Low-loss and broadband BGA package transition for LTCC-SiP applications

T. Kangasvieri (Corresponding Author), J. Halme, J. Vähäkangas, Markku Lahti

    Research output: Contribution to journal › Article › Scientific › peer-review

    13 Citations (Scopus)

    Fingerprint

    Dive into the research topics of 'Low-loss and broadband BGA package transition for LTCC-SiP applications'. Together they form a unique fingerprint.

    Engineering

    Agricultural and Biological Sciences

    Material Science