MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

5 Citations (Scopus)

Abstract

In order to fulfill the specifications of photonic systems, various optoelectronic chips, MEMS, MOEMS and RF-MEMS devices, micro-optical elements and integrated circuits needs to be integrated into functional components, modules and systems. The sub-systems of the photonic system must be fabricated by the use of cost-efficient, reproducible, well-established, high-volume manufacturing technologies. The functionality of the system is outlined by the combination of the functionalities of individual devices. The performance of the system, however, is defined by packaging and integration methods and configurations. Low temperature cofired ceramics (LTCC) is one of our key technology assets for photonics and MEMS/MOEMS/RF-MEMS packaging. In photonics integration, the tolerance of device alignment is the key issue of integration. In order to be able to use mass-manufacturing tools, the primary aim is to process 3D structures, such as, grooves, cavities, holes, bumps and alignment fiducials, which can be used for the passive alignment of devices. The tolerances of LTCC structures are typically ±5μm and in some specific cases ±2μm. Therefore, LTCC provides means for the passive alignment of multimode fiber as well as MOEMS devices. Thermal management by the use of thermal vias in LTCC is a well-established technique, and liquid cooling channels in the LTCC substrate provide efficient additional means for high-power laser cooling. When targeting for thermally controlled systems, thermal bridge structures can be used to isolate critical devices from main structures. LTCC provides inherently hermetic substrate allowing for the possibility to hermetic encapsulation. Hermetic fiber feed throughs and transparent windows can be integrated in LTCC structures. Cavities, channels and sealed gas cells can be fabricated, also. RF antennas and coil structures for electro-magnetic field control can be integrated in the LTCC substrate. Therefore, 3D packaging of MEMS, MOEMS and photonic devices is enabled by LTCC.
Original languageEnglish
Title of host publicationProceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014
PublisherInstitute of Electrical and Electronic Engineers IEEE
Number of pages6
ISBN (Electronic)978-1-4799-4026-4
DOIs
Publication statusPublished - 2014
MoE publication typeA4 Article in a conference publication
Event5th Electronics System-Integration Technology Conference, ESTC 2014 - Helsinki, Finland
Duration: 16 Sep 201418 Sep 2014
Conference number: 5th

Conference

Conference5th Electronics System-Integration Technology Conference, ESTC 2014
Abbreviated titleESTC 2014
CountryFinland
CityHelsinki
Period16/09/1418/09/14

Fingerprint

MOEMS
Photonics
MEMS
Packaging
Temperature
Substrates
Laser cooling
Photonic devices
Multimode fibers
High power lasers
Optical devices
Encapsulation
Temperature control
Optoelectronic devices
Electromagnetic fields
Integrated circuits
Antennas
Cooling
Specifications

Cite this

Karioja, P., Kautio, K., Ollila, J., Keränen, K., Karppinen, M., Heikkinen, V., ... Lahti, M. (2014). MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology. In Proceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014 Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/ESTC.2014.6962731
Karioja, Pentti ; Kautio, Kari ; Ollila, Jyrki ; Keränen, Kimmo ; Karppinen, Mikko ; Heikkinen, Veli ; Jaakola, Tuomo ; Lahti, Markku. / MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology. Proceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014. Institute of Electrical and Electronic Engineers IEEE, 2014.
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abstract = "In order to fulfill the specifications of photonic systems, various optoelectronic chips, MEMS, MOEMS and RF-MEMS devices, micro-optical elements and integrated circuits needs to be integrated into functional components, modules and systems. The sub-systems of the photonic system must be fabricated by the use of cost-efficient, reproducible, well-established, high-volume manufacturing technologies. The functionality of the system is outlined by the combination of the functionalities of individual devices. The performance of the system, however, is defined by packaging and integration methods and configurations. Low temperature cofired ceramics (LTCC) is one of our key technology assets for photonics and MEMS/MOEMS/RF-MEMS packaging. In photonics integration, the tolerance of device alignment is the key issue of integration. In order to be able to use mass-manufacturing tools, the primary aim is to process 3D structures, such as, grooves, cavities, holes, bumps and alignment fiducials, which can be used for the passive alignment of devices. The tolerances of LTCC structures are typically ±5μm and in some specific cases ±2μm. Therefore, LTCC provides means for the passive alignment of multimode fiber as well as MOEMS devices. Thermal management by the use of thermal vias in LTCC is a well-established technique, and liquid cooling channels in the LTCC substrate provide efficient additional means for high-power laser cooling. When targeting for thermally controlled systems, thermal bridge structures can be used to isolate critical devices from main structures. LTCC provides inherently hermetic substrate allowing for the possibility to hermetic encapsulation. Hermetic fiber feed throughs and transparent windows can be integrated in LTCC structures. Cavities, channels and sealed gas cells can be fabricated, also. RF antennas and coil structures for electro-magnetic field control can be integrated in the LTCC substrate. Therefore, 3D packaging of MEMS, MOEMS and photonic devices is enabled by LTCC.",
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Karioja, P, Kautio, K, Ollila, J, Keränen, K, Karppinen, M, Heikkinen, V, Jaakola, T & Lahti, M 2014, MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology. in Proceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014. Institute of Electrical and Electronic Engineers IEEE, 5th Electronics System-Integration Technology Conference, ESTC 2014, Helsinki, Finland, 16/09/14. https://doi.org/10.1109/ESTC.2014.6962731

MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology. / Karioja, Pentti; Kautio, Kari; Ollila, Jyrki; Keränen, Kimmo; Karppinen, Mikko; Heikkinen, Veli; Jaakola, Tuomo; Lahti, Markku.

Proceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014. Institute of Electrical and Electronic Engineers IEEE, 2014.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Karioja, Pentti

AU - Kautio, Kari

AU - Ollila, Jyrki

AU - Keränen, Kimmo

AU - Karppinen, Mikko

AU - Heikkinen, Veli

AU - Jaakola, Tuomo

AU - Lahti, Markku

PY - 2014

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N2 - In order to fulfill the specifications of photonic systems, various optoelectronic chips, MEMS, MOEMS and RF-MEMS devices, micro-optical elements and integrated circuits needs to be integrated into functional components, modules and systems. The sub-systems of the photonic system must be fabricated by the use of cost-efficient, reproducible, well-established, high-volume manufacturing technologies. The functionality of the system is outlined by the combination of the functionalities of individual devices. The performance of the system, however, is defined by packaging and integration methods and configurations. Low temperature cofired ceramics (LTCC) is one of our key technology assets for photonics and MEMS/MOEMS/RF-MEMS packaging. In photonics integration, the tolerance of device alignment is the key issue of integration. In order to be able to use mass-manufacturing tools, the primary aim is to process 3D structures, such as, grooves, cavities, holes, bumps and alignment fiducials, which can be used for the passive alignment of devices. The tolerances of LTCC structures are typically ±5μm and in some specific cases ±2μm. Therefore, LTCC provides means for the passive alignment of multimode fiber as well as MOEMS devices. Thermal management by the use of thermal vias in LTCC is a well-established technique, and liquid cooling channels in the LTCC substrate provide efficient additional means for high-power laser cooling. When targeting for thermally controlled systems, thermal bridge structures can be used to isolate critical devices from main structures. LTCC provides inherently hermetic substrate allowing for the possibility to hermetic encapsulation. Hermetic fiber feed throughs and transparent windows can be integrated in LTCC structures. Cavities, channels and sealed gas cells can be fabricated, also. RF antennas and coil structures for electro-magnetic field control can be integrated in the LTCC substrate. Therefore, 3D packaging of MEMS, MOEMS and photonic devices is enabled by LTCC.

AB - In order to fulfill the specifications of photonic systems, various optoelectronic chips, MEMS, MOEMS and RF-MEMS devices, micro-optical elements and integrated circuits needs to be integrated into functional components, modules and systems. The sub-systems of the photonic system must be fabricated by the use of cost-efficient, reproducible, well-established, high-volume manufacturing technologies. The functionality of the system is outlined by the combination of the functionalities of individual devices. The performance of the system, however, is defined by packaging and integration methods and configurations. Low temperature cofired ceramics (LTCC) is one of our key technology assets for photonics and MEMS/MOEMS/RF-MEMS packaging. In photonics integration, the tolerance of device alignment is the key issue of integration. In order to be able to use mass-manufacturing tools, the primary aim is to process 3D structures, such as, grooves, cavities, holes, bumps and alignment fiducials, which can be used for the passive alignment of devices. The tolerances of LTCC structures are typically ±5μm and in some specific cases ±2μm. Therefore, LTCC provides means for the passive alignment of multimode fiber as well as MOEMS devices. Thermal management by the use of thermal vias in LTCC is a well-established technique, and liquid cooling channels in the LTCC substrate provide efficient additional means for high-power laser cooling. When targeting for thermally controlled systems, thermal bridge structures can be used to isolate critical devices from main structures. LTCC provides inherently hermetic substrate allowing for the possibility to hermetic encapsulation. Hermetic fiber feed throughs and transparent windows can be integrated in LTCC structures. Cavities, channels and sealed gas cells can be fabricated, also. RF antennas and coil structures for electro-magnetic field control can be integrated in the LTCC substrate. Therefore, 3D packaging of MEMS, MOEMS and photonic devices is enabled by LTCC.

U2 - 10.1109/ESTC.2014.6962731

DO - 10.1109/ESTC.2014.6962731

M3 - Conference article in proceedings

BT - Proceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014

PB - Institute of Electrical and Electronic Engineers IEEE

ER -

Karioja P, Kautio K, Ollila J, Keränen K, Karppinen M, Heikkinen V et al. MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology. In Proceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014. Institute of Electrical and Electronic Engineers IEEE. 2014 https://doi.org/10.1109/ESTC.2014.6962731