Measuring and modelling the thermal behavior of LEDs in structural electronics

Esa Hannila; Noora Heinilehto; Janne Lauri; Kimmo Keränen; Tapio Fabritius

doi:10.1109/I2MTC43012.2020.9128941

Measuring and modelling the thermal behavior of LEDs in structural electronics

Esa Hannila, Noora Heinilehto, Janne Lauri, Kimmo Keränen, Tapio Fabritius

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

Structural electronics consists of printed electronics and silicon-based rigid electronics and load-bearing supporting parts of a device (plastic, glass etc.). One interesting example of structural electronics is large area elements in which light emitting diodes (LEDs) are embedded into the glass laminate. LEDs are used as light sources to create i.e. smart surfaces for the architectural and automotive industry. Once the LEDs are embedded into the structure, they undergo the high temperature conditions and stresses, which are known to have an impact on their lifetime. Many of these aspects are not known for structural electronics. In this study, a thermal simulation model for surface mounted LED on polymer substrate was designed in Comsol Multiphysics -simulation software and the validity of it was evaluated with T3ster measurements. According to measurements, the simulation model is accurate and temperature variations between the simulation and the measurement results was less than 1.0 %. Developed model could be used as a basis for designing the structural LED elements and evaluating their performance characteristics in different user cases.

Original language	English
Title of host publication	2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)
Publisher	IEEE Institute of Electrical and Electronic Engineers
Number of pages	6
ISBN (Electronic)	978-1-7281-4460-3
ISBN (Print)	978-1-7281-4461-0
DOIs	https://doi.org/10.1109/I2MTC43012.2020.9128941
Publication status	Published - 2020
MoE publication type	A4 Article in a conference publication
Event	2020 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2020 - Dubrovnik, Croatia Duration: 25 May 2020 → 29 May 2020

Conference

Conference	2020 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2020
Country	Croatia
City	Dubrovnik
Period	25/05/20 → 29/05/20

Keywords

Hybrid electronics
Junction temperature
Model verification
Printed electronics

Access to Document

10.1109/I2MTC43012.2020.9128941

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Hannila, E., Heinilehto, N., Lauri, J., Keränen, K., & Fabritius, T. (2020). Measuring and modelling the thermal behavior of LEDs in structural electronics. In 2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/I2MTC43012.2020.9128941

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abstract = "Structural electronics consists of printed electronics and silicon-based rigid electronics and load-bearing supporting parts of a device (plastic, glass etc.). One interesting example of structural electronics is large area elements in which light emitting diodes (LEDs) are embedded into the glass laminate. LEDs are used as light sources to create i.e. smart surfaces for the architectural and automotive industry. Once the LEDs are embedded into the structure, they undergo the high temperature conditions and stresses, which are known to have an impact on their lifetime. Many of these aspects are not known for structural electronics. In this study, a thermal simulation model for surface mounted LED on polymer substrate was designed in Comsol Multiphysics -simulation software and the validity of it was evaluated with T3ster measurements. According to measurements, the simulation model is accurate and temperature variations between the simulation and the measurement results was less than 1.0 %. Developed model could be used as a basis for designing the structural LED elements and evaluating their performance characteristics in different user cases.",

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author = "Esa Hannila and Noora Heinilehto and Janne Lauri and Kimmo Ker{\"a}nen and Tapio Fabritius",

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Hannila, E, Heinilehto, N, Lauri, J, Keränen, K & Fabritius, T 2020, Measuring and modelling the thermal behavior of LEDs in structural electronics. in 2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC). IEEE Institute of Electrical and Electronic Engineers, 2020 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2020, Dubrovnik, Croatia, 25/05/20. https://doi.org/10.1109/I2MTC43012.2020.9128941

Measuring and modelling the thermal behavior of LEDs in structural electronics. / Hannila, Esa; Heinilehto, Noora; Lauri, Janne; Keränen, Kimmo; Fabritius, Tapio.

2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC). IEEE Institute of Electrical and Electronic Engineers, 2020.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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