Mechanically decoupled surface micromechanical element and method for manufacturing the same

Aarne Oja (Inventor), Jaakko Saarilahti (Inventor)

    Research output: PatentPatent


    The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.

    Patent family as of 10.12.2021
    DE602017016524 D1 20200604 DE201760016524T 20170502      
    EP3452406 A1 20190313 EP20170725290 20170502      
    EP3452406 B1 20200513 EP20170725290 20170502      
    US10807861 BB 20201020 US20170096735 20170502      
    US2019119102 AA 20190425 US20170096735 20170502      
    US2021002127 AA 20210107 US20200027751 20200922      
    WO17191365 A1 20171109 WO2017FI50337 20170502

    Link to currentpatent family on right 

    Original languageEnglish
    Patent numberEP3452406
    IPCB81B 7/ 00 A I
    Priority date2/05/17
    Publication statusPublished - 13 Mar 2019
    MoE publication typeH1 Granted patent


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