Method for manufacturing micromechanical components

Jyrki Kiihamaki (Inventor), Hannu Kattelus (Inventor)

Research output: PatentPatent


The present invention relates to a method for manufacturing an acceleration sensor. In the method, thin SOI-wafer structures are used, in which grooves are etched, the walls of which are oxidized. A thick layer of electrode material, covering all other material, is grown on top of the structures, after which the surface is ground and polished chemo-mechanically, thin release holes are etched in the structure, structural patterns are formed, and finally etching using a hydrofluoric acid solution is performed to release the structures intended to move and to open a capacitive gap.

Patent family as of 27.8.2021  
CN101351400 A 20090121 CN200680019491 20060602      
CN101351400 B 20130424 CN200680019491 20060602      
FI121539 B 20101231 FI20050000592 20050603      
FI20050592 A 20061204 FI20050000592 20050603      
FI20050592 A0 20050603 FI20050000592 20050603      
GB200724114 A0 20080130 GB20070024114 20060602      
GB2441465 A1 20080305 GB20070024114 20060602      
GB2441465 B2 20110309 GB20070024114 20060602      
HK1118528 A1 20090213 HK20080109828 20080904      
HK1118528 A3 20090213 HK20080109828 20080904      
HK1118528 B 20111014 HK20080109828 20080904      
US2009206423 AA 20090820 US20060920687 20060602      
US7882741 BB 20110208 US20060920687 20060602      
US2011070675 AA 20110324 US20100884823 20100917      
US8236694 BB 20120807 US20100884823 20100917      
WO06128958 A2 20061207 WO2006FI00174 20060602      
WO06128958 A3 20070405 WO2006FI00174 20060602

Link to current patent family on right 

Original languageEnglish
Patent numberUS2009206423
IPCH01L 21/ 306 A I
Priority date2/06/06
Publication statusPublished - 20 Aug 2009
MoE publication typeH1 Granted patent


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