LTCC packaging from RF to millimeter waves

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Abstract

Radio applications are utilising continuously increasing frequencies. For example, automotive radars are already used in microwave region at 24 and 77 GHz. Telecommunication systems are utilising frequencies around 60 GHz. There is a pressure on the development of both semiconductor processes and module integration. LTCC has currently widely been used in e.g. RF front-end modules for portable devices such as mobile phones. During last years LTCC has also been applied to microwave and millimetre wave modules. This paper presents the key issues of the LTCC technology for high-frequency applications. Some examples about antenna and filter modules will also be given
Original languageEnglish
Title of host publicationIMAPS Nordic Annual Conference 2011
EditorsJarkko Kutilainen
Place of PublicationFinland
PublisherCurran Associates Inc.
Pages96-101
ISBN (Print)978-161839112-4
Publication statusPublished - 2011
MoE publication typeB3 Non-refereed article in conference proceedings
EventIMAPS Nordic Annual Conference 2011 - Dipoli Congress Center, Espoo, Finland
Duration: 5 Jun 20118 Jun 2011

Conference

ConferenceIMAPS Nordic Annual Conference 2011
CountryFinland
CityEspoo
Period5/06/118/06/11

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Lahti, M., Kautio, K., Kondratyev, V., Kaunisto, M., & Vähä-Heikkilä, T. (2011). LTCC packaging from RF to millimeter waves. In J. Kutilainen (Ed.), IMAPS Nordic Annual Conference 2011 (pp. 96-101). Curran Associates Inc..