Abstract
A method for forming a semiconductor device, the method includes providing a semiconductor substrate, applying a slurry to the semiconductor substrate, wherein the slurry was tested using a testing method includes taking a first undiluted sample from a top of the slurry; determining a first particle size distribution characteristic of the first undiluted sample; taking a second undiluted sample from a bottom of the slurry; determining a second particle size distribution characteristic of the second undiluted sample; and comparing a difference between the first particle size distribution characteristic and the second particle size distribution characteristics with a first predetermined value.
| Original language | English |
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| Patent number | US20080282778A1 |
| IPC | PCT/EP2005/O13519 |
| Priority date | 16/07/08 |
| Filing date | 25/10/05 |
| Publication status | Published - 20 Nov 2008 |
| MoE publication type | Not Eligible |