Mems packaging using precision machined LTCC substrates

Veli Heikkinen; Janne Aikio; Teemu Alajoki; Jussi Hiltunen; Mattila Antti-Jussi; Jyrki Ollila; Pentti Karioja

doi:10.1109/OMEMS.2003.1233477

Mems packaging using precision machined LTCC substrates

Veli Heikkinen, Janne Aikio, Teemu Alajoki, Jussi Hiltunen, Mattila Antti-Jussi, Jyrki Ollila, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

1 Citation (Scopus)

Original language	English
Title of host publication	IEEE/LEOS International Conference on Optical MEMS
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	81-82
ISBN (Print)	0-7803-7830-X
DOIs	https://doi.org/10.1109/OMEMS.2003.1233477
Publication status	Published - 2003
MoE publication type	A4 Article in a conference publication
Event	International Conference on Optical MEMS, MOEMS 2003 - Waikoloa, United States Duration: 18 Aug 2003 → 21 Aug 2003

Conference

Conference	International Conference on Optical MEMS, MOEMS 2003
Abbreviated title	MOEMS 2003
Country	United States
City	Waikoloa
Period	18/08/03 → 21/08/03

Keywords

micromechanical devices
optical surface waves
micromaching
MEMS packaging
LTCC substrates

Access to Document

10.1109/OMEMS.2003.1233477

Cite this

@inproceedings{092c52eba99c4290b64e79fa15f20cde,

title = "Mems packaging using precision machined LTCC substrates",

keywords = "micromechanical devices, optical surface waves, micromaching, MEMS packaging, LTCC substrates",

author = "Veli Heikkinen and Janne Aikio and Teemu Alajoki and Jussi Hiltunen and Mattila Antti-Jussi and Jyrki Ollila and Pentti Karioja",

year = "2003",

doi = "10.1109/OMEMS.2003.1233477",

language = "English",

isbn = "0-7803-7830-X",

pages = "81--82",

booktitle = "IEEE/LEOS International Conference on Optical MEMS",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "International Conference on Optical MEMS, MOEMS 2003, MOEMS 2003 ; Conference date: 18-08-2003 Through 21-08-2003",

}

Heikkinen, V, Aikio, J, Alajoki, T , Hiltunen, J, Antti-Jussi, M, Ollila, J & Karioja, P 2003, Mems packaging using precision machined LTCC substrates. in IEEE/LEOS International Conference on Optical MEMS. IEEE Institute of Electrical and Electronic Engineers, pp. 81-82, International Conference on Optical MEMS, MOEMS 2003, Waikoloa, United States, 18/08/03. https://doi.org/10.1109/OMEMS.2003.1233477

Mems packaging using precision machined LTCC substrates. / Heikkinen, Veli; Aikio, Janne; Alajoki, Teemu ; Hiltunen, Jussi; Antti-Jussi, Mattila; Ollila, Jyrki ; Karioja, Pentti.

IEEE/LEOS International Conference on Optical MEMS. IEEE Institute of Electrical and Electronic Engineers, 2003. p. 81-82.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Mems packaging using precision machined LTCC substrates

AU - Heikkinen, Veli

AU - Aikio, Janne

AU - Alajoki, Teemu

AU - Hiltunen, Jussi

AU - Antti-Jussi, Mattila

AU - Ollila, Jyrki

AU - Karioja, Pentti

PY - 2003

Y1 - 2003

KW - micromechanical devices

KW - optical surface waves

KW - micromaching

KW - MEMS packaging

KW - LTCC substrates

U2 - 10.1109/OMEMS.2003.1233477

DO - 10.1109/OMEMS.2003.1233477

M3 - Conference article in proceedings

SN - 0-7803-7830-X

SP - 81

EP - 82

BT - IEEE/LEOS International Conference on Optical MEMS

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - International Conference on Optical MEMS, MOEMS 2003

Y2 - 18 August 2003 through 21 August 2003

ER -