Magnetically coupled wireless communication for buried environmental sensor

Colm McCaffrey, Janne Häkli, Mervi Hirvonen, Ismo Huhtinen, Kaj Nummila, Timo Lehikoinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Ambient sensors are finding their way into our lives and the world around us enabling a great deal of real time environmental monitoring applications. Solid medium, like soil, compost, ice and ore, with relatively high conductivity and non-uniform dielectric properties, provide a unique challenge. One particular case where this is acutely true is black schist ore. While opaque to the propagation of high frequency electric waves, frequencies in the kHz range, and magnetic fields, are better able to penetrate these medium. This paper describes transmission characteristics for this kind of ore. It continues to show the modeling and development of a simple, cheap and low power 125 kHz inductively coupled wireless communication system and demonstrates its performance at a black schist ore mine site.
Original languageEnglish
Title of host publicationConference proceedings
Subtitle of host publication12th International Conference on Environment and Electrical Engineering, EEEIC 2013
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages341-345
ISBN (Electronic)978-1-4673-3059-6
ISBN (Print)978-1-4673-3060-2
DOIs
Publication statusPublished - 2013
MoE publication typeNot Eligible
Event12th International Conference on Environment and Electrical Engineering, EEEIC 2013 - Wroclaw, Poland
Duration: 5 May 20138 May 2013

Conference

Conference12th International Conference on Environment and Electrical Engineering, EEEIC 2013
Abbreviated titleEEEIC 2013
CountryPoland
CityWroclaw
Period5/05/138/05/13

Fingerprint

Ores
Communication
Sensors
Electromagnetic waves
Dielectric properties
Ice
Communication systems
Magnetic fields
Soils
Monitoring

Keywords

  • black schist ore
  • environmental monitoring
  • low frequency
  • magnetic coupling
  • magnetic induction
  • underground communication
  • wireless sensors

Cite this

McCaffrey, C., Häkli, J., Hirvonen, M., Huhtinen, I., Nummila, K., & Lehikoinen, T. (2013). Magnetically coupled wireless communication for buried environmental sensor. In Conference proceedings: 12th International Conference on Environment and Electrical Engineering, EEEIC 2013 (pp. 341-345). Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/EEEIC.2013.6549539
McCaffrey, Colm ; Häkli, Janne ; Hirvonen, Mervi ; Huhtinen, Ismo ; Nummila, Kaj ; Lehikoinen, Timo. / Magnetically coupled wireless communication for buried environmental sensor. Conference proceedings: 12th International Conference on Environment and Electrical Engineering, EEEIC 2013. Institute of Electrical and Electronic Engineers IEEE, 2013. pp. 341-345
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McCaffrey, C, Häkli, J, Hirvonen, M, Huhtinen, I, Nummila, K & Lehikoinen, T 2013, Magnetically coupled wireless communication for buried environmental sensor. in Conference proceedings: 12th International Conference on Environment and Electrical Engineering, EEEIC 2013. Institute of Electrical and Electronic Engineers IEEE, pp. 341-345, 12th International Conference on Environment and Electrical Engineering, EEEIC 2013, Wroclaw, Poland, 5/05/13. https://doi.org/10.1109/EEEIC.2013.6549539

Magnetically coupled wireless communication for buried environmental sensor. / McCaffrey, Colm; Häkli, Janne; Hirvonen, Mervi; Huhtinen, Ismo; Nummila, Kaj; Lehikoinen, Timo.

Conference proceedings: 12th International Conference on Environment and Electrical Engineering, EEEIC 2013. Institute of Electrical and Electronic Engineers IEEE, 2013. p. 341-345.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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McCaffrey C, Häkli J, Hirvonen M, Huhtinen I, Nummila K, Lehikoinen T. Magnetically coupled wireless communication for buried environmental sensor. In Conference proceedings: 12th International Conference on Environment and Electrical Engineering, EEEIC 2013. Institute of Electrical and Electronic Engineers IEEE. 2013. p. 341-345 https://doi.org/10.1109/EEEIC.2013.6549539