Mechanically decoupled surface micromechanical element and method for manufacturing the same

Aarne Oja; Jaakko Saarilahti

Mechanically decoupled surface micromechanical element and method for manufacturing the same

Aarne Oja (Inventor), Jaakko Saarilahti (Inventor)

Research output: Patent › Patent

Abstract

The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.

Patent family as of 10.12.2021
DE602017016524 D1 20200604 DE201760016524T 20170502
EP3452406 A1 20190313 EP20170725290 20170502
EP3452406 B1 20200513 EP20170725290 20170502
US10807861 BB 20201020 US20170096735 20170502
US2019119102 AA 20190425 US20170096735 20170502
US2021002127 AA 20210107 US20200027751 20200922
WO17191365 A1 20171109 WO2017FI50337 20170502

Link to currentpatent family on right

Original language	English
Patent number	EP3452406
IPC	B81B 7/ 00 A I
Priority date	2/05/17
Publication status	Published - 13 Mar 2019
MoE publication type	H1 Granted patent

Cite this

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abstract = " The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.Patent family as of 10.12.2021DE602017016524 D1 20200604 DE201760016524T 20170502 EP3452406 A1 20190313 EP20170725290 20170502 EP3452406 B1 20200513 EP20170725290 20170502 US10807861 BB 20201020 US20170096735 20170502 US2019119102 AA 20190425 US20170096735 20170502 US2021002127 AA 20210107 US20200027751 20200922 WO17191365 A1 20171109 WO2017FI50337 20170502Link to currentpatent family on right ",

author = "Aarne Oja and Jaakko Saarilahti",

year = "2019",

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day = "13",

language = "English",

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T1 - Mechanically decoupled surface micromechanical element and method for manufacturing the same

AU - Oja, Aarne

AU - Saarilahti, Jaakko

PY - 2019/3/13

Y1 - 2019/3/13

N2 - The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.Patent family as of 10.12.2021DE602017016524 D1 20200604 DE201760016524T 20170502 EP3452406 A1 20190313 EP20170725290 20170502 EP3452406 B1 20200513 EP20170725290 20170502 US10807861 BB 20201020 US20170096735 20170502 US2019119102 AA 20190425 US20170096735 20170502 US2021002127 AA 20210107 US20200027751 20200922 WO17191365 A1 20171109 WO2017FI50337 20170502Link to currentpatent family on right

AB - The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.Patent family as of 10.12.2021DE602017016524 D1 20200604 DE201760016524T 20170502 EP3452406 A1 20190313 EP20170725290 20170502 EP3452406 B1 20200513 EP20170725290 20170502 US10807861 BB 20201020 US20170096735 20170502 US2019119102 AA 20190425 US20170096735 20170502 US2021002127 AA 20210107 US20200027751 20200922 WO17191365 A1 20171109 WO2017FI50337 20170502Link to currentpatent family on right

UR - https://worldwide.espacenet.com/patent/search/family/058765861/publication/EP3452406A1?q=EP3452406

M3 - Patent

M1 - EP3452406

ER -

Mechanically decoupled surface micromechanical element and method for manufacturing the same

Abstract

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