| Original language | English |
|---|---|
| Title of host publication | IEEE/LEOS International Conference on Optical MEMS |
| Publisher | Institute of Electrical and Electronic Engineers IEEE |
| Pages | 81-82 |
| ISBN (Print) | 0-7803-7830-X |
| DOIs | |
| Publication status | Published - 2003 |
| MoE publication type | A4 Article in a conference publication |
| Event | International Conference on Optical MEMS, MOEMS 2003 - Waikoloa, United States Duration: 18 Aug 2003 → 21 Aug 2003 |
Conference
| Conference | International Conference on Optical MEMS, MOEMS 2003 |
|---|---|
| Abbreviated title | MOEMS 2003 |
| Country | United States |
| City | Waikoloa |
| Period | 18/08/03 → 21/08/03 |
Keywords
- micromechanical devices
- optical surface waves
- micromaching
- MEMS packaging
- LTCC substrates
Cite this
}
Mems packaging using precision machined LTCC substrates. / Heikkinen, Veli; Aikio, Janne; Alajoki, Teemu; Hiltunen, Jussi; Antti-Jussi, Mattila; Ollila, Jyrki; Karioja, Pentti.
IEEE/LEOS International Conference on Optical MEMS. Institute of Electrical and Electronic Engineers IEEE, 2003. p. 81-82.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Mems packaging using precision machined LTCC substrates
AU - Heikkinen, Veli
AU - Aikio, Janne
AU - Alajoki, Teemu
AU - Hiltunen, Jussi
AU - Antti-Jussi, Mattila
AU - Ollila, Jyrki
AU - Karioja, Pentti
PY - 2003
Y1 - 2003
KW - micromechanical devices
KW - optical surface waves
KW - micromaching
KW - MEMS packaging
KW - LTCC substrates
U2 - 10.1109/OMEMS.2003.1233477
DO - 10.1109/OMEMS.2003.1233477
M3 - Conference article in proceedings
SN - 0-7803-7830-X
SP - 81
EP - 82
BT - IEEE/LEOS International Conference on Optical MEMS
PB - Institute of Electrical and Electronic Engineers IEEE
ER -