Mems packaging using precision machined LTCC substrates

Veli Heikkinen, Janne Aikio, Teemu Alajoki, Jussi Hiltunen, Mattila Antti-Jussi, Jyrki Ollila, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationIEEE/LEOS International Conference on Optical MEMS
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages81-82
ISBN (Print)0-7803-7830-X
DOIs
Publication statusPublished - 2003
MoE publication typeA4 Article in a conference publication
EventInternational Conference on Optical MEMS, MOEMS 2003 - Waikoloa, United States
Duration: 18 Aug 200321 Aug 2003

Conference

ConferenceInternational Conference on Optical MEMS, MOEMS 2003
Abbreviated titleMOEMS 2003
CountryUnited States
CityWaikoloa
Period18/08/0321/08/03

Keywords

  • micromechanical devices
  • optical surface waves
  • micromaching
  • MEMS packaging
  • LTCC substrates

Cite this

Heikkinen, V., Aikio, J., Alajoki, T., Hiltunen, J., Antti-Jussi, M., Ollila, J., & Karioja, P. (2003). Mems packaging using precision machined LTCC substrates. In IEEE/LEOS International Conference on Optical MEMS (pp. 81-82). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/OMEMS.2003.1233477