Low-Temperature Processes for MEMS Device Fabrication

Jyrki Kiihamäki (Corresponding author), Hannu Kattelus, Martti Blomberg, Riikka Puurunen, Mari Laamanen, Panu Pekko, Jaakko Saarilahti, Heini Ritala, Anna Rissanen

Research output: Chapter in Book/Report/Conference proceedingChapter or book articleScientificpeer-review

6 Citations (Scopus)

Abstract

The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.
Original languageEnglish
Title of host publicationAdvanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
EditorsEvgeni Gusev, Eric Garfunkel, Arthur Dideikin
PublisherSpringer
Pages167-178
ISBN (Electronic)978-90-481-3807-4
ISBN (Print)978-90-481-3805-0
DOIs
Publication statusPublished - 2010
MoE publication typeA3 Part of a book or another research book
EventNATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators - St. Petersburg, Russian Federation
Duration: 29 Jun 20092 Jul 2009

Publication series

NameNATO Science for Peace and Security Series B: Physics and Biophysics

Workshop

WorkshopNATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
CountryRussian Federation
CitySt. Petersburg
Period29/06/092/07/09

Fingerprint

MEMS
Fabrication
Wafer bonding
Temperature
Hydrofluoric acid
Atomic layer deposition
Reactive sputtering
Plasma enhanced chemical vapor deposition
Etching
Vapors
Switches
Semiconductor materials
Oxides

Keywords

  • MEMS
  • thin film technology
  • fusion bonding
  • amorphous metals
  • HF-vapour etching

Cite this

Kiihamäki, J., Kattelus, H., Blomberg, M., Puurunen, R., Laamanen, M., Pekko, P., ... Rissanen, A. (2010). Low-Temperature Processes for MEMS Device Fabrication. In E. Gusev, E. Garfunkel, & A. Dideikin (Eds.), Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators (pp. 167-178). Springer. NATO Science for Peace and Security Series B: Physics and Biophysics https://doi.org/10.1007/978-90-481-3807-4_13
Kiihamäki, Jyrki ; Kattelus, Hannu ; Blomberg, Martti ; Puurunen, Riikka ; Laamanen, Mari ; Pekko, Panu ; Saarilahti, Jaakko ; Ritala, Heini ; Rissanen, Anna. / Low-Temperature Processes for MEMS Device Fabrication. Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. editor / Evgeni Gusev ; Eric Garfunkel ; Arthur Dideikin. Springer, 2010. pp. 167-178 (NATO Science for Peace and Security Series B: Physics and Biophysics).
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Kiihamäki, J, Kattelus, H, Blomberg, M, Puurunen, R, Laamanen, M, Pekko, P, Saarilahti, J, Ritala, H & Rissanen, A 2010, Low-Temperature Processes for MEMS Device Fabrication. in E Gusev, E Garfunkel & A Dideikin (eds), Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. Springer, NATO Science for Peace and Security Series B: Physics and Biophysics, pp. 167-178, NATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators, St. Petersburg, Russian Federation, 29/06/09. https://doi.org/10.1007/978-90-481-3807-4_13

Low-Temperature Processes for MEMS Device Fabrication. / Kiihamäki, Jyrki (Corresponding author); Kattelus, Hannu; Blomberg, Martti; Puurunen, Riikka; Laamanen, Mari; Pekko, Panu; Saarilahti, Jaakko; Ritala, Heini; Rissanen, Anna.

Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. ed. / Evgeni Gusev; Eric Garfunkel; Arthur Dideikin. Springer, 2010. p. 167-178 (NATO Science for Peace and Security Series B: Physics and Biophysics).

Research output: Chapter in Book/Report/Conference proceedingChapter or book articleScientificpeer-review

TY - CHAP

T1 - Low-Temperature Processes for MEMS Device Fabrication

AU - Kiihamäki, Jyrki

AU - Kattelus, Hannu

AU - Blomberg, Martti

AU - Puurunen, Riikka

AU - Laamanen, Mari

AU - Pekko, Panu

AU - Saarilahti, Jaakko

AU - Ritala, Heini

AU - Rissanen, Anna

PY - 2010

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AB - The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.

KW - MEMS

KW - thin film technology

KW - fusion bonding

KW - amorphous metals

KW - HF-vapour etching

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SN - 978-90-481-3805-0

T3 - NATO Science for Peace and Security Series B: Physics and Biophysics

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BT - Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

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A2 - Dideikin, Arthur

PB - Springer

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Kiihamäki J, Kattelus H, Blomberg M, Puurunen R, Laamanen M, Pekko P et al. Low-Temperature Processes for MEMS Device Fabrication. In Gusev E, Garfunkel E, Dideikin A, editors, Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. Springer. 2010. p. 167-178. (NATO Science for Peace and Security Series B: Physics and Biophysics). https://doi.org/10.1007/978-90-481-3807-4_13