MEMS sensor packaging using LTCC substrate technology

Harri Kopola; Jaakko Lenkkeri; Kari Kautio; Altti Torkkeli; Outi Rusanen; Tuomo Jaakola

doi:10.1117/12.448960

MEMS sensor packaging using LTCC substrate technology

Harri Kopola^*, Jaakko Lenkkeri, Kari Kautio, Altti Torkkeli, Outi Rusanen, Tuomo Jaakola

^*Corresponding author for this work

Nokia Oyj

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

12 Citations (Scopus)

Original language	English
Title of host publication	Device and Process Technologies for MEMS and Microelectronics II
Publisher	International Society for Optics and Photonics SPIE
Pages	148-158
DOIs	https://doi.org/10.1117/12.448960
Publication status	Published - 2001
MoE publication type	B3 Non-refereed article in conference proceedings
Event	International Symposium on Microelectronics and MEMS 2001 - Adelaide, Australia Duration: 17 Dec 2001 → 19 Dec 2001

Publication series

Series	Proceedings of SPIE
Volume	4592
ISSN	0277-786X

Conference

Conference	International Symposium on Microelectronics and MEMS 2001
Country/Territory	Australia
City	Adelaide
Period	17/12/01 → 19/12/01

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1117/12.448960

Cite this

@inproceedings{ada1ff53c4b84fb89ffe73d38ed6c281,

title = "MEMS sensor packaging using LTCC substrate technology",

author = "Harri Kopola and Jaakko Lenkkeri and Kari Kautio and Altti Torkkeli and Outi Rusanen and Tuomo Jaakola",

year = "2001",

doi = "10.1117/12.448960",

language = "English",

series = "Proceedings of SPIE",

publisher = "International Society for Optics and Photonics SPIE",

pages = "148--158",

booktitle = "Device and Process Technologies for MEMS and Microelectronics II",

address = "United States",

note = " International Symposium on Microelectronics and MEMS 2001 ; Conference date: 17-12-2001 Through 19-12-2001",

}

Kopola, H, Lenkkeri, J, Kautio, K, Torkkeli, A, Rusanen, O & Jaakola, T 2001, MEMS sensor packaging using LTCC substrate technology. in Device and Process Technologies for MEMS and Microelectronics II. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 4592, pp. 148-158, International Symposium on Microelectronics and MEMS 2001, Adelaide, Australia, 17/12/01. https://doi.org/10.1117/12.448960

MEMS sensor packaging using LTCC substrate technology. / Kopola, Harri; Lenkkeri, Jaakko; Kautio, Kari et al.
Device and Process Technologies for MEMS and Microelectronics II. International Society for Optics and Photonics SPIE, 2001. p. 148-158 (Proceedings of SPIE, Vol. 4592).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

T1 - MEMS sensor packaging using LTCC substrate technology

AU - Kopola, Harri

AU - Lenkkeri, Jaakko

AU - Kautio, Kari

AU - Torkkeli, Altti

AU - Rusanen, Outi

AU - Jaakola, Tuomo

PY - 2001

Y1 - 2001

U2 - 10.1117/12.448960

DO - 10.1117/12.448960

M3 - Conference article in proceedings

T3 - Proceedings of SPIE

SP - 148

EP - 158

BT - Device and Process Technologies for MEMS and Microelectronics II

PB - International Society for Optics and Photonics SPIE

T2 - International Symposium on Microelectronics and MEMS 2001

Y2 - 17 December 2001 through 19 December 2001

ER -