MEMS sensor packaging using LTCC substrate technology

Harri Kopola (Corresponding author), Jaakko Lenkkeri, Kari Kautio, Altti Torkkeli, Outi Rusanen, Tuomo Jaakola

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

11 Citations (Scopus)
Original languageEnglish
Title of host publicationDevice and Process Technologies for MEMS and Microelectronics II
PublisherInternational Society for Optics and Photonics SPIE
Pages148-158
DOIs
Publication statusPublished - 2001
MoE publication typeB3 Non-refereed article in conference proceedings
Event International Symposium on Microelectronics and MEMS 2001 - Adelaide, Australia
Duration: 17 Dec 200119 Dec 2001

Publication series

SeriesProceedings of SPIE
Volume4592
ISSN0277-786X

Conference

Conference International Symposium on Microelectronics and MEMS 2001
CountryAustralia
CityAdelaide
Period17/12/0119/12/01

Cite this

Kopola, H., Lenkkeri, J., Kautio, K., Torkkeli, A., Rusanen, O., & Jaakola, T. (2001). MEMS sensor packaging using LTCC substrate technology. In Device and Process Technologies for MEMS and Microelectronics II (pp. 148-158). International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 4592 https://doi.org/10.1117/12.448960