Low-Temperature Processes for MEMS Device Fabrication

Jyrki Kiihamäki; Hannu Kattelus; Martti Blomberg; Riikka Puurunen; Mari Laamanen; Panu Pekko; Jaakko Saarilahti; Heini Ritala; Anna Rissanen

doi:10.1007/978-90-481-3807-4_13

Low-Temperature Processes for MEMS Device Fabrication

Jyrki Kiihamäki (Corresponding author), Hannu Kattelus, Martti Blomberg, Riikka Puurunen, Mari Laamanen, Panu Pekko, Jaakko Saarilahti, Heini Ritala, Anna Rissanen

Research output: Chapter in Book/Report/Conference proceeding › Chapter or book article › Scientific › peer-review

6 Citations (Scopus)

Abstract

The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.

Original language	English
Title of host publication	Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
Editors	Evgeni Gusev, Eric Garfunkel, Arthur Dideikin
Publisher	Springer
Pages	167-178
ISBN (Electronic)	978-90-481-3807-4
ISBN (Print)	978-90-481-3805-0
DOIs	https://doi.org/10.1007/978-90-481-3807-4_13
Publication status	Published - 2010
MoE publication type	A3 Part of a book or another research book
Event	NATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators - St. Petersburg, Russian Federation Duration: 29 Jun 2009 → 2 Jul 2009

Publication series

Series	NATO Science for Peace and Security Series B: Physics and Biophysics
ISSN	1874-6500

Workshop

Workshop	NATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
Country/Territory	Russian Federation
City	St. Petersburg
Period	29/06/09 → 2/07/09

Keywords

MEMS
thin film technology
fusion bonding
amorphous metals
HF-vapour etching

Access to Document

10.1007/978-90-481-3807-4_13

Cite this

Kiihamäki, J., Kattelus, H., Blomberg, M., Puurunen, R., Laamanen, M., Pekko, P., Saarilahti, J., Ritala, H., & Rissanen, A. (2010). Low-Temperature Processes for MEMS Device Fabrication. In E. Gusev, E. Garfunkel, & A. Dideikin (Eds.), Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators (pp. 167-178). Springer. NATO Science for Peace and Security Series B: Physics and Biophysics https://doi.org/10.1007/978-90-481-3807-4_13

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abstract = "The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.",

keywords = "MEMS, thin film technology, fusion bonding, amorphous metals, HF-vapour etching",

author = "Jyrki Kiiham{\"a}ki and Hannu Kattelus and Martti Blomberg and Riikka Puurunen and Mari Laamanen and Panu Pekko and Jaakko Saarilahti and Heini Ritala and Anna Rissanen",

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booktitle = "Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators",

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Kiihamäki, J, Kattelus, H, Blomberg, M, Puurunen, R, Laamanen, M, Pekko, P , Saarilahti, J, Ritala, H & Rissanen, A 2010, Low-Temperature Processes for MEMS Device Fabrication. in E Gusev, E Garfunkel & A Dideikin (eds), Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. Springer, NATO Science for Peace and Security Series B: Physics and Biophysics, pp. 167-178, NATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators, St. Petersburg, Russian Federation, 29/06/09. https://doi.org/10.1007/978-90-481-3807-4_13

Low-Temperature Processes for MEMS Device Fabrication. / Kiihamäki, Jyrki (Corresponding author); Kattelus, Hannu; Blomberg, Martti et al.

Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. ed. / Evgeni Gusev; Eric Garfunkel; Arthur Dideikin. Springer, 2010. p. 167-178 (NATO Science for Peace and Security Series B: Physics and Biophysics).

Research output: Chapter in Book/Report/Conference proceeding › Chapter or book article › Scientific › peer-review

TY - CHAP

T1 - Low-Temperature Processes for MEMS Device Fabrication

AU - Kiihamäki, Jyrki

AU - Kattelus, Hannu

AU - Blomberg, Martti

AU - Puurunen, Riikka

AU - Laamanen, Mari

AU - Pekko, Panu

AU - Saarilahti, Jaakko

AU - Ritala, Heini

AU - Rissanen, Anna

PY - 2010

Y1 - 2010

N2 - The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.

AB - The high temperatures typical in semiconductor and conventional MEMS fabrication limit the material choices in MEMS structures. This paper reviews some of the low-temperature processes and techniques available for MEMS fabrication and describes some characteristics of these techniques and practical process examples. The techniques described are plasma-enhanced chemical vapour deposition, atomic layer deposition, reactive sputtering, vapour phase hydrofluoric acid etching of low-temperature oxides, and low-temperature wafer bonding. As a practical example of the use of these techniques, the basic characteristics of a MEMS switch and other devices fabricated at VTT are presented.

KW - MEMS

KW - thin film technology

KW - fusion bonding

KW - amorphous metals

KW - HF-vapour etching

U2 - 10.1007/978-90-481-3807-4_13

DO - 10.1007/978-90-481-3807-4_13

M3 - Chapter or book article

SN - 978-90-481-3805-0

T3 - NATO Science for Peace and Security Series B: Physics and Biophysics

SP - 167

EP - 178

BT - Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

A2 - Gusev, Evgeni

A2 - Garfunkel, Eric

A2 - Dideikin, Arthur

PB - Springer

T2 - NATO Advanced Research Workshop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

Y2 - 29 June 2009 through 2 July 2009

ER -

Kiihamäki J, Kattelus H, Blomberg M, Puurunen R, Laamanen M, Pekko P et al. Low-Temperature Processes for MEMS Device Fabrication. In Gusev E, Garfunkel E, Dideikin A, editors, Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. Springer. 2010. p. 167-178. (NATO Science for Peace and Security Series B: Physics and Biophysics). doi: 10.1007/978-90-481-3807-4_13

Low-Temperature Processes for MEMS Device Fabrication

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Keywords

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