MEMS sensor packaging using LTCC substrate technology

Harri Kopola (Corresponding author), Jaakko Lenkkeri, Kari Kautio, Altti Torkkeli, Outi Rusanen, Tuomo Jaakola

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    11 Citations (Scopus)
    Original languageEnglish
    Title of host publicationDevice and Process Technologies for MEMS and Microelectronics II
    PublisherInternational Society for Optics and Photonics SPIE
    Pages148-158
    DOIs
    Publication statusPublished - 2001
    MoE publication typeB3 Non-refereed article in conference proceedings
    Event International Symposium on Microelectronics and MEMS 2001 - Adelaide, Australia
    Duration: 17 Dec 200119 Dec 2001

    Publication series

    SeriesProceedings of SPIE
    Volume4592
    ISSN0277-786X

    Conference

    Conference International Symposium on Microelectronics and MEMS 2001
    Country/TerritoryAustralia
    CityAdelaide
    Period17/12/0119/12/01

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