Mems packaging using precision machined LTCC substrates

Veli Heikkinen, Janne Aikio, Teemu Alajoki, Jussi Hiltunen, Mattila Antti-Jussi, Jyrki Ollila, Pentti Karioja

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)


    The use of low-temperature co-fired ceramic (LTCC) substrate as a wiring board for a silicon surface micromachined Fabry-Perot interferometer (FPI) device is presented. FPI is an electrically controlled optical bandpass filter that is widely used in spectroscopy. In this paper, the FPI device is applied to demonstrate a wavelength tunable diode laser in an external cavity configuration.
    Original languageEnglish
    Title of host publicationIEEE/LEOS International Conference on Optical MEMS (MOEMS 2003)
    PublisherIEEE Institute of Electrical and Electronic Engineers
    ISBN (Print)978-0-7803-7830-8
    Publication statusPublished - 2003
    MoE publication typeA4 Article in a conference publication
    EventInternational Conference on Optical MEMS, MOEMS 2003 - Waikoloa, United States
    Duration: 18 Aug 200321 Aug 2003


    ConferenceInternational Conference on Optical MEMS, MOEMS 2003
    Abbreviated titleMOEMS 2003
    Country/TerritoryUnited States


    • micromechanical devices
    • optical surface waves
    • micromaching
    • MEMS packaging
    • LTCC substrates


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