Mems packaging using precision machined LTCC substrates

Veli Heikkinen, Janne Aikio, Teemu Alajoki, Jussi Hiltunen, Mattila Antti-Jussi, Jyrki Ollila, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationIEEE/LEOS International Conference on Optical MEMS
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages81-82
ISBN (Print)0-7803-7830-X
DOIs
Publication statusPublished - 2003
MoE publication typeA4 Article in a conference publication
EventInternational Conference on Optical MEMS, MOEMS 2003 - Waikoloa, United States
Duration: 18 Aug 200321 Aug 2003

Conference

ConferenceInternational Conference on Optical MEMS, MOEMS 2003
Abbreviated titleMOEMS 2003
CountryUnited States
CityWaikoloa
Period18/08/0321/08/03

Keywords

  • micromechanical devices
  • optical surface waves
  • micromaching
  • MEMS packaging
  • LTCC substrates

Cite this

Heikkinen, V., Aikio, J., Alajoki, T., Hiltunen, J., Antti-Jussi, M., Ollila, J., & Karioja, P. (2003). Mems packaging using precision machined LTCC substrates. In IEEE/LEOS International Conference on Optical MEMS (pp. 81-82). Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/OMEMS.2003.1233477
Heikkinen, Veli ; Aikio, Janne ; Alajoki, Teemu ; Hiltunen, Jussi ; Antti-Jussi, Mattila ; Ollila, Jyrki ; Karioja, Pentti. / Mems packaging using precision machined LTCC substrates. IEEE/LEOS International Conference on Optical MEMS. Institute of Electrical and Electronic Engineers IEEE, 2003. pp. 81-82
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title = "Mems packaging using precision machined LTCC substrates",
keywords = "micromechanical devices, optical surface waves, micromaching, MEMS packaging, LTCC substrates",
author = "Veli Heikkinen and Janne Aikio and Teemu Alajoki and Jussi Hiltunen and Mattila Antti-Jussi and Jyrki Ollila and Pentti Karioja",
year = "2003",
doi = "10.1109/OMEMS.2003.1233477",
language = "English",
isbn = "0-7803-7830-X",
pages = "81--82",
booktitle = "IEEE/LEOS International Conference on Optical MEMS",
publisher = "Institute of Electrical and Electronic Engineers IEEE",
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}

Heikkinen, V, Aikio, J, Alajoki, T, Hiltunen, J, Antti-Jussi, M, Ollila, J & Karioja, P 2003, Mems packaging using precision machined LTCC substrates. in IEEE/LEOS International Conference on Optical MEMS. Institute of Electrical and Electronic Engineers IEEE, pp. 81-82, International Conference on Optical MEMS, MOEMS 2003, Waikoloa, United States, 18/08/03. https://doi.org/10.1109/OMEMS.2003.1233477

Mems packaging using precision machined LTCC substrates. / Heikkinen, Veli; Aikio, Janne; Alajoki, Teemu; Hiltunen, Jussi; Antti-Jussi, Mattila; Ollila, Jyrki; Karioja, Pentti.

IEEE/LEOS International Conference on Optical MEMS. Institute of Electrical and Electronic Engineers IEEE, 2003. p. 81-82.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Mems packaging using precision machined LTCC substrates

AU - Heikkinen, Veli

AU - Aikio, Janne

AU - Alajoki, Teemu

AU - Hiltunen, Jussi

AU - Antti-Jussi, Mattila

AU - Ollila, Jyrki

AU - Karioja, Pentti

PY - 2003

Y1 - 2003

KW - micromechanical devices

KW - optical surface waves

KW - micromaching

KW - MEMS packaging

KW - LTCC substrates

U2 - 10.1109/OMEMS.2003.1233477

DO - 10.1109/OMEMS.2003.1233477

M3 - Conference article in proceedings

SN - 0-7803-7830-X

SP - 81

EP - 82

BT - IEEE/LEOS International Conference on Optical MEMS

PB - Institute of Electrical and Electronic Engineers IEEE

ER -

Heikkinen V, Aikio J, Alajoki T, Hiltunen J, Antti-Jussi M, Ollila J et al. Mems packaging using precision machined LTCC substrates. In IEEE/LEOS International Conference on Optical MEMS. Institute of Electrical and Electronic Engineers IEEE. 2003. p. 81-82 https://doi.org/10.1109/OMEMS.2003.1233477