Low temperature co-fired ceramics on optoelectronic sensors integration

Ville Moilanen, Kari Kautio, Pentti Karioja, Raimo Rikola, Jarmo Lehtomaa, Jouko Malinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

The optical analyzers used in on-line and off-line process measurements set a large variety of special demands for optical detectors, i.e. customized detectors are needed. Both the detector (array) and its read-out circuit are affected. The typical volume for process analyzers is so low that fully customized ASICs easily become too expensive for signal recovery solutions in optical detectors. This is due to high fixed costs in ASIC development. Low Temperature Co-fired Ceramics (LTCC) substrates allow high integration grade and the smart packaging solutions needed in optical detectors. The ceramic substrate is suitable for hermetic packaging. The high integration grade is possible thanks to multilayer capability, with narrow metal strips as well as blind and buried vias which can be placed directly underneath the solder pads. Standard connection methods can be used, i.e. soldering, gluing and wire bonding for components and detector chip assembly. By using small passive components and bare chip or chip scale packaged active components, one is able to integrate the read-out functions in a small enough space. This paper briefly presents three different cases where infrared photoconductive detector arrays are attached to read-out circuitry which is made on LTCC substrate. The detector read-out hybrids are packaged in hermetic metal packages. The packages have been either non-cooled or thermoelectrically cooled. 24 element PbS, 4 by 4 element PbS and 128 element MCT cases are handled. Also an example of an integrated infrared light emitting diode array for an LEDspectrometer is presented. General feasibility analysis, including some electrical test results and the management of substrate dimensional tolerances, is given. (7 refs.)
Original languageEnglish
Title of host publicationOptical Sensing Technology and Applications
PublisherInternational Society for Optics and Photonics SPIE
DOIs
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
EventInternational Congress on Optics and Optoelectronics: Optical Sensing Technology and Applications - Prague, Czech Republic
Duration: 16 Apr 200718 Apr 2007

Publication series

SeriesProceedings of SPIE
Volume6585

Conference

ConferenceInternational Congress on Optics and Optoelectronics
CountryCzech Republic
CityPrague
Period16/04/0718/04/07

Fingerprint

ceramics
sensors
detectors
application specific integrated circuits
chips
packaging
grade
analyzers
feasibility analysis
metal strips
soldering
solders
light emitting diodes
assembly
recovery
wire
costs
metals

Keywords

  • LTCC
  • Read-out circuit
  • Photoconductor
  • Infrared
  • LED

Cite this

Moilanen, V., Kautio, K., Karioja, P., Rikola, R., Lehtomaa, J., & Malinen, J. (2007). Low temperature co-fired ceramics on optoelectronic sensors integration. In Optical Sensing Technology and Applications International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 6585 https://doi.org/10.1117/12.724158
Moilanen, Ville ; Kautio, Kari ; Karioja, Pentti ; Rikola, Raimo ; Lehtomaa, Jarmo ; Malinen, Jouko. / Low temperature co-fired ceramics on optoelectronic sensors integration. Optical Sensing Technology and Applications. International Society for Optics and Photonics SPIE, 2007. (Proceedings of SPIE, Vol. 6585).
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Moilanen, V, Kautio, K, Karioja, P, Rikola, R, Lehtomaa, J & Malinen, J 2007, Low temperature co-fired ceramics on optoelectronic sensors integration. in Optical Sensing Technology and Applications. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 6585, International Congress on Optics and Optoelectronics, Prague, Czech Republic, 16/04/07. https://doi.org/10.1117/12.724158

Low temperature co-fired ceramics on optoelectronic sensors integration. / Moilanen, Ville; Kautio, Kari; Karioja, Pentti; Rikola, Raimo; Lehtomaa, Jarmo; Malinen, Jouko.

Optical Sensing Technology and Applications. International Society for Optics and Photonics SPIE, 2007. (Proceedings of SPIE, Vol. 6585).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Malinen, Jouko

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AB - The optical analyzers used in on-line and off-line process measurements set a large variety of special demands for optical detectors, i.e. customized detectors are needed. Both the detector (array) and its read-out circuit are affected. The typical volume for process analyzers is so low that fully customized ASICs easily become too expensive for signal recovery solutions in optical detectors. This is due to high fixed costs in ASIC development. Low Temperature Co-fired Ceramics (LTCC) substrates allow high integration grade and the smart packaging solutions needed in optical detectors. The ceramic substrate is suitable for hermetic packaging. The high integration grade is possible thanks to multilayer capability, with narrow metal strips as well as blind and buried vias which can be placed directly underneath the solder pads. Standard connection methods can be used, i.e. soldering, gluing and wire bonding for components and detector chip assembly. By using small passive components and bare chip or chip scale packaged active components, one is able to integrate the read-out functions in a small enough space. This paper briefly presents three different cases where infrared photoconductive detector arrays are attached to read-out circuitry which is made on LTCC substrate. The detector read-out hybrids are packaged in hermetic metal packages. The packages have been either non-cooled or thermoelectrically cooled. 24 element PbS, 4 by 4 element PbS and 128 element MCT cases are handled. Also an example of an integrated infrared light emitting diode array for an LEDspectrometer is presented. General feasibility analysis, including some electrical test results and the management of substrate dimensional tolerances, is given. (7 refs.)

KW - LTCC

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KW - Photoconductor

KW - Infrared

KW - LED

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M3 - Conference article in proceedings

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ER -

Moilanen V, Kautio K, Karioja P, Rikola R, Lehtomaa J, Malinen J. Low temperature co-fired ceramics on optoelectronic sensors integration. In Optical Sensing Technology and Applications. International Society for Optics and Photonics SPIE. 2007. (Proceedings of SPIE, Vol. 6585). https://doi.org/10.1117/12.724158