Low-temperature bump bonding of timepix readout chips and CdTe sensors at different sensor pitches

Hannele Heikkinen, Akiko Gädda, Sami Vähänen, Jaakko Salonen, Philippe Monnoyer, G. Blaj, L. Tlustos, M. Campbell

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Fingerprint Dive into the research topics of 'Low-temperature bump bonding of timepix readout chips and CdTe sensors at different sensor pitches'. Together they form a unique fingerprint.

Physics & Astronomy