LTCC packaging from RF to millimeter waves

Markku Lahti; Kari Kautio; Vassili Kondratyev; Mikko Kaunisto; Tauno Vähä-Heikkilä

LTCC packaging from RF to millimeter waves

Markku Lahti, Kari Kautio, Vassili Kondratyev, Mikko Kaunisto, Tauno Vähä-Heikkilä

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Abstract

Radio applications are utilising continuously increasing frequencies. For example, automotive radars are already used in microwave region at 24 and 77 GHz. Telecommunication systems are utilising frequencies around 60 GHz. There is a pressure on the development of both semiconductor processes and module integration. LTCC has currently widely been used in e.g. RF front-end modules for portable devices such as mobile phones. During last years LTCC has also been applied to microwave and millimetre wave modules. This paper presents the key issues of the LTCC technology for high-frequency applications. Some examples about antenna and filter modules will also be given

Original language	English
Title of host publication	IMAPS Nordic Annual Conference 2011
Editors	Jarkko Kutilainen
Place of Publication	Finland
Publisher	Curran Associates Inc.
Pages	96-101
ISBN (Print)	978-161839112-4
Publication status	Published - 2011
MoE publication type	B3 Non-refereed article in conference proceedings
Event	IMAPS Nordic Annual Conference 2011 - Dipoli Congress Center, Espoo, Finland Duration: 5 Jun 2011 → 8 Jun 2011

Conference

Conference	IMAPS Nordic Annual Conference 2011
Country/Territory	Finland
City	Espoo
Period	5/06/11 → 8/06/11

Cite this

@inproceedings{bb3f2645b09a4054894a6890b9df06d1,

title = "LTCC packaging from RF to millimeter waves",

abstract = "Radio applications are utilising continuously increasing frequencies. For example, automotive radars are already used in microwave region at 24 and 77 GHz. Telecommunication systems are utilising frequencies around 60 GHz. There is a pressure on the development of both semiconductor processes and module integration. LTCC has currently widely been used in e.g. RF front-end modules for portable devices such as mobile phones. During last years LTCC has also been applied to microwave and millimetre wave modules. This paper presents the key issues of the LTCC technology for high-frequency applications. Some examples about antenna and filter modules will also be given",

author = "Markku Lahti and Kari Kautio and Vassili Kondratyev and Mikko Kaunisto and Tauno V{\"a}h{\"a}-Heikkil{\"a}",

year = "2011",

language = "English",

isbn = "978-161839112-4",

pages = "96--101",

editor = "Jarkko Kutilainen",

booktitle = "IMAPS Nordic Annual Conference 2011",

publisher = "Curran Associates Inc.",

address = "United States",

note = "IMAPS Nordic Annual Conference 2011 ; Conference date: 05-06-2011 Through 08-06-2011",

}

TY - GEN

T1 - LTCC packaging from RF to millimeter waves

AU - Lahti, Markku

AU - Kautio, Kari

AU - Kondratyev, Vassili

AU - Kaunisto, Mikko

AU - Vähä-Heikkilä, Tauno

PY - 2011

Y1 - 2011

N2 - Radio applications are utilising continuously increasing frequencies. For example, automotive radars are already used in microwave region at 24 and 77 GHz. Telecommunication systems are utilising frequencies around 60 GHz. There is a pressure on the development of both semiconductor processes and module integration. LTCC has currently widely been used in e.g. RF front-end modules for portable devices such as mobile phones. During last years LTCC has also been applied to microwave and millimetre wave modules. This paper presents the key issues of the LTCC technology for high-frequency applications. Some examples about antenna and filter modules will also be given

AB - Radio applications are utilising continuously increasing frequencies. For example, automotive radars are already used in microwave region at 24 and 77 GHz. Telecommunication systems are utilising frequencies around 60 GHz. There is a pressure on the development of both semiconductor processes and module integration. LTCC has currently widely been used in e.g. RF front-end modules for portable devices such as mobile phones. During last years LTCC has also been applied to microwave and millimetre wave modules. This paper presents the key issues of the LTCC technology for high-frequency applications. Some examples about antenna and filter modules will also be given

M3 - Conference article in proceedings

SN - 978-161839112-4

SP - 96

EP - 101

BT - IMAPS Nordic Annual Conference 2011

A2 - Kutilainen, Jarkko

PB - Curran Associates Inc.

CY - Finland

T2 - IMAPS Nordic Annual Conference 2011

Y2 - 5 June 2011 through 8 June 2011

ER -

LTCC packaging from RF to millimeter waves

Abstract

Conference

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