Keyphrases
Micro-electro-mechanical Systems
100%
Thick Film
100%
Polysilicon
100%
Low-temperature Bonding
100%
Bonding Quality
40%
Polishing Process
40%
Polysilicon Film
40%
Scanning Electron Microscopy
20%
Annealing
20%
System Design
20%
Thermal Load
20%
Atomic Force Microscope
20%
Multicrystalline Silicon
20%
Silica
20%
Silicon-on-insulator
20%
Wafer
20%
Argon Plasma
20%
Surface Quality
20%
Crack Opening
20%
Insulator Substrate
20%
Scanning Acoustic Microscope
20%
Interface Quality
20%
Film Quality
20%
Boron Doping
20%
Anodic Bonding
20%
HF Etching
20%
Varying Temperature
20%
Process Duration
20%
Varying Pressure
20%
INIS
bonding
100%
low temperature
100%
microelectromechanical systems
100%
films
100%
silicon
37%
polishing
37%
surfaces
25%
single crystals
12%
interfaces
12%
design
12%
plasma
12%
substrates
12%
atomic force microscopy
12%
scanning electron microscopy
12%
boron
12%
sensors
12%
annealing
12%
argon
12%
cracks
12%
quartz
12%
acoustics
12%
glass
12%
microscopes
12%
etching
12%
Engineering
Low-Temperature
100%
Microelectromechanical System
100%
Polysilicon
100%
Polishing Process
50%
Atomic Force Microscope
25%
Surface Quality
25%
Silicon Single Crystal
25%
Crack Opening
25%
Silicon on Insulator
25%
Microelectromechanical System Design
25%
Direct Bonding
25%
Silicon Dioxide
25%
Thermal Load
25%
Material Science
Film
100%
Microelectromechanical System
100%
Thick Films
100%
Silicon
75%
Surface Property
25%
Boron
25%
Scanning Electron Microscopy
25%
Microelectromechanical System Design
25%
Surface (Surface Science)
25%
Thermal Loads
25%
Single Crystal
25%