@inproceedings{ada1ff53c4b84fb89ffe73d38ed6c281,
title = "MEMS sensor packaging using LTCC substrate technology",
author = "Harri Kopola and Jaakko Lenkkeri and Kari Kautio and Altti Torkkeli and Outi Rusanen and Tuomo Jaakola",
year = "2001",
doi = "10.1117/12.448960",
language = "English",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
pages = "148--158",
booktitle = "Device and Process Technologies for MEMS and Microelectronics II",
address = "United States",
note = " International Symposium on Microelectronics and MEMS 2001 ; Conference date: 17-12-2001 Through 19-12-2001",
}