Low-Temperature Processes for MEMS Device Fabrication

Jyrki Kiihamäki (Corresponding author), Hannu Kattelus, Martti Blomberg, Riikka Puurunen, Mari Laamanen, Panu Pekko, Jaakko Saarilahti, Heini Ritala, Anna Rissanen

    Research output: Chapter in Book/Report/Conference proceedingChapter or book articleScientificpeer-review

    6 Citations (Scopus)

    Abstract

    The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.
    Original languageEnglish
    Title of host publicationAdvanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
    EditorsEvgeni Gusev, Eric Garfunkel, Arthur Dideikin
    PublisherSpringer
    Pages167-178
    ISBN (Electronic)978-90-481-3807-4
    ISBN (Print)978-90-481-3805-0
    DOIs
    Publication statusPublished - 2010
    MoE publication typeA3 Part of a book or another research book
    EventNATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators - St. Petersburg, Russian Federation
    Duration: 29 Jun 20092 Jul 2009

    Publication series

    SeriesNATO Science for Peace and Security Series B: Physics and Biophysics
    ISSN1874-6500

    Workshop

    WorkshopNATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
    CountryRussian Federation
    CitySt. Petersburg
    Period29/06/092/07/09

    Fingerprint

    MEMS
    Fabrication
    Wafer bonding
    Temperature
    Hydrofluoric acid
    Atomic layer deposition
    Reactive sputtering
    Plasma enhanced chemical vapor deposition
    Etching
    Vapors
    Switches
    Semiconductor materials
    Oxides

    Keywords

    • MEMS
    • thin film technology
    • fusion bonding
    • amorphous metals
    • HF-vapour etching

    Cite this

    Kiihamäki, J., Kattelus, H., Blomberg, M., Puurunen, R., Laamanen, M., Pekko, P., ... Rissanen, A. (2010). Low-Temperature Processes for MEMS Device Fabrication. In E. Gusev, E. Garfunkel, & A. Dideikin (Eds.), Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators (pp. 167-178). Springer. NATO Science for Peace and Security Series B: Physics and Biophysics https://doi.org/10.1007/978-90-481-3807-4_13
    Kiihamäki, Jyrki ; Kattelus, Hannu ; Blomberg, Martti ; Puurunen, Riikka ; Laamanen, Mari ; Pekko, Panu ; Saarilahti, Jaakko ; Ritala, Heini ; Rissanen, Anna. / Low-Temperature Processes for MEMS Device Fabrication. Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. editor / Evgeni Gusev ; Eric Garfunkel ; Arthur Dideikin. Springer, 2010. pp. 167-178 (NATO Science for Peace and Security Series B: Physics and Biophysics).
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    abstract = "The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.",
    keywords = "MEMS, thin film technology, fusion bonding, amorphous metals, HF-vapour etching",
    author = "Jyrki Kiiham{\"a}ki and Hannu Kattelus and Martti Blomberg and Riikka Puurunen and Mari Laamanen and Panu Pekko and Jaakko Saarilahti and Heini Ritala and Anna Rissanen",
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    Kiihamäki, J, Kattelus, H, Blomberg, M, Puurunen, R, Laamanen, M, Pekko, P, Saarilahti, J, Ritala, H & Rissanen, A 2010, Low-Temperature Processes for MEMS Device Fabrication. in E Gusev, E Garfunkel & A Dideikin (eds), Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. Springer, NATO Science for Peace and Security Series B: Physics and Biophysics, pp. 167-178, NATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators, St. Petersburg, Russian Federation, 29/06/09. https://doi.org/10.1007/978-90-481-3807-4_13

    Low-Temperature Processes for MEMS Device Fabrication. / Kiihamäki, Jyrki (Corresponding author); Kattelus, Hannu; Blomberg, Martti; Puurunen, Riikka; Laamanen, Mari; Pekko, Panu; Saarilahti, Jaakko; Ritala, Heini; Rissanen, Anna.

    Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. ed. / Evgeni Gusev; Eric Garfunkel; Arthur Dideikin. Springer, 2010. p. 167-178 (NATO Science for Peace and Security Series B: Physics and Biophysics).

    Research output: Chapter in Book/Report/Conference proceedingChapter or book articleScientificpeer-review

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    T1 - Low-Temperature Processes for MEMS Device Fabrication

    AU - Kiihamäki, Jyrki

    AU - Kattelus, Hannu

    AU - Blomberg, Martti

    AU - Puurunen, Riikka

    AU - Laamanen, Mari

    AU - Pekko, Panu

    AU - Saarilahti, Jaakko

    AU - Ritala, Heini

    AU - Rissanen, Anna

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    N2 - The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.

    AB - The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.

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    KW - thin film technology

    KW - fusion bonding

    KW - amorphous metals

    KW - HF-vapour etching

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    Kiihamäki J, Kattelus H, Blomberg M, Puurunen R, Laamanen M, Pekko P et al. Low-Temperature Processes for MEMS Device Fabrication. In Gusev E, Garfunkel E, Dideikin A, editors, Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. Springer. 2010. p. 167-178. (NATO Science for Peace and Security Series B: Physics and Biophysics). https://doi.org/10.1007/978-90-481-3807-4_13