Low temperature co-fired ceramics on optoelectronic sensors integration

Ville Moilanen, Kari Kautio, Pentti Karioja, Raimo Rikola, Jarmo Lehtomaa, Jouko Malinen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)


    The optical analyzers used in on-line and off-line process measurements set a large variety of special demands for optical detectors, i.e. customized detectors are needed. Both the detector (array) and its read-out circuit are affected. The typical volume for process analyzers is so low that fully customized ASICs easily become too expensive for signal recovery solutions in optical detectors. This is due to high fixed costs in ASIC development. Low Temperature Co-fired Ceramics (LTCC) substrates allow high integration grade and the smart packaging solutions needed in optical detectors. The ceramic substrate is suitable for hermetic packaging. The high integration grade is possible thanks to multilayer capability, with narrow metal strips as well as blind and buried vias which can be placed directly underneath the solder pads. Standard connection methods can be used, i.e. soldering, gluing and wire bonding for components and detector chip assembly. By using small passive components and bare chip or chip scale packaged active components, one is able to integrate the read-out functions in a small enough space. This paper briefly presents three different cases where infrared photoconductive detector arrays are attached to read-out circuitry which is made on LTCC substrate. The detector read-out hybrids are packaged in hermetic metal packages. The packages have been either non-cooled or thermoelectrically cooled. 24 element PbS, 4 by 4 element PbS and 128 element MCT cases are handled. Also an example of an integrated infrared light emitting diode array for an LEDspectrometer is presented. General feasibility analysis, including some electrical test results and the management of substrate dimensional tolerances, is given. (7 refs.)
    Original languageEnglish
    Title of host publicationOptical Sensing Technology and Applications
    PublisherInternational Society for Optics and Photonics SPIE
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication
    EventInternational Congress on Optics and Optoelectronics: Optical Sensing Technology and Applications - Prague, Czech Republic
    Duration: 16 Apr 200718 Apr 2007

    Publication series

    SeriesProceedings of SPIE


    ConferenceInternational Congress on Optics and Optoelectronics
    Country/TerritoryCzech Republic


    • LTCC
    • Read-out circuit
    • Photoconductor
    • Infrared
    • LED


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