Materials for electronics by thermal spraying

Helena Ronkainen, Ulla Kanerva, Tommi Varis, Kimmo Ruusuvuori, Erja Turunen, Jani Peräntie, Jussi Putaala, Jari Juuti, Heli Jantunen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

In this paper, dielectric and conductive properties of thermally sprayed Al2O3- and Cubased coatings on steel and alumina substrates were studied. Alumina powders with nano- and micro-sized additions of Ni, NiO, TiO2, silica, and commercial glass were used in High Velocity Oxygen Fuel (HVOF) deposition. The conventional commercial copper powder and three Ag, WC and H2 -modified powders were used in Direct Write Thermal Spray (DWTS) deposition. Mixed phases of a-Al2O3 and ?-Al2O3 were found to be present in the as-deposited coatings. Sprayed alumina-based composites exhibited dielectric permittivity of 5.3-13.9 and losses of 0.002-0.178 at 1 MHz and 1 GHz while the additions tend to increase the values. Sprayed compositions with glasstype additions were found to retain a-Al2O3 crystalline phase after the deposition. Cu depositions, especially modified ones, realised by Direct Write Thermal Spray (DWTS) showed conductivity values as high as 42-56% of IACS values. The results demonstrate that ceramic and conductive coatings fabricated by thermal spray techniques show feasible properties for electrical applications, such as low-frequency components and insulation layers to be utilised in embedded 3D circuitry, in a way that is not possible through traditional manufacturing methods.
Original languageEnglish
Title of host publicationPhysical and numerical simulation of materials processing VII
EditorsL. Pentti Karjalainen, David A. Porter, Seppo A. Järvenpää
PublisherTrans Tech Publications
Pages451 - 456
DOIs
Publication statusPublished - 2013
MoE publication typeA4 Article in a conference publication
Event7th International Conference on Physical and Numerical Simulation of Materials Processing, ICPNS 2013 - Oulu, Finland
Duration: 16 Jun 201319 Jun 2013
Conference number: 7

Publication series

SeriesMaterials Science Forum
Volume762
ISSN0255-5476

Conference

Conference7th International Conference on Physical and Numerical Simulation of Materials Processing, ICPNS 2013
Abbreviated titleICPNS 2013
CountryFinland
CityOulu
Period16/06/1319/06/13

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Keywords

  • conductivity
  • dielectric properties
  • direct write thermal spray
  • HVOF
  • thermal spraying

Cite this

Ronkainen, H., Kanerva, U., Varis, T., Ruusuvuori, K., Turunen, E., Peräntie, J., Putaala, J., Juuti, J., & Jantunen, H. (2013). Materials for electronics by thermal spraying. In L. P. Karjalainen, D. A. Porter, & S. A. Järvenpää (Eds.), Physical and numerical simulation of materials processing VII (pp. 451 - 456). Trans Tech Publications. Materials Science Forum, Vol.. 762 https://doi.org/10.4028/www.scientific.net/MSF.762.451