Measuring and modelling the thermal behavior of LEDs in structural electronics

Esa Hannila, Noora Heinilehto, Janne Lauri, Kimmo Keränen, Tapio Fabritius

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Structural electronics consists of printed electronics and silicon-based rigid electronics and load-bearing supporting parts of a device (plastic, glass etc.). One interesting example of structural electronics is large area elements in which light emitting diodes (LEDs) are embedded into the glass laminate. LEDs are used as light sources to create i.e. smart surfaces for the architectural and automotive industry. Once the LEDs are embedded into the structure, they undergo the high temperature conditions and stresses, which are known to have an impact on their lifetime. Many of these aspects are not known for structural electronics. In this study, a thermal simulation model for surface mounted LED on polymer substrate was designed in Comsol Multiphysics -simulation software and the validity of it was evaluated with T3ster measurements. According to measurements, the simulation model is accurate and temperature variations between the simulation and the measurement results was less than 1.0 %. Developed model could be used as a basis for designing the structural LED elements and evaluating their performance characteristics in different user cases.

Original languageEnglish
Title of host publication2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)
PublisherIEEE Institute of Electrical and Electronic Engineers
Number of pages6
ISBN (Electronic)978-1-7281-4460-3
ISBN (Print)978-1-7281-4461-0
DOIs
Publication statusPublished - 2020
MoE publication typeA4 Article in a conference publication
Event2020 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2020 - Dubrovnik, Croatia
Duration: 25 May 202029 May 2020

Conference

Conference2020 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2020
CountryCroatia
CityDubrovnik
Period25/05/2029/05/20

Keywords

  • Hybrid electronics
  • Junction temperature
  • Model verification
  • Printed electronics

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  • Cite this

    Hannila, E., Heinilehto, N., Lauri, J., Keränen, K., & Fabritius, T. (2020). Measuring and modelling the thermal behavior of LEDs in structural electronics. In 2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/I2MTC43012.2020.9128941