and implemented from DC up to the Ka‐band frequencies. The vertical BGA‐via transition path starts from an organic motherboard (PCB) and ends at the top surface of a low‐temperature cofired ceramic module package. To assess solder joint reliability, large plastic‐core solder balls with a diameter of 800 μm were employed. The measured insertion loss of the entire vertical transition path, including feedlines, was better than 0.5 dB (1 dB) up to 25 GHz (29 GHz). Moreover, an equivalent circuit model for the complete transition path was developed.

KW - BGA

KW - broadband

KW - LTCC

KW - System-in-Package

KW - transition

U2 - 10.1002/mop.23276

DO - 10.1002/mop.23276

M3 - Article

VL - 50

SP - 1036

EP - 1040

JO - Microwave and Optical Technology Letters

JF - Microwave and Optical Technology Letters

SN - 0895-2477

IS - 4

ER -