LTCC toolbox for photonics integration

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

13 Citations (Scopus)

Abstract

In photonic module integration, optoelectronic chips, micro-optical elements and integrated circuits are integrated into functional components, sub-assemblies, modules and systems. The building blocks of the photonic
system must be fabricated by the use of cost-efficient, reproducible, well-established, high-volume manufacturing technologies. The reliability of the system as well as the tolerances of device alignment are key issue in the integration. We have developed a Low Temperature Co-fired Ceramics (LTCC) toolbox for photonic integration. The primary aim was to process co-fired 3D structures, such as, grooves, cavities, holes, bumps and alignment fiducials for the passive alignment of photonic devices. LTCC provides means for full 3D integration. The tolerances of the alignment structures are typically ±5µm and in some specific cases ±2µm. LTCC structures provide means for the passive alignment of multimode fiber, for example. With Monte-Carlo tolerancing tools, we can simulate and optimize the performance of the system and estimate manufacturing yield in volume production. Thermal management by the use of thermal vias is a well-established technique; liquid cooling channels in the LTCC substrate provide efficient means for high-power laser cooling. LTCC provides
inherently hermetic substrate allowing the possibility for hermetic encapsulation. High-speed ICs as well as millimeter-wave circuits can easily be integrated into the LTCC substrate. Novel materials allow the fabrication of advanced systems, especially, for millimeter-wave operation.
Original languageEnglish
Title of host publicationIMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
Subtitle of host publicationCICMT
Number of pages12
Publication statusPublished - 2006
MoE publication typeA4 Article in a conference publication
EventIMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT - Denver, United States
Duration: 25 Apr 200627 Apr 2006
Conference number: 2

Conference

ConferenceIMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT
Abbreviated titleCICMT
CountryUnited States
CityDenver
Period25/04/0627/04/06

Fingerprint

Photonics
Millimeter waves
Temperature
Substrates
Laser cooling
Photonic devices
Multimode fibers
High power lasers
Optical devices
Encapsulation
Temperature control
Optoelectronic devices
Integrated circuits
Cooling
Fabrication
Networks (circuits)
Liquids
Costs

Keywords

  • fiber optics
  • photonic module
  • cost-efficient
  • thermal management

Cite this

Karioja, P., Keränen, K., Karppinen, M., Kautio, K., Heikkinen, V., Lahti, M., ... Heilala, J. (2006). LTCC toolbox for photonics integration. In IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies: CICMT
Karioja, Pentti ; Keränen, Kimmo ; Karppinen, Mikko ; Kautio, Kari ; Heikkinen, Veli ; Lahti, M. ; Ollila, Jyrki ; Mäkinen, Jukka-Tapani ; Kataja, Kari ; Tuominen, Jarkko ; Jaakola, Tuomo ; Park, Sang Hyun ; Korhonen, Pentti ; Alajoki, Teemu ; Tanskanen, Antti ; Lenkkeri, Jaakko ; Heilala, Juhani. / LTCC toolbox for photonics integration. IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies: CICMT. 2006.
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title = "LTCC toolbox for photonics integration",
abstract = "In photonic module integration, optoelectronic chips, micro-optical elements and integrated circuits are integrated into functional components, sub-assemblies, modules and systems. The building blocks of the photonicsystem must be fabricated by the use of cost-efficient, reproducible, well-established, high-volume manufacturing technologies. The reliability of the system as well as the tolerances of device alignment are key issue in the integration. We have developed a Low Temperature Co-fired Ceramics (LTCC) toolbox for photonic integration. The primary aim was to process co-fired 3D structures, such as, grooves, cavities, holes, bumps and alignment fiducials for the passive alignment of photonic devices. LTCC provides means for full 3D integration. The tolerances of the alignment structures are typically ±5µm and in some specific cases ±2µm. LTCC structures provide means for the passive alignment of multimode fiber, for example. With Monte-Carlo tolerancing tools, we can simulate and optimize the performance of the system and estimate manufacturing yield in volume production. Thermal management by the use of thermal vias is a well-established technique; liquid cooling channels in the LTCC substrate provide efficient means for high-power laser cooling. LTCC providesinherently hermetic substrate allowing the possibility for hermetic encapsulation. High-speed ICs as well as millimeter-wave circuits can easily be integrated into the LTCC substrate. Novel materials allow the fabrication of advanced systems, especially, for millimeter-wave operation.",
keywords = "fiber optics, photonic module, cost-efficient, thermal management",
author = "Pentti Karioja and Kimmo Ker{\"a}nen and Mikko Karppinen and Kari Kautio and Veli Heikkinen and M. Lahti and Jyrki Ollila and Jukka-Tapani M{\"a}kinen and Kari Kataja and Jarkko Tuominen and Tuomo Jaakola and Park, {Sang Hyun} and Pentti Korhonen and Teemu Alajoki and Antti Tanskanen and Jaakko Lenkkeri and Juhani Heilala",
year = "2006",
language = "English",
booktitle = "IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies",

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Karioja, P, Keränen, K, Karppinen, M, Kautio, K, Heikkinen, V, Lahti, M, Ollila, J, Mäkinen, J-T, Kataja, K, Tuominen, J, Jaakola, T, Park, SH, Korhonen, P, Alajoki, T, Tanskanen, A, Lenkkeri, J & Heilala, J 2006, LTCC toolbox for photonics integration. in IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies: CICMT. IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT, Denver, United States, 25/04/06.

LTCC toolbox for photonics integration. / Karioja, Pentti; Keränen, Kimmo; Karppinen, Mikko; Kautio, Kari; Heikkinen, Veli; Lahti, M.; Ollila, Jyrki; Mäkinen, Jukka-Tapani; Kataja, Kari; Tuominen, Jarkko; Jaakola, Tuomo; Park, Sang Hyun; Korhonen, Pentti; Alajoki, Teemu; Tanskanen, Antti; Lenkkeri, Jaakko; Heilala, Juhani.

IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies: CICMT. 2006.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - LTCC toolbox for photonics integration

AU - Karioja, Pentti

AU - Keränen, Kimmo

AU - Karppinen, Mikko

AU - Kautio, Kari

AU - Heikkinen, Veli

AU - Lahti, M.

AU - Ollila, Jyrki

AU - Mäkinen, Jukka-Tapani

AU - Kataja, Kari

AU - Tuominen, Jarkko

AU - Jaakola, Tuomo

AU - Park, Sang Hyun

AU - Korhonen, Pentti

AU - Alajoki, Teemu

AU - Tanskanen, Antti

AU - Lenkkeri, Jaakko

AU - Heilala, Juhani

PY - 2006

Y1 - 2006

N2 - In photonic module integration, optoelectronic chips, micro-optical elements and integrated circuits are integrated into functional components, sub-assemblies, modules and systems. The building blocks of the photonicsystem must be fabricated by the use of cost-efficient, reproducible, well-established, high-volume manufacturing technologies. The reliability of the system as well as the tolerances of device alignment are key issue in the integration. We have developed a Low Temperature Co-fired Ceramics (LTCC) toolbox for photonic integration. The primary aim was to process co-fired 3D structures, such as, grooves, cavities, holes, bumps and alignment fiducials for the passive alignment of photonic devices. LTCC provides means for full 3D integration. The tolerances of the alignment structures are typically ±5µm and in some specific cases ±2µm. LTCC structures provide means for the passive alignment of multimode fiber, for example. With Monte-Carlo tolerancing tools, we can simulate and optimize the performance of the system and estimate manufacturing yield in volume production. Thermal management by the use of thermal vias is a well-established technique; liquid cooling channels in the LTCC substrate provide efficient means for high-power laser cooling. LTCC providesinherently hermetic substrate allowing the possibility for hermetic encapsulation. High-speed ICs as well as millimeter-wave circuits can easily be integrated into the LTCC substrate. Novel materials allow the fabrication of advanced systems, especially, for millimeter-wave operation.

AB - In photonic module integration, optoelectronic chips, micro-optical elements and integrated circuits are integrated into functional components, sub-assemblies, modules and systems. The building blocks of the photonicsystem must be fabricated by the use of cost-efficient, reproducible, well-established, high-volume manufacturing technologies. The reliability of the system as well as the tolerances of device alignment are key issue in the integration. We have developed a Low Temperature Co-fired Ceramics (LTCC) toolbox for photonic integration. The primary aim was to process co-fired 3D structures, such as, grooves, cavities, holes, bumps and alignment fiducials for the passive alignment of photonic devices. LTCC provides means for full 3D integration. The tolerances of the alignment structures are typically ±5µm and in some specific cases ±2µm. LTCC structures provide means for the passive alignment of multimode fiber, for example. With Monte-Carlo tolerancing tools, we can simulate and optimize the performance of the system and estimate manufacturing yield in volume production. Thermal management by the use of thermal vias is a well-established technique; liquid cooling channels in the LTCC substrate provide efficient means for high-power laser cooling. LTCC providesinherently hermetic substrate allowing the possibility for hermetic encapsulation. High-speed ICs as well as millimeter-wave circuits can easily be integrated into the LTCC substrate. Novel materials allow the fabrication of advanced systems, especially, for millimeter-wave operation.

KW - fiber optics

KW - photonic module

KW - cost-efficient

KW - thermal management

M3 - Conference article in proceedings

BT - IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies

ER -

Karioja P, Keränen K, Karppinen M, Kautio K, Heikkinen V, Lahti M et al. LTCC toolbox for photonics integration. In IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies: CICMT. 2006