Abstract
The present invention relates to a method of heat treatment of a solid piece of wood, such as sawn timber. According to the method, the temperature difference between the inside temperature of the heating oven and, correspondingly, the inside temperature of the wood is maintained at a maximum of 10 degrees centigrade, after the level of moisture content of the piece of wood has reached the fibre saturation point of the wood. A small temperature difference such as this is maintained when the temperature is further increased until a level of moisture content is reached at which the strength properties of the piece of wood are at their best. By means of the solution it is possible to considerably reduce the formation of internal cracks in heat treated wood.
Patent family as of 30.8.2021
CA2598499 AA 20070821 CA20062598499 20060222
EP1851019 A1 20071107 EP20060708920 20060222
FI118139 B 20070713 FI20050000208 20050222
FI20050208 A 20061009 FI20050000208 20050222
FI20050208 A0 20050222 FI20050000208 20050222
JP2008531332 T2 20080814 JP20070556622T 20060222
JP4854679 B2 20120118 JP20070556622T 20060222
NO20074427 A 20070830 NO20070004427 20070830
NO20074427 L 20070830 NO20070004427 20070830
US2008256824 AA 20081023 US20060884773 20060222
WO06089998 A1 20060831 WO2006FI00061 2006022
Patent family as of 30.8.2021
CA2598499 AA 20070821 CA20062598499 20060222
EP1851019 A1 20071107 EP20060708920 20060222
FI118139 B 20070713 FI20050000208 20050222
FI20050208 A 20061009 FI20050000208 20050222
FI20050208 A0 20050222 FI20050000208 20050222
JP2008531332 T2 20080814 JP20070556622T 20060222
JP4854679 B2 20120118 JP20070556622T 20060222
NO20074427 A 20070830 NO20070004427 20070830
NO20074427 L 20070830 NO20070004427 20070830
US2008256824 AA 20081023 US20060884773 20060222
WO06089998 A1 20060831 WO2006FI00061 2006022
Link to current patent family on right
Original language | English |
---|---|
Patent number | FI20050208 |
IPC | F26B 25/22 |
Priority date | 22/02/05 |
Publication status | Published - 9 Oct 2006 |
MoE publication type | H1 Granted patent |